Texas Instruments 1P1G126QYEPR

Overview

1P1G126QYEPR from Texas Instruments is a single noninverting bus buffer gate with 3-state output, designed for 1.65-V to 5.5-V V_CC operation. It features ±24-mA output drive at 3.3 V, 3.7-ns max propagation delay at 3.3 V, and I_off support for partial-power-down mode - enabling use in voltage-level-translating data buses in portable instrumentation and low-voltage microcontroller I/O expansion.

For engineers reviewing the 1P1G126QYEPR datasheet, 1P1G126QYEPR pinout, 1P1G126QYEPR application, or 1P1G126QYEPR equivalent, key selection criteria include 3-state bus isolation capability, 5-pin WCSP package footprint, I_off-enabled power sequencing compatibility, and 5.5-V tolerant inputs for mixed-supply interface bridging.

Technical Context

This device implements a single-channel noninverting buffer with active-high output-enable control (OE), where output Y follows input A when OE is high and enters high-impedance state when OE is low. Its logic diagram confirms direct signal path without inversion and explicit OE gating of the output stage.

Designed for LVC logic family compatibility, it supports 1.65–5.5 V V_CC, accepts input voltages up to 5.5 V regardless of supply level, and delivers rail-to-rail output swing. The I_off circuit disables outputs during power-down to prevent back-current flow, satisfying JESD 78 Class II latch-up and JESD 22 ESD requirements.

Key Specifications

Pinout & Package

1P1G126QYEPR uses the NanoFree™ WCSP (YEP) 5-ball die-size package - 0.23-mm large bump, bottom-side ball layout, no leadframe, with solder-bump composition indicated by pin-1 marking (• = Pb-free). Total package size is 1.0 mm × 1.0 mm × 0.55 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus buffer applications.

Compared with SN74LVC1G126DBVR and SN74LVC1G126DCKR, 1P1G126QYEPR delivers the smallest board footprint and lowest thermal resistance (132°C/W), but requires wafer-level reflow and X-ray inspection - making it optimal for high-volume, space-limited consumer electronics rather than low-volume industrial control.

Availability

1P1G126QYEPR is available at Aetrix Electronics and suitable for microcontroller I/O expansion, low-power sensor interface, and portable display data bus applications requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.

Supply support for 1P1G126QYEPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.

The SN74LVC1G126 product line targets low-voltage, low-power logic interface functions - specifically addressing voltage translation, bus isolation, and I/O expansion needs in space- and energy-constrained embedded systems.

FAQ

What is the function of the OE pin on the 1P1G126QYEPR?

The OE (output-enable) pin on the 1P1G126QYEPR is an active-high control input that determines whether the output Y is driven or placed in high-impedance state. When OE is high, Y follows input A; when OE is low, Y disconnects from the bus. For reliable power-up behavior, TI recommends tying OE to GND through a pulldown resistor - a design requirement explicitly documented in the 1P1G126QYEPR datasheet's application guidance section.

Does the 1P1G126QYEPR support mixed-voltage operation?

Yes, the 1P1G126QYEPR supports true mixed-voltage operation: its inputs accept voltages up to 5.5 V regardless of V_CC level (which can be as low as 1.65 V), and its outputs swing rail-to-rail between GND and V_CC. This allows the 1P1G126QYEPR to serve as a level translator - for example, connecting a 5-V sensor output to a 1.8-V microcontroller input - without external components, as confirmed by the absolute maximum ratings and recommended operating conditions tables in the official 1P1G126QYEPR datasheet.

What is the thermal resistance (θ_JA) of the 1P1G126QYEPR package?

According to the official Texas Instruments datasheet, the 1P1G126QYEPR - packaged in the NanoFree™ WCSP (YEP) variant - has a junction-to-ambient thermal resistance (θ_JA) of 132°C/W. This value is measured under JEDEC JESD 51-7 standard conditions and is significantly lower than alternative packages like SOT-23 (206°C/W) or SC-70 (252°C/W), reflecting the superior thermal performance of the die-as-package construction used in the 1P1G126QYEPR.

Can the 1P1G126QYEPR be used in partial-power-down systems?

Yes, the 1P1G126QYEPR includes I_off circuitry explicitly designed for partial-power-down applications. When V_CC = 0 V, the I_off feature limits current flow through powered inputs or outputs to less than ±10 µA, preventing damaging back-current into unpowered sections of the system. This behavior is verified per JESD 78 Class II latch-up standards and is a guaranteed specification for the 1P1G126QYEPR, not just a typical characteristic.

What is the maximum propagation delay (t_pd) of the 1P1G126QYEPR at 3.3 V?

The maximum propagation delay (t_pd) of the 1P1G126QYEPR is 3.7 ns at V_CC = 3.3 V, CL = 15 pF, and TA = 25°C - a value specified in the "Switching Characteristics" table of the official datasheet. This parameter applies to the A → Y path and defines the worst-case timing budget for synchronous data transfer, making the 1P1G126QYEPR suitable for 25-MHz SPI or parallel bus applications where deterministic latency is critical.