Microchip Technology 1N3024BUR-1/TR

Overview

1N3024BUR-1 from Microsemi is a hermetically sealed, metallurgically bonded surface-mount Zener diode in DO-213AB (MELF/LL41) package, rated for 1 W DC power dissipation, with nominal Zener voltage of 15 V at 17 mA test current, dynamic impedance of 14 Ω at IZT, and maximum reverse leakage current of 0.25 mA at 11.4 V. It is qualified to MIL-PRF-19500/115 at JAN/JANTX/JANTXV levels and used for precision voltage regulation in high-reliability aerospace and defense power supplies.

For engineers reviewing the 1N3024BUR-1 datasheet, 1N3024BUR-1 pinout, 1N3024BUR-1 application, or 1N3024BUR-1 equivalent, key selection criteria include its 15 V Zener voltage tolerance (±5%), low thermal resistance (50 °C/W), hermetic glass MELF construction, radiation-hardened design per MicroNote 050, and compatibility with automated SMT assembly using 12 mm tape-and-reel.

Technical Context

This device operates as a two-terminal voltage reference diode, conducting in reverse breakdown with sharp knee characteristics verified by dual-point Zener impedance measurement per MicroNote 202. Its metallurgically enhanced internal contact design reduces thermal resistance and improves long-term stability under thermal cycling.

The 1N3024BUR-1 exhibits a temperature coefficient of +0.088 %/°C and maintains regulation across -55 °C to +175 °C junction temperature range, with linear power derating from 1.0 W at 125 °C to zero at 175 °C per Figure 1. It is non-ESD-sensitive and RoHS-compliant in commercial grade variants.

Key Specifications

Pinout & Package

DO-213AB (MELF) glass hermetic package with axial symmetry; cathode identified by single black band; terminals are metallurgically bonded copper-clad steel with tin/lead or matte-tin finish; weight ≈ 0.05 g; dimensions: BD = 2.39–2.67 mm, BL = 4.80–5.21 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Zener regulation applications.

Compared with 1N3024B-1 and MMBZ5245B, the 1N3024BUR-1 uniquely combines surface-mount MELF packaging, 1 W power handling, MIL-qualified reliability, and radiation hardness - making it irreplaceable in space-grade and defense-critical voltage regulation where long-term parametric stability is mandatory.

Availability

1N3024BUR-1 is available at Aetrix Electronics and suitable for aerospace power regulation, defense system reference, and industrial sensor excitation requiring stable component supply across extended temperature and radiation environments.

Supply support for 1N3024BUR-1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microsemi Corporation (now part of Microchip Technology) is a U.S.-based semiconductor company specializing in high-reliability analog and mixed-signal components for aerospace, defense, and industrial markets.

The 1N3024BUR-1 belongs to Microsemi's MIL-qualified Zener diode family designed for precision voltage regulation in mission-critical systems where hermeticity, radiation tolerance, and long-term stability outweigh cost constraints.

FAQ

What is the Zener voltage tolerance for the 1N3024BUR-1?

The 1N3024BUR-1 has a nominal Zener voltage of 15 V with a standard tolerance of ±5%, indicated by the "B" suffix in its nomenclature. This tolerance is guaranteed across the full operating temperature range (-55 °C to +175 °C) and applies to all qualification levels (JAN, JANTX, JANTXV, and commercial). The 1N3024BUR-1 does not offer tighter 2% or 1% tolerances - those require different part numbers such as 1N3024CUR-1 or 1N3024DUR-1.

Is the 1N3024BUR-1 compatible with lead-free reflow soldering?

Yes, the 1N3024BUR-1 supports lead-free reflow soldering with a peak temperature of 260 °C for 10 seconds, as specified in the mechanical data sheet. Its glass hermetic seal and metallurgically bonded construction prevent cracking or delamination during thermal cycling. Commercial-grade versions are RoHS compliant (e3 suffix); military-grade units use tin/lead finish but remain compatible with lead-free processes due to their robust thermal design.

Does the 1N3024BUR-1 require heatsinking in 1 W operation?

The 1N3024BUR-1 can dissipate 1 W continuously without external heatsinking when mounted on a minimum 100 mm² copper pad per the recommended pad layout (A = 7.00 mm, B = 1.8 mm, C = 2.8 mm). Its R_θJEC of 50 °C/W means junction temperature rise is 50 °C above end-cap temperature at full load. For ambient temperatures above 75 °C, thermal derating per Figure 1 must be applied - power must be reduced linearly from 1.0 W at 125 °C T_EC to zero at 175 °C.

How does the radiation hardness of the 1N3024BUR-1 compare to commercial Zeners?

The 1N3024BUR-1 is inherently radiation-hardened per Microsemi MicroNote 050, with demonstrated tolerance to ≥100 krad(Si) total ionizing dose - a level far exceeding standard commercial Zeners, which typically degrade above 10 krad. This hardness stems from its hermetic glass construction and defect-free metallurgical bonding, not process additives. Radiation testing data is available upon request for 1N3024BUR-1 lots supplied under JAN/JANTXV qualification.

Can the 1N3024BUR-1 be used in series or parallel configurations?

The 1N3024BUR-1 is not recommended for parallel operation due to mismatched Zener impedances causing current imbalance and thermal runaway. Series connection is permissible for higher-voltage references (e.g., two 1N3024BUR-1 devices yield ~30 V), but requires individual current-limiting resistors to ensure equal biasing. Derating to 0.5 W per device is advised in series configurations to maintain junction temperature within limits under worst-case mismatch.