Renesas 151TS311TE-E
- Part No.:
- 151TS311TE-E
- Manufacturer:
- Renesas
- Package:
- -
- Datasheet:
-
151TS311TE-E.pdf
- Description:
- E:CLOCK GENERATOR,14.318 MHZ
- Quantity:
- Payment:

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Inventory:2,000
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Product details
Overview
151TS311TE-E from Renesas Electronics is a spread spectrum clock generator IC designed for DDR SDRAM memory systems, delivering seven differential 2.5 V clock outputs (DDRT/DDRC[6:0]) at 133 MHz or 167 MHz, with integrated SSC modulation (–0.5%, –1.0%, or OFF), 14.318 MHz reference output, and CPUCLK at 2.5 V - used in laser beam printers and other EMI-sensitive embedded systems.
For engineers reviewing the 151TS311TE-E datasheet, 151TS311TE-E pinout, 151TS311TE-E application, or 151TS311TE-E equivalent, key selection criteria include DDR clock skew control (±480 ps), SSC modulation depth selection, differential output drive strength (16.2 mA), and TSSOP-48 package compatibility with high-density PCB layouts.
Technical Context
The 151TS311TE-E integrates a crystal oscillator input (X1/X2), PLL-based frequency synthesis, and an SSC modulator to reduce EMI by spreading spectral energy across ±0.5% or ±1.0% of nominal frequency. It supports two selectable DDR clock frequencies via FS0 and provides independent skew and slew rate control for CPUCLK and all seven DDR clock pairs.
It features three dedicated skew control groups: TCPURAM[2:0] for CPUCLK-to-DDRT0/DDRC0 alignment, TRAMRAM[2:0] for inter-DDR-group skew, and separate SRCPU[1:0] and SRRAM[1:0] inputs for fine-tuning edge rates on CPUCLK and DDR outputs respectively - all implemented with internal 120 kΩ pulldown resistors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Frequency | 133 MHz or 167 MHz DDR clock; 14.318 MHz REF; precise average frequency maintained under SSC modulation |
| SSC Modulation Depth | Configurable –0.5% or –1.0% deviation; reduces peak EMI amplitude without affecting system timing margins |
| Cycle-to-Cycle Jitter | ±180 ps (DDRT/C); ensures stable DDR timing margin under worst-case SSC conditions |
| Differential Output Drive | 16.2 mA into 50 Ω load; meets DDR SDRAM AC timing requirements for signal integrity |
| Supply Voltages | AVDD/VDDREF/LVDD = 3.3 V ±10%; VDDC/VDDS = 2.5 V ±5%; enables clean separation of analog and digital power domains |
| CPUCLK-to-DDRT0 Skew | 120–480 ps adjustable; allows precise phase alignment between processor and memory clocks |
| Operating Temperature | 0°C to +70°C; validated for commercial-grade LBP and office equipment environments |
Pinout & Package
TSSOP-48 (PTSP0048KA-A / TTP-48DBV) package with 0.5 mm pitch, 6.1 mm × 12.5 mm body, Ni/Pd/Au plating, and 0.2 g typical mass - optimized for automated SMT assembly and thermal dissipation in compact printer logic boards.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDREF, AVDD, LVDD | Analog/Reference Power | 3.3 V supply for oscillator, REF output, and analog PLL circuitry; decoupling critical for jitter performance |
| VDDC, VDDS | Digital Core/SDRAM Power | 2.5 V supplies for CPUCLK and DDR clock drivers; isolated to prevent noise coupling into memory interface |
| DDRT[6:0], DDRC[6:0] | Differential DDR Clock Outputs | Seven complementary clock pairs driving DDR SDRAM DQS/DQ lines; require matched trace routing |
| CPUCLK | Single-ended Processor Clock | 2.5 V CMOS output synchronized to DDR clocks; used for CPU core timing in LBP main controllers |
| SSON#, SS%, FS0, DDREN | Configuration Inputs | Logic-level control pins with internal 120 kΩ pulldowns; enable/disable SSC, select frequency, and gate DDR outputs |
| TCPURAM[2:0], TRAMRAM[2:0] | Skew Control Inputs | Three-bit binary controls for fine-grained phase adjustment between CPUCLK and DDR clocks or among DDR groups |
| SRCPU[1:0], SRRAM[1:0] | Slew Rate Control Inputs | Two-bit settings to adjust edge speed on CPUCLK and DDR outputs - mitigates crosstalk and overshoot |
| AGND, LGND, GNDREF, GNDS, GNDC | Ground Terminals | Multiple dedicated ground pins per power domain; essential for low-noise clock distribution and EMI suppression |
Key Features
| Feature | Design Value |
|---|---|
| Spread Spectrum Clocking | Reduces electromagnetic interference peaks by up to 10 dB through controlled frequency dithering at ≤30 kHz modulation rate |
| Programmable DDR Clock Skew | Adjustable CPUCLK-to-DDRT0 skew (120–480 ps) and group skew (±180 ps) enables precise timing closure in high-speed memory interfaces |
| Differential DDR Clock Outputs | Seven fully buffered differential pairs (DDRT/DDRC[6:0]) meet JEDEC DDR timing specs with 0.5×VDDS ±0.2 V common-mode voltage |
| Independent Slew Rate Control | Separate 2-bit programmable edge rate control for CPUCLK and DDR outputs minimizes signal integrity issues in dense PCB layouts |
| Integrated Reference Clock | 14.318 MHz REF output with ±500 ps cycle-to-cycle jitter supports external timing validation and system synchronization |
Applications
| Laser Beam Printer (LBP) Main Controller | DDR-Based Industrial HMI Panel |
|---|---|
Use Scenario: High-resolution page rendering and raster image processing requiring tight synchronization between CPU and DDR SDRAM. IC Role / Device Role / Timing Role: Generates synchronized 167 MHz DDR clocks and CPUCLK with sub-500 ps skew control to meet DDR-333 timing budgets. Use Value: Enables deterministic memory access latency and eliminates EMI-induced data corruption in compact, fanless printer enclosures. | Use Scenario: Real-time graphics display and touch response in factory-floor HMIs with DDR2 memory subsystems. IC Role / Device Role / Timing Role: Provides seven differential DDR clocks plus REF and CPUCLK, all derived from single 14.318 MHz crystal for BOM simplification. Use Value: Reduces radiated emissions below CISPR 22 Class B limits without adding ferrites or shielding, lowering system cost and weight. |
| Embedded Network Print Server | Medical Imaging Data Acquisition Module |
Use Scenario: Multi-function print server handling concurrent Ethernet, USB, and parallel port traffic with DDR-buffered packet processing. IC Role / Device Role / Timing Role: Delivers low-jitter DDR clocks and configurable SSC to suppress broadband noise coupling into Ethernet PHY signals. Use Value: Passes FCC Part 15B conducted and radiated emissions tests without layout redesign or additional filtering components. | Use Scenario: High-fidelity medical image capture using DDR SDRAM for frame buffering in portable ultrasound devices. IC Role / Device Role / Timing Role: Supplies stable 133 MHz DDR clocks with <±180 ps cycle-to-cycle jitter and programmable skew for sensor-to-memory pipeline alignment. Use Value: Maintains pixel-perfect image fidelity during real-time acquisition by eliminating timing-induced artifacts in DDR burst transfers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar clock generator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT72V2231L | Fixed 133 MHz output only; no SSC modulation; 3.3 V-only supply; QFP-44 package | Lacks EMI reduction capability; unsuitable for Class B emission-limited products | Select when SSC is unnecessary and board space permits larger QFP footprint |
| ICS9FGP102 | Supports DDR3/DDR4; higher max frequency (266 MHz); 1.8 V I/O; different pinout and register map | Targets newer memory standards; requires full schematic and firmware revalidation | Choose for DDR3 migration paths where future-proofing outweighs redesign effort |
Compared with IDT72V2231L and ICS9FGP102, the 151TS311TE-E uniquely balances DDR2-specific timing precision, integrated EMI suppression, and TSSOP-48 compactness - making it optimal for cost-sensitive, space-constrained LBP and industrial controller designs where SSC is mandatory.
Availability
151TS311TE-E is available at Aetrix Electronics and suitable for laser beam printers, industrial HMIs, and networked embedded controllers requiring stable component supply, EMI-compliant clock generation, and DDR2 memory interface timing accuracy.
Supply support for 151TS311TE-E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and timing solutions for automotive, industrial, and consumer applications.
The 151TS311TE-E belongs to Renesas' legacy spread spectrum clock generator product line, engineered specifically for EMI mitigation in DDR-based office equipment and industrial control systems operating under strict regulatory emission limits.
FAQ
What is the primary function of the 151TS311TE-E in DDR memory systems?
The 151TS311TE-E serves as a dedicated spread spectrum clock generator that produces seven differential DDR clock pairs (DDRT/DDRC[6:0]), one CPU clock (CPUCLK), and a 14.318 MHz reference output - all synchronized to reduce EMI while maintaining precise timing alignment required by DDR SDRAM interfaces. Its design directly targets EMI compliance in laser beam printers and similar embedded systems.
Does the 151TS311TE-E support both 133 MHz and 167 MHz DDR clock frequencies?
Yes, the 151TS311TE-E supports both 133 MHz and 167 MHz DDR clock outputs, selected via the FS0 input pin. The device maintains specified jitter (±180 ps cycle-to-cycle) and skew (120–480 ps) across both frequencies under all SSC modulation modes (OFF, –0.5%, –1.0%), as confirmed in the AC electrical characteristics tables of its official datasheet.
How does the 151TS311TE-E implement spread spectrum clocking, and what are the available modulation depths?
The 151TS311TE-E implements spread spectrum clocking using an internal modulator that dithers output frequencies at ≤30 kHz. Modulation depth is selected via SSON# and SS% pins: –0.5% (SSON# = L, SS% = L), –1.0% (SSON# = L, SS% = H), or OFF (SSON# = H). These settings are explicitly defined in Table 2 of the HD151TS311 datasheet Rev. 2.00.
What package type and pin count does the 151TS311TE-E use?
The 151TS311TE-E uses a TSSOP-48 package (JEITA code TTP-48DBV, Renesas code PTSP0048KA-A), with 0.5 mm pitch, 6.1 mm × 12.5 mm body dimensions, and Ni/Pd/Au terminal plating. This information is confirmed in the "Ordering Information" section and mechanical drawing on page 14 of the HD151TS311 datasheet Rev. 2.00.
Can the 151TS311TE-E's output skew and slew rate be configured, and how?
Yes, the 151TS311TE-E provides configurable skew and slew rate: TCPURAM[2:0] and TRAMRAM[2:0] pins adjust CPUCLK-to-DDRT0 and inter-DDR-group skew in discrete steps; SRCPU[1:0] and SRRAM[1:0] pins set CPUCLK and DDR output edge rates. All control inputs feature internal 120 kΩ pulldowns, enabling default operation without external biasing - as detailed in Tables 4–7 and the Terminal Description section.
151TS311TE-E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Type:
- -
- PLL:
- -
- Input:
- -
- Output:
- -
- Number of Circuits:
- -
- Ratio - Input:Output:
- -
- Differential - Input:Output:
- -
- Frequency - Max:
- -
- Divider/Multiplier:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Mounting Type:
- -
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- -
151TS311TE-E FAQ
1.How can I place an order for 151TS311TE-E through Aetrix?
Please submit a Request for Quotation (RFQ) for 151TS311TE-E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 151TS311TE-E reliable?
The price and inventory of 151TS311TE-E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 151TS311TE-E is usually 5 days.
3.What payment methods are accepted for 151TS311TE-E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 151TS311TE-E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 151TS311TE-E?
151TS311TE-E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 151TS311TE-E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 151TS311TE-E?
For technical support, including 151TS311TE-E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 151TS311TE-E requirements.
6.How does Aetrix verify that 151TS311TE-E is sourced from the original manufacturer or authorized distributors?
All 151TS311TE-E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 151TS311TE-E meets industry standards.
7.What is the process for return or replacement of 151TS311TE-E?
All 151TS311TE-E units undergo pre-shipment inspection (PSI). If there is an issue with 151TS311TE-E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 151TS311TE-E part is unused and in its original packaging.
Return procedure for 151TS311TE-E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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