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Texas Instruments 1P2G125QYEPR
- Part No.:
- 1P2G125QYEPR
- Manufacturer:
- Texas Instruments
- Package:
- 8-XFBGA, DSBGA
- Datasheet:
-
1P2G125QYEPR.pdf
- Description:
- IC BUF NON-INVERT 5.5V 8DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,793
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Product details
Overview
1P2G125QYEPR from Texas Instruments is a dual 3-state bus buffer gate designed for 1.65-V to 5.5-V VCC operation, featuring two independent noninverting buffers with active-low output-enable control, 4.3 ns max propagation delay at 3.3 V, ±24-mA output drive, and Ioff partial-power-down support - used in voltage-level translation and bidirectional bus isolation in portable logic interfaces.
For engineers reviewing the 1P2G125QYEPR datasheet, 1P2G125QYEPR pinout, 1P2G125QYEPR application, or 1P2G125QYEPR equivalent, this page delivers verified electrical parameters, NanoFree™ DSBGA package mapping, functional truth table behavior, thermal resistance (102°C/W), and real-world substitution guidance for industrial and space-constrained embedded designs.
Technical Context
The 1P2G125QYEPR implements two identical noninverting buffer stages, each with an independent active-low output-enable (OE) input controlling high-impedance state on its respective Y output. Its Ioff circuitry ensures no backflow current when powered down, enabling safe hot-insertion in mixed-voltage systems.
It supports input voltages up to 5.5 V regardless of VCC level (1.65–5.5 V), allowing interfacing between 1.8-V, 2.5-V, 3.3-V, and 5-V logic domains. Output VOH/VOL performance is specified across all VCC values, with typical VOLP < 0.8 V and VOHV > 2 V at 3.3 V, ensuring signal integrity in fast-switching environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 5.5 V - enables interoperability across 1.8-V, 2.5-V, 3.3-V, and 5-V logic families without level shifters |
| tpd (Max) | 4.3 ns at VCC = 3.3 V - supports >100-MHz data rates in buffered address/data paths |
| Ioff Current | ±10 µA max - prevents damaging current flow during partial power-down in multi-rail systems |
| Output Drive | ±24 mA at VCC = 3.3 V - drives 15-pF loads with clean edges in dense PCB layouts |
| Input Voltage Range | –0.5 V to 5.5 V - accepts 5-V-tolerant inputs even when VCC = 1.65 V, simplifying mixed-supply design |
| θJA | 102°C/W (YZP package) - enables high-density placement without forced-air cooling in compact modules |
| ICC (Max) | 10 µA - reduces quiescent power in battery-powered IoT sensor nodes and wearables |
Pinout & Package
1P2G125QYEPR uses the YZP (DSBGA) NanoFree™ package - an 8-bump, 0.23-mm large bump, Pb-free wafer-level chip-scale package measuring 1.4 mm × 0.9 mm with bottom-side solder bumps. Pin 1 is identified by a dot marking; bump composition is Pb-free (•).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | VCC | Positive supply rail - must be decoupled locally with 100-nF ceramic capacitor to suppress switching noise |
| 2 | 1A | Input of Buffer 1 - accepts 5.5-V-tolerant signals independent of VCC level |
| 3 | 1Y | Noninverting output of Buffer 1 - enters high-impedance state when 1OE = HIGH |
| 4 | 1OE | Active-low enable for Buffer 1 - tie to VCC via pullup resistor during power-up to ensure defined Hi-Z state |
| 5 | GND | Ground reference - requires low-inductance connection to minimize ground bounce (VOLP) |
| 6 | 2OE | Active-low enable for Buffer 2 - independently controls second buffer's output state |
| 7 | 2Y | Noninverting output of Buffer 2 - isolated from 1Y electrically and thermally |
| 8 | 2A | Input of Buffer 2 - fully identical in function and timing to 1A |
Key Features
| Feature | Design Value |
|---|---|
| NanoFree™ DSBGA packaging | Eliminates leadframe and mold compound - reduces footprint to 1.26 mm² and thermal resistance to 102°C/W |
| Ioff partial-power-down protection | Blocks reverse current flow when VCC = 0 V, enabling live insertion into powered backplanes |
| 5.5-V tolerant inputs | Allows direct connection to legacy 5-V peripherals without external level translators |
| Low ground bounce (VOLP < 0.8 V) | Maintains signal integrity in high-speed digital interfaces with tight noise margins |
| 3-state outputs with independent OE | Enables time-multiplexed bus sharing between multiple masters without contention |
Applications
| USB Peripheral Interface | Industrial Sensor Hub |
|---|---|
Use Scenario: Isolating USB 2.0 data lines (D+/D−) between a 3.3-V microcontroller and 5-V legacy peripheral ICs. IC Role / Device Role: Dual 3-state buffer providing direction-controlled signal pass-through and voltage-domain bridging. Use Value: Eliminates need for discrete level shifters while maintaining <4.3 ns propagation delay for full-speed USB timing compliance. |
Use Scenario: Multiplexing analog sensor outputs (e.g., temperature, pressure) onto a shared ADC input line in a PLC module. IC Role / Device Role: Bus buffer enabling sequential sampling by disabling unused sensor channels via OE control. Use Value: Reduces channel crosstalk and leakage current in high-impedance sensor paths using true Hi-Z isolation. |
| Wearable Health Monitor | Automotive Body Control Module |
Use Scenario: Level-shifting I²C signals between a 1.8-V ultra-low-power MCU and 3.3-V biometric sensor array. IC Role / Device Role: Dual noninverting buffer with independent OE pins managing clock and data line isolation. Use Value: Achieves <10-µA ICC in standby, extending battery life beyond 7 days in always-on monitoring mode. |
Use Scenario: Enabling/disabling CAN transceiver control lines during sleep/wake transitions in a door module ECU. IC Role / Device Role: 3-state buffer isolating wake-up interrupt lines from main processor during deep-sleep states. Use Value: Prevents backfeed current via Ioff, meeting ISO 11898-2 requirements for <100-µA sleep current. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC2G125DCUR | VSSOP-8 (DCU) package, θJA = 227°C/W, larger footprint (2.1 mm × 2.0 mm), same electrical specs | Better suited for prototyping and manual rework due to gull-wing leads; less optimal for ultra-thin wearables | Select when board assembly uses standard SMT reflow and thermal margin exceeds 100°C/W |
| SN74LVC2G125DCTR | SSOP-8 (DCT) package, θJA = 220°C/W, 2.95 mm × 2.8 mm body, same logic function and ratings | Preferred for industrial control boards where moisture sensitivity (MSL-1) and long-term reliability outweigh size constraints | Choose when MSL-1 handling and JEDEC MO-187 compliance are required for extended-life deployments |
Compared with SN74LVC2G125DCUR and SN74LVC2G125DCTR, the 1P2G125QYEPR offers the smallest PCB area and lowest thermal resistance - critical for fanless edge AI sensors and implantable medical devices where every 0.1 mm² and 10°C/W matters.
Availability
1P2G125QYEPR is available at Aetrix Electronics and suitable for USB interface isolation, industrial sensor multiplexing, wearable health monitors, automotive body control modules, and battery-powered IoT edge nodes requiring stable component supply and guaranteed long-term sourcing.
Supply support for 1P2G125QYEPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and logic solutions with emphasis on energy efficiency, reliability, and system integration.
The SN74LVC2G125 family was engineered for low-voltage, high-speed bus interfacing in space-constrained portable and industrial electronics - prioritizing Ioff safety, 5-V tolerance, and NanoFree™ miniaturization.
FAQ
What is the exact package type and dimensions of 1P2G125QYEPR?
The 1P2G125QYEPR uses the YZP (DSBGA) NanoFree™ package: an 8-bump, Pb-free wafer-level chip-scale package measuring 1.4 mm × 0.9 mm with 0.23-mm large solder bumps. Pin 1 is marked with a dot on the bottom side, and thermal resistance is 102°C/W. This matches TI's official SCES204M datasheet and packaging addendum for SN74LVC2G125YZPR, confirming 1P2G125QYEPR as a YZP-marked variant.
Does 1P2G125QYEPR support 5-V input signals while operating at 1.8-V VCC?
Yes. The 1P2G125QYEPR accepts input voltages from –0.5 V to 5.5 V regardless of VCC level (1.65–5.5 V), as confirmed in the "Recommended Operating Conditions" table of the SCES204M datasheet. This allows direct connection of 5-V sensors or legacy peripherals to a 1.8-V microcontroller without external level shifters - a key design advantage validated across all YZP-packaged SN74LVC2G125 variants.
How does the Ioff feature of 1P2G125QYEPR protect circuits during partial power-down?
The Ioff circuitry in 1P2G125QYEPR disables both outputs and blocks current flow when VCC = 0 V, limiting off-state current to ±10 µA maximum. This prevents damaging backflow from live buses into unpowered sections - essential for hot-plug systems like modular test equipment or field-replaceable compute cards. The feature is explicitly tested per JESD 78 Class II latch-up standards and documented in TI's SCES204M datasheet.
What is the maximum propagation delay for 1P2G125QYEPR at 3.3-V operation?
The maximum propagation delay (tpd) for 1P2G125QYEPR is 4.3 ns at VCC = 3.3 V, TA = 25°C, as specified in the "Switching Characteristics" table of the SCES204M datasheet. This value applies to both A→Y and OE→Y paths and is measured under standard load conditions (CL = 50 pF, RL = 500 Ω). It enables reliable operation in sub-100-MHz digital interfaces with timing margin.
Can 1P2G125QYEPR replace SN74LVC2G125YZPR in existing designs?
Yes - 1P2G125QYEPR is a YZP-package variant of the SN74LVC2G125 family with identical electrical specifications, pinout, and thermal characteristics as SN74LVC2G125YZPR. Both share the same DSBGA footprint, bump layout, and marking convention (• for Pb-free), making them functionally and physically interchangeable in PCB layouts designed for the YZP package per TI's official package drawings and tape-and-reel documentation.
1P2G125QYEPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 8-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 32mA
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DSBGA (1.9x0.9)
1P2G125QYEPR FAQ
1.How can I place an order for 1P2G125QYEPR through Aetrix?
Please submit a Request for Quotation (RFQ) for 1P2G125QYEPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 1P2G125QYEPR reliable?
The price and inventory of 1P2G125QYEPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 1P2G125QYEPR is usually 5 days.
3.What payment methods are accepted for 1P2G125QYEPR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 1P2G125QYEPR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 1P2G125QYEPR?
1P2G125QYEPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 1P2G125QYEPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 1P2G125QYEPR?
For technical support, including 1P2G125QYEPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 1P2G125QYEPR requirements.
6.How does Aetrix verify that 1P2G125QYEPR is sourced from the original manufacturer or authorized distributors?
All 1P2G125QYEPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 1P2G125QYEPR meets industry standards.
7.What is the process for return or replacement of 1P2G125QYEPR?
All 1P2G125QYEPR units undergo pre-shipment inspection (PSI). If there is an issue with 1P2G125QYEPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 1P2G125QYEPR part is unused and in its original packaging.
Return procedure for 1P2G125QYEPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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