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NXP Semiconductors 13226PRO-DBG
- Part No.:
- 13226PRO-DBG
- Manufacturer:
- NXP Semiconductors
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
13226PRO-DBG.pdf
- Description:
- KIT DEV PRO ZIGBEE 1322X
- Quantity:
- Payment:
- Shipping:
Inventory:1,761
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Product details
Overview
13226PRO-DBG from Freescale Semiconductor is a ZigBee Pro–optimized System-in-Package (SiP) integrating a 26 MHz ARM7TDMI-S MCU, IEEE 802.15.4 transceiver, AES-128 security accelerator, 128 KB serial FLASH, 96 KB SRAM, and 80 KB ROM in a 99-pin LGA package. It delivers -96 dBm DCD receive sensitivity, programmable TX output from -30 to +4 dBm, and supports residential automation, industrial sensor networks, and battery-powered mesh nodes.
For engineers reviewing the 13226PRO-DBG datasheet, 13226PRO-DBG pinout, 13226PRO-DBG application, or 13226PRO-DBG equivalent, key selection criteria include ZigBee Pro stack compatibility, on-chip balun and PA/LNA support, 2.0–3.6 V operation with buck regulator option, and 0.85 µA hibernate current with 8 KB RAM retention.
Technical Context
The 13226PRO-DBG implements a full IEEE 802.15.4 PHY/MAC stack in hardware with dedicated MAC accelerator (MACA) and AES-128 encryption engine, enabling deterministic low-latency packet processing. Its RF interface integrates an on-die balun, TX/RX switch, and programmable crystal load capacitance - eliminating external matching components for single-ended 50 Ω antenna connection.
Power management is handled by the Clock and Reset Module (CRM), supporting Hibernate (0.85 µA) and Doze modes with selectable RAM retention, wake-up via 2 kHz oscillator or optional 32.768 kHz crystal, and integrated buck regulator control for extended battery life in portable deployments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | ARM7TDMI-S, up to 26 MHz - enables real-time ZigBee Pro stack execution with Thumb/ARM instruction mix for code density and performance. |
| RF Transceiver | IEEE 802.15.4-compliant 2.4 GHz O-QPSK - supports 16 channels, 250 kbps data rate, and full CCA/ED/LQI measurement without host CPU intervention. |
| Receive Sensitivity | < -96 dBm (DCD mode, 1% PER, 20-byte packet) - exceeds IEEE 802.15.4 minimum (-85 dBm) by 11 dB, enabling robust link budget in noisy environments. |
| Transmit Power | Programmable -30 dBm to +4 dBm - allows precise RF power tuning per regulatory region and range requirement without external PA biasing. |
| Memory | 128 KB serial FLASH (mirrored to RAM), 96 KB SRAM, 80 KB ROM - ROM contains optimized ZigBee Pro MAC/PHY firmware; 20 KB more application RAM vs. MC13224V. |
| Supply Voltage | 2.0 V to 3.6 V - supports coin-cell (e.g., CR2032) and Li-ion battery operation with integrated linear regulators and optional buck converter. |
| Low-Power Modes | Hibernate: 0.85 µA (8 KB RAM retained); Doze: 3.3 mA (oscillator active) - enables multi-year battery life in periodic-sensing applications like smart meters. |
Pinout & Package
99-pin LGA package (Case 1901-01), 9.5 mm × 9.5 mm × 1.2 mm, RoHS-compliant, non-JEDEC footprint. Pin assignments follow MC1322x standard layout with dedicated RIF (Radio Interface Module), UART0/UART1, SPIF, I2C, SSI, ADC, GPIO, and debug (JTAG/Nexus) terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_RF / VDD_DIG | Power supply inputs | Separate analog/digital rails enable noise isolation; internal LDOs regulate from 2.0–3.6 V input. |
| ANT / RF_IN | Single-ended 50 Ω antenna port | Integrated balun and TX/RX switch allow direct connection to PCB trace or chip antenna - no external matching required. |
| PA_OUT_P / PA_OUT_N | Differential PA outputs | Enable external high-power PA integration while retaining on-die LNA for extended range; controlled via four dedicated RF_EN pins. |
| XTAL_IN / XTAL_OUT | 24 MHz crystal oscillator interface | On-chip programmable load capacitance (6–20 pF) eliminates external caps; supports 13–26 MHz crystals with PLL. |
| JTAG_TCK / TMS / TDI / TDO | In-circuit debug interface | Full boundary-scan and Nexus trace capability for real-time debugging of ZigBee Pro stack and application code. |
Key Features
| Feature | Design Value |
|---|---|
| ZigBee Pro–Optimized ROM | ROM image stripped of ADC/LCDfont/SSI drivers to free ~20 KB RAM for application use - validated for BeeStack Pro Profile 2 only. |
| Hardware AES-128 Engine | Dedicated cryptographic accelerator offloads encryption/decryption from ARM7 core - ensures sub-100 µs AES round time and deterministic secure frame handling. |
| Integrated Balun & Matching | On-package differential-to-single-ended conversion and impedance transformation - reduces BOM count by ≥5 RF components and PCB area by >30%. |
| Programmable Crystal Load Caps | Digitally configurable 6–20 pF capacitance per crystal pin - eliminates external load capacitors and enables rapid crystal vendor qualification. |
| Buck Regulator Control | Dedicated BUCK_EN and BUCK_CTRL pins manage external 100 µH inductor/10 µF capacitor - extends CR2032 battery life from weeks to >2 years in sleep-dominated operation. |
Applications
| Residential Lighting Control | Industrial Asset Tracking |
|---|---|
Use Scenario: Wireless dimmer switches and occupancy sensors forming self-healing ZigBee Pro mesh networks in commercial buildings. IC Role / Device Role / Timing Role: Full-stack node executing ZigBee Pro NWK layer, APS, ZDO, and manufacturer-specific lighting profiles with AES-128 secured over-the-air updates. Use Value: 0.85 µA hibernate current enables >5-year battery life in battery-powered sensors; on-die balun simplifies 2-layer PCB design for cost-sensitive fixtures. | Use Scenario: Battery-powered vibration/temperature tags on factory floor equipment reporting status every 15 minutes to gateway via ZigBee Pro cluster tree. IC Role / Device Role / Timing Role: Low-power end device with scheduled wake-up timer, RF packet assembly, and secure payload encryption before transmission. Use Value: -96 dBm sensitivity ensures reliable 30+ meter indoor range through metal enclosures; buck regulator option extends CR123A battery life beyond 36 months. |
| Smart Meter AMR | Healthcare Patient Monitor |
Use Scenario: Gas/water meter modules transmitting consumption data hourly to neighborhood collector using ZigBee Pro Green Power extension. IC Role / Device Role / Timing Role: Green Power proxy capable of harvesting energy from piezoelectric elements and managing ultra-low-duty-cycle transmissions. Use Value: 2.0–3.6 V operation supports direct connection to energy-harvesting circuits; 8 KB retained RAM preserves session keys across power-loss events. | Use Scenario: Disposable wearable patch monitoring ECG and respiration, transmitting encrypted biometric data to bedside hub via ZigBee Pro healthcare profile. IC Role / Device Role / Timing Role: Secure medical endpoint with AES-128 encryption, battery voltage monitoring via integrated ADC, and regulated 20 mA PA bias for reliable short-range link. Use Value: On-chip 1.2 V reference enables accurate battery health estimation; separate PA/LNA control pins simplify FDA-compliant RF validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ZigBee Pro system-on-chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC13224V | Same silicon die, but ROM includes full peripheral drivers (ADC, LCDfont, SSI); 20 KB less available RAM for application. | Targeted for ZigBee-2007 Profile 1 and proprietary 802.15.4 stacks - not optimized for Pro memory footprint. | Select MC13224V only if application requires on-ROM ADC driver or legacy BeeStack Profile 1 compatibility. |
| CC2530F256 | 8051 core (not ARM7), 256 KB FLASH, no integrated balun or buck controller; requires external matching and DC-DC. | Supports ZigBee Pro but lacks hardware MAC acceleration and integrated RF front-end - higher BOM cost and larger PCB area. | Choose CC2530F256 only when 8051 toolchain familiarity outweighs ARM7 performance and SiP integration benefits. |
Compared with MC13224V, the 13226PRO-DBG trades peripheral driver availability for 20 KB extra RAM and Pro-specific ROM optimization; compared with CC2530F256, it delivers superior RF integration, lower system-level power, and ARM7 scalability - making it optimal for battery-constrained, high-reliability Pro mesh deployments.
Availability
13226PRO-DBG is available at Aetrix Electronics and suitable for residential automation, industrial asset tracking, and smart metering requiring stable component supply and long-term lifecycle support.
Supply support for 13226PRO-DBG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Freescale Semiconductor (now part of NXP Semiconductors) is a fabless semiconductor company specializing in microcontrollers, connectivity SoCs, and analog power solutions for industrial and IoT markets.
The MC1322x product line was designed as a fully integrated ZigBee Pro–ready Platform-in-Package (PiP) targeting ultra-low-power, high-reliability wireless sensor networks where RF integration, memory efficiency, and certified stack compatibility are critical.
FAQ
What is the primary functional distinction between 13226PRO-DBG and MC13224V?
The 13226PRO-DBG features a ROM image specifically optimized for ZigBee Pro Profile 2, removing ADC, LCDfont, and SSI drivers to free approximately 20 KB of RAM for application use. In contrast, MC13224V retains those drivers in ROM and targets ZigBee-2007 Profile 1. Both share identical hardware, pinout, RF performance, and ARM7 core - the difference is purely in firmware content and memory allocation strategy for the 13226PRO-DBG.
Does 13226PRO-DBG support beacon-enabled networks or GTS as defined in IEEE 802.15.4?
No, the 13226PRO-DBG does not support beaconing or Guaranteed Time Slots (GTS). This limitation applies to all MC1322x devices and is explicitly documented in the technical data - the MAC accelerator implements only non-beacon-enabled operation, which aligns with ZigBee Pro requirements and avoids unnecessary power overhead. The 13226PRO-DBG relies on slotted CSMA/CA and transaction-based polling instead.
Can the 13226PRO-DBG operate without an external crystal?
Yes, the 13226PRO-DBG can operate using its internal 2 kHz oscillator for wake-up timing in Hibernate mode, but full RF and MCU operation requires an external crystal (24 MHz nominal, 13–26 MHz supported). The device integrates programmable crystal load capacitance (6–20 pF), so no external capacitors are needed - only the crystal itself is mandatory for functional 802.15.4 compliance and accurate timing in the 13226PRO-DBG.
What RF front-end configurations does 13226PRO-DBG support beyond the integrated balun?
The 13226PRO-DBG supports two RF configurations: (1) standard single-ended 50 Ω operation using the integrated balun and ANT pin, and (2) extended-range mode using complementary PA_OUT_P/PA_OUT_N differential outputs with external PA/LNA, while repurposing the ANT pin as RX-only input. Four dedicated RF_EN control pins and a regulated 20 mA bias supply are provided to manage external RF components in the 13226PRO-DBG.
Is the 13226PRO-DBG pin-compatible with evaluation boards designed for MC13226V?
Yes, the 13226PRO-DBG is mechanically and electrically pin-compatible with MC13226V - both use the identical 99-pin LGA package (Case 1901-01) and share identical pin functions, power domains, and interface timing. Any evaluation board or carrier PCB designed for MC13226V will accept the 13226PRO-DBG without modification, enabling seamless migration to the Pro-optimized ROM variant in the 13226PRO-DBG.
13226PRO-DBG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Packaging:
- Box
- Product Status:
- Active
- Type:
- Transceiver; 802.15.4 (Zigbee®)
- Frequency:
- 2.4GHz
- Contents:
- Board(s)
- Utilized IC / Part:
- MC1322x
13226PRO-DBG FAQ
1.How can I place an order for 13226PRO-DBG through Aetrix?
Please submit a Request for Quotation (RFQ) for 13226PRO-DBG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 13226PRO-DBG reliable?
The price and inventory of 13226PRO-DBG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 13226PRO-DBG is usually 5 days.
3.What payment methods are accepted for 13226PRO-DBG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 13226PRO-DBG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 13226PRO-DBG?
13226PRO-DBG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 13226PRO-DBG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 13226PRO-DBG?
For technical support, including 13226PRO-DBG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 13226PRO-DBG requirements.
6.How does Aetrix verify that 13226PRO-DBG is sourced from the original manufacturer or authorized distributors?
All 13226PRO-DBG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 13226PRO-DBG meets industry standards.
7.What is the process for return or replacement of 13226PRO-DBG?
All 13226PRO-DBG units undergo pre-shipment inspection (PSI). If there is an issue with 13226PRO-DBG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 13226PRO-DBG part is unused and in its original packaging.
Return procedure for 13226PRO-DBG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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