Texas Instruments 14-24-LOGIC-EVM

Overview

14-24-LOGIC-EVM from Texas Instruments is a breakable evaluation module designed to support leaded logic ICs in TSSOP (PW), SSOP (DB), SOP (NS), TVSOP (DGV), SOIC (D/DW), SOT-23-THN (DYY), and VSSOP (DGS) packages with 14–24 pins. It provides header-based I/O access, on-board bypass capacitor footprints, and v-scored sections for selective use. Engineers use it to validate logic device functionality, interface timing, and supply stability during early-stage design.

For engineers reviewing the 14-24-LOGIC-EVM datasheet, 14-24-LOGIC-EVM pinout, 14-24-LOGIC-EVM application, or 14-24-LOGIC-EVM equivalent, this page delivers verified hardware layout details, supported package families, breakout section configuration guidance, and TI's official EVM usage constraints for leaded logic evaluation.

Technical Context

The 14-24-LOGIC-EVM PCB is segmented into six v-scored sections-each dedicated to one or more TI leaded logic package types. Each section includes plated-through-hole footprints aligned to standard pinouts, 12-pin 2.54 mm headers for signal and power routing, and designated pads for 0.1 µF X7R ceramic bypass capacitors at VCC.

It supports device evaluation without soldering modifications for 14-, 16-, 20-, and 24-pin variants across seven package families. Dashed alignment guides assist placement of sub-24-pin devices, and shunt-based VCC/GND tie-down enables rapid logic state control for unused inputs per TI's CMOS floating-input guidelines.

Key Specifications

Availability

14-24-LOGIC-EVM is available at Aetrix Electronics and suitable for logic IC validation, schematic prototyping, and CMOS interface testing requiring stable component supply, traceable sourcing, and long-term BOM continuity.

Supply support for 14-24-LOGIC-EVM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and logic technologies, with decades of leadership in high-reliability industrial and automotive IC design.

The 14-24-LOGIC-EVM belongs to TI's Logic Evaluation Module family-designed explicitly to accelerate functional validation of leaded logic ICs across multiple packaging formats without custom PCB fabrication.

FAQ

What is the primary purpose of the 14-24-LOGIC-EVM?

The 14-24-LOGIC-EVM is a Texas Instruments evaluation module intended solely for R&D use by qualified electronics engineers to evaluate leaded logic ICs-including SN74, CD74, and other TI logic families-in TSSOP, SSOP, SOP, TVSOP, SOIC, SOT-23-THN, and VSSOP packages. It is not a finished product and must not be integrated into end equipment or production systems. The 14-24-LOGIC-EVM enables rapid signal integrity checks, power sequencing verification, and functional truth-table validation before committing to custom PCB layouts.

Which logic device packages does the 14-24-LOGIC-EVM support?

The 14-24-LOGIC-EVM supports seven TI leaded logic package types: TSSOP (PW), SSOP (DB), SOP (NS), TVSOP (DGV), SOIC (D and DW), SOT-23-THN (DYY), and VSSOP (DGS). Each v-scored section accommodates 14-, 16-, 20-, or 24-pin variants, with dashed alignment guides ensuring correct orientation for smaller-count devices. The 14-24-LOGIC-EVM does not support QFN, BGA, or leadless packages.

Can the 14-24-LOGIC-EVM be used for production-level testing?

No-the 14-24-LOGIC-EVM is explicitly restricted to research, feasibility analysis, and development-stage evaluation under TI's EVM Terms. It carries no production-grade reliability certification, lacks conformal coating or environmental hardening, and is not warranted for continuous operation. TI prohibits its use in finished products, safety-critical systems, or any commercial deployment. The 14-24-LOGIC-EVM is intended only for lab-based logic device characterization prior to final schematic and layout sign-off.

How is power supplied and managed on the 14-24-LOGIC-EVM?

Power is delivered externally via header pins or test points; the 14-24-LOGIC-EVM has no onboard regulation. Each section provides dedicated VCC and GND header pads, and users must connect external supplies using shunts or jumper wires. A 0805 footprint for a 0.1 µF X7R ceramic bypass capacitor is placed adjacent to each VCC pad to suppress high-frequency noise-consistent with TI's recommendations for stable logic operation. The 14-24-LOGIC-EVM does not include voltage translation or level-shifting circuitry.

Are there any regulatory compliance limitations for the 14-24-LOGIC-EVM?

Yes-the 14-24-LOGIC-EVM is classified as a Class A digital device under FCC Part 15 and is intended for commercial environments only. It is not certified for residential use and may cause radio interference if operated outside shielded labs or test facilities. In Japan, users must comply with Radio Law requirements-including use in approved test facilities or obtaining experimental licenses-since the 14-24-LOGIC-EVM lacks Technical Regulations Conformity Certification. TI explicitly disclaims liability for noncompliant deployment.