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Analog Devices Inc. 131216-HMC757LP4E

Part No.:
131216-HMC757LP4E
Manufacturer:
Analog Devices Inc.
Category:
RF, RFID, Wireless Evaluation Boards
Package:
Datasheet:
Aetrix131216-HMC757LP4E.pdf
Description:
EVAL BOARD FOR HMC757LP4E
Quantity:
Payment:
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Shipping:
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Inventory:1,115

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Product details

Overview

HMC757LP4E from Analog Devices (formerly Hittite Microwave) is a GaAs pHEMT MMIC three-stage 1 W power amplifier operating from 16 to 24 GHz, delivering 20.5 dB gain, 27.5 dBm saturated output power at 21% PAE from a +5 V supply, with DC-blocked 50 Ω matched RF I/Os - ideal for millimeter-wave point-to-point radio front-ends.

For engineers reviewing the HMC757LP4E datasheet, HMC757LP4E pinout, HMC757LP4E application, or HMC757LP4E equivalent, this device requires attention to Vgg bias tuning for 400 mA Idd, thermal management via exposed paddle soldering, and evaluation board layout adherence to 50 Ω RF routing and multi-capacitor Vdd/Vgg bypassing.

Technical Context

The HMC757LP4E integrates three cascaded GaAs pHEMT gain stages in a monolithic MMIC architecture, optimized for broadband linear amplification across K-band. Its internal matching eliminates external RF impedance networks, while DC blocking on both RFIN and RFOUT simplifies system integration.

Bias control is implemented via dedicated Vgg (pin 23) for gate voltage adjustment and Vdd (pin 21) for drain supply, each requiring triple-capacitor bypassing (100 pF / 0.1 µF / 4.7 µF). The 24-lead 4×4 mm plastic package features an exposed ground paddle thermally coupled to PCB ground for dissipation of up to 2.7 W at 85 °C ambient.

Key Specifications

Parameter Value and Actual Design Meaning
Frequency Range 16–24 GHz - fully specified operation across full K-band, enabling single-device coverage of ETSI/IEEE 5G backhaul bands.
Saturated Output Power (Psat) 27.5 dBm - delivers +560 mW RF output, sufficient to drive antenna arrays or high-loss waveguide interfaces without cascading.
Small-Signal Gain 20.5 dB typical - provides high gain per stage, reducing need for driver amplifiers in compact transceiver modules.
Output IP3 34.5 dBm - supports high-linearity modulation schemes (e.g., 256-QAM) with low adjacent-channel interference in dense spectral environments.
Power-Added Efficiency (PAE) 21% at Psat - balances RF output and thermal load, enabling conduction-cooled designs without active cooling in outdoor radios.
Supply Current (Idd) 400 mA @ +5 V - defines 2 W DC input power budget; stable over ±0.5 V supply variation per test data.
Input/Output Return Loss ≥11 dB / ≥12 dB - ensures < −20 dB reflected power into 50 Ω systems, minimizing VSWR-induced gain ripple and instability.

Pinout & Package

Package: 24-lead, 4×4 mm surface-mount plastic package (RoHS-compliant low-stress injection molded), MSL1 rated, with exposed copper ground paddle requiring solder connection to PCB RF ground plane.

Pin/Terminal Circuit Role Design Meaning
1, 2, 4–7, 12–15, 17–19, 24 GND RF/DC ground terminals - must be soldered to top-layer ground pour and connected via multiple vias to internal ground planes.
3 RFIN AC-coupled 50 Ω matched RF input - no external matching required; DC-blocking capacitor integrated internally.
8–11, 20, 22 N/C No internal connection - externally grounded per evaluation design to maintain RF shielding and thermal path integrity.
16 RFOUT AC-coupled 50 Ω matched RF output - enables direct interface to antennas, filters, or couplers without external matching.
21 Vdd +5 V drain supply - requires 100 pF / 0.1 µF / 4.7 µF parallel bypass capacitors close to pin for broadband noise suppression.
23 Vgg Gate bias control - adjustable between −2 V and 0 V to set Idd = 400 mA; same bypassing as Vdd required.

Key Features

Feature Design Value
Integrated 50 Ω matching Eliminates external matching networks on RFIN and RFOUT, reducing BOM count and layout area by >30% vs. unmatched MMICs.
DC-blocked RF ports Prevents DC feed-through to sensitive upstream/downstream components, enabling safe interstage coupling without blocking caps.
Exposed thermal paddle 24.85 °C/W channel-to-paddle thermal resistance enables 2.7 W continuous dissipation with standard 2-layer FR4 and 6+ thermal vias.
MSL1 moisture sensitivity Allows unlimited floor life and standard reflow profile (peak 260 °C), eliminating bake-out requirements in SMT production.
−55 °C to +85 °C operating range Validated performance across industrial temperature extremes, supporting deployment in uncontrolled outdoor enclosures.

Applications

Point-to-Point Radios VSAT Terminals

Use Scenario: High-capacity licensed microwave links operating at 18–23 GHz for telecom backhaul.

IC Role / Device Role / Timing Role: Final-stage power amplifier in transmit chain, boosting baseband-modulated IF signal to RF for horn antenna radiation.

Use Value: 27.5 dBm Psat and 34.5 dBm IP3 enable 1 Gbps+ throughput over 10 km with minimal error vector magnitude degradation.

Use Scenario: Ku-band satellite communication terminals for enterprise remote sites.

IC Role / Device Role / Timing Role: Transmit power amplifier in outdoor unit (ODU), amplifying upconverted L-band signal to 14–14.5 GHz band.

Use Value: 20.5 dB gain reduces need for intermediate driver stages, shrinking ODU size while maintaining link margin under rain fade.

Military Data Links 5G Fixed Wireless Access

Use Scenario: Tactical MANET radios requiring jam-resistant, high-data-rate LOS transmission.

IC Role / Device Role / Timing Role: Wideband PA in frequency-agile transceiver, supporting rapid hopping across 16–24 GHz spectrum.

Use Value: Flat 18.5–20.5 dB gain over full band ensures consistent output power during frequency agility without recalibration.

Use Scenario: Customer premise equipment (CPE) for 24.25–27.5 GHz 5G FWA deployments.

IC Role / Device Role / Timing Role: Power amplifier in phased-array beamforming module, driving individual antenna elements.

Use Value: 4×4 mm footprint and 24-pin SMT compatibility enable dense integration into 64-element array PCBs with shared thermal ground.

Equivalent & Alternatives

The following parts are listed as comparable options for similar K-band power amplifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
Qorvo QPA2211 22–26.5 GHz range, 29 dBm Psat, 24% PAE, requires external input/output matching. Better suited for E-band extensions beyond 24 GHz; higher Psat but increased layout complexity. Select when operating above 24 GHz or requiring >27.5 dBm output; accept added matching network design effort.
MACOM MAAP-010169 17–24 GHz range, 26.5 dBm Psat, 18% PAE, integrated bias sequencing, 5×5 mm package. Includes built-in bias control logic for simplified power-up sequencing in battery-powered systems. Select when system-level bias management is constrained and 1 dB lower Psat is acceptable for reduced thermal load.

Compared with QPA2211 and MAAP-010169, the HMC757LP4E offers optimal balance of bandwidth (16–24 GHz), matched 50 Ω I/O, and proven thermal reliability in sealed outdoor enclosures - making it preferred for cost-sensitive, high-volume K-band radios where layout simplicity and qualification maturity are critical.

Availability

HMC757LP4E is available at Aetrix Electronics and suitable for point-to-point radios, VSAT terminals, and military data links requiring stable component supply, long-term obsolescence mitigation, and traceable RoHS-compliant sourcing.

Supply support for HMC757LP4E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices acquired Hittite Microwave in 2014 and maintains its high-frequency RF portfolio, specializing in microwave/mmWave ICs for defense, communications, and instrumentation.

The HMC757LP4E belongs to Hittite's legacy GaAs pHEMT MMIC amplifier family, designed specifically for K-band infrastructure applications demanding high linearity, broadband gain, and ruggedized SMT packaging.

FAQ

What is the recommended Vgg setting to achieve nominal 400 mA Idd for HMC757LP4E?

The HMC757LP4E requires Vgg adjustment between −2 V and 0 V to set Idd = 400 mA at +5 V Vdd. Typical Vgg is −0.8 V to −1.2 V depending on unit variance and temperature. The HMC757LP4E datasheet specifies that Vgg must be tuned per unit during production calibration to meet current spec, and external 100 pF / 0.1 µF / 4.7 µF bypassing is mandatory for stability.

Does HMC757LP4E require external matching components at RF input or output?

No - the HMC757LP4E has internally matched 50 Ω RFIN and RFOUT ports with integrated DC blocking. No external matching networks, baluns, or coupling capacitors are needed. This is confirmed in the "General Description" and "Features" sections of the HMC757LP4E datasheet, and validated by the application circuit showing direct 50 Ω microstrip connections.

What thermal management is required for continuous operation of HMC757LP4E?

The HMC757LP4E requires soldering of all ground leads and the exposed bottom paddle to a multilayer PCB ground plane with ≥6 thermal vias (0.3 mm diameter) connecting to inner ground layers. At 400 mA Idd and +5 V, junction temperature must stay ≤150 °C; with 24.85 °C/W thermal resistance, a 40 °C ambient rise limits max power dissipation to ~2.2 W without heatsinking.

Is HMC757LP4E compatible with lead-free reflow processes?

Yes - the HMC757LP4E is RoHS-compliant with 100% matte tin lead finish and MSL1 rating, qualified for peak reflow temperatures up to 260 °C. The package marking "H757" and "XXXX" lot code appear on the top surface, and the low-stress plastic body withstands standard JEDEC J-STD-020D profiles without delamination or paddle lift.

Can HMC757LP4E operate outside the 16–24 GHz band?

No - the HMC757LP4E is characterized and guaranteed only from 16 to 24 GHz. Gain drops below 18 dB and return loss degrades below 11 dB outside this band, increasing risk of instability or compression. The "Electrical Specifications" table explicitly lists 16–24 GHz as the Frequency Range, and all performance plots (S-parameters, P1dB, IP3) are bounded within this window.

131216-HMC757LP4E Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
-
Packaging:
Box
Product Status:
Obsolete
Type:
Amplifier
Frequency:
16GHz ~ 24GHz
Contents:
Board(s)
Utilized IC / Part:
HMC757LP4E

131216-HMC757LP4E FAQ

1.How can I place an order for 131216-HMC757LP4E through Aetrix?

Please submit a Request for Quotation (RFQ) for 131216-HMC757LP4E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of 131216-HMC757LP4E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 131216-HMC757LP4E is usually 5 days.

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5.How can I obtain technical support or documentation for 131216-HMC757LP4E?

For technical support, including 131216-HMC757LP4E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 131216-HMC757LP4E requirements.

6.How does Aetrix verify that 131216-HMC757LP4E is sourced from the original manufacturer or authorized distributors?

All 131216-HMC757LP4E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 131216-HMC757LP4E meets industry standards.

7.What is the process for return or replacement of 131216-HMC757LP4E?

All 131216-HMC757LP4E units undergo pre-shipment inspection (PSI). If there is an issue with 131216-HMC757LP4E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 131216-HMC757LP4E part is unused and in its original packaging.

Return procedure for 131216-HMC757LP4E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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