Renesas 17050R-23-27

Overview

17050R-23-27 from Echelon Corporation is a Power Line Development Support Kit (PL DSK 2.3) designed to accelerate hardware design for LonWorks® power line communication systems using PL 3120®, PL 3150®, and PL 3170® Smart Transceivers. It delivers eight verified reference designs-including a new compact SIP-based layout for PL 3120/PL 3170-and provides P-CAD®, OrCAD®, Altium®, and Gerber-format layout files, BOMs, and schematics for rapid implementation in industrial control and building automation.

For engineers reviewing the 17050R-23-27 datasheet, 17050R-23-27 application, 17050R-23-27 equivalent, or 17050R-23-27 pinout, this kit supports fast prototyping of two-layer and four-layer PCBs with validated thermal management, trace capacitance control, receive sensitivity, transmit power, and noise resilience-critical for reliable PLC deployment in real-world EMI environments.

Technical Context

The 17050R-23-27 PL DSK 2.3 targets design validation of Echelon's PL 3120/3150/3170 transceivers in AC/DC power line networks. It includes layout files optimized for crystal frequency stability, controlled impedance traces, and heat-dissipating copper pours aligned with transceiver thermal limits.

Reference designs cover multiple form factors: 2-layer single-sided (23 mm × 63 mm), 4-layer double-sided (17 mm × 38 mm SIP variant), and 4-layer variants supporting up to 2 A_p-p transmit amplifiers-enabling scalable development from proof-of-concept to production-grade PLC nodes.

Key Specifications

Availability

17050R-23-27 is available at Aetrix Electronics and suitable for building automation, industrial control, smart metering, and energy management systems requiring stable component supply and proven PLC design infrastructure.

Supply support for 17050R-23-27 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Echelon Corporation is a U.S.-based developer of open-standard control networking platforms, specializing in LonWorks® technology for interoperable building and industrial automation systems.

The PL DSK 2.3 kit belongs to Echelon's Power Line Smart Transceiver ecosystem and was created to reduce time-to-market for certified, noise-immune PLC node designs compliant with ANSI/EIA-709.1 and ISO/IEC 14908 standards.

FAQ

What is the 17050R-23-27 and how does it differ from evaluation hardware?

The 17050R-23-27 is a downloadable design support kit-not physical hardware. It contains reference schematics, layout files, BOMs, and technical documentation for implementing PL 3120/3150/3170 transceivers. Unlike the Model 10000R-40-27 Mini FX/PL Evaluation Kit, the 17050R-23-27 provides no boards or components; it enables custom PCB development directly from verified design assets. The 17050R-23-27 is intended for integration into proprietary hardware platforms.

Which transceiver families are supported by the 17050R-23-27 PL DSK 2.3?

The 17050R-23-27 PL DSK 2.3 explicitly supports the PL 3120®, PL 3150®, and PL 3170® Smart Transceivers. Each included reference design maps to one or more of these devices, with specific layout rules, crystal load capacitance values, and amplifier configurations validated per device datasheet requirements. The 17050R-23-27 does not support earlier PL 2000-series or non-Echelon transceivers.

Does the 17050R-23-27 include Gerber files and manufacturing data?

Yes-the 17050R-23-27 includes full Gerber RS-274X files alongside PDF, ASCII, PDIF, and native ECAD formats (OrCAD®, Altium®, PADS®, P-CAD®). These files are production-ready and reflect the verified layouts described in the PL 3120/3150/3170 Data Book. No additional conversion or layer mapping is required to generate fabrication and assembly outputs for the 17050R-23-27 reference designs.

How does the 17050R-23-27 address thermal and EMI challenges in power line designs?

The 17050R-23-27 addresses thermal challenges via optimized copper pour geometry and strategic component placement that maintains PL 3120/3150/3170 junction temperatures below 105°C during sustained transmit cycles. For EMI, it enforces controlled trace capacitances matched to crystal oscillation frequencies and incorporates ground-shielded routing practices validated for >60 dB noise rejection in 50/60 Hz environments. These features are implemented across all eight 17050R-23-27 reference designs.

Is the 17050R-23-27 compatible with modern ECAD tools like Altium Designer and KiCad?

The 17050R-23-27 includes native Altium Designer project files and Gerber/ASCII/PDIF exports compatible with KiCad, Cadence Allegro, and other mainstream tools. While KiCad lacks direct import for OrCAD or P-CAD formats, its Gerber and netlist support ensures full usability. All 17050R-23-27 layout files have been tested for round-trip fidelity in Altium Designer v20+ and confirmed to retain layer stackup, component placement, and signal integrity constraints without manual correction.