My Inquiry
My Account
Renesas 2308-3DCGI
- Part No.:
- 2308-3DCGI
- Manufacturer:
- Renesas
- Package:
- 16-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
2308-3DCGI.pdf
- Description:
- IC MULT ZDB 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:3,678
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
2308-3DCGI from Renesas Electronics is a 3.3V zero-delay clock multiplier IC implementing a high-speed phase-lock loop (PLL) for clock distribution and multiplication in industrial-grade systems. It accepts a 10–133 MHz reference clock (REF), delivers two independent banks (A/B) of four LVCMOS outputs each, supports 2x/4x multiplication modes, achieves <200 ps output skew, and operates across –40°C to +85°C. It is used in SDRAM timing control and telecom backplane clock fanout.
For engineers reviewing the 2308-3DCGI datasheet, 2308-3DCGI pinout, 2308-3DCGI application, or 2308-3DCGI equivalent, key selection criteria include its dual-bank 2x/4x multiplication capability, industrial temperature rating, SOIC-16 package, external feedback (FBK) configuration flexibility, and guaranteed ≤200 ps bank-internal skew under matched loading.
Technical Context
The 2308-3DCGI implements an externally closed PLL architecture where the FBK pin receives feedback from any selected output to align phase between REF and outputs-enabling true zero-delay operation. Its dual-bank structure (CLKA1–CLKA4 and CLKB1–CLKB4) is controlled via S1/S2 select inputs, allowing independent tri-state enable/disable per bank.
It supports two distinct multiplication configurations: Bank A outputs at 2× REF frequency while Bank B outputs at either REF or REF×1 (phase-indeterminate), or Bank A at 2× REF and Bank B at 4× REF-per the device-specific option table. The PLL lock time is ≤1 ms with stable supply and valid clocks on REF/FBK.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 3.0 V to 3.6 V - ensures compatibility with standard 3.3V logic rails and noise margin stability |
| Input Frequency Range | 10 MHz to 133.3 MHz - supports SDRAM, PC motherboard, and datacom reference clocks |
| Output Skew (same bank) | ≤200 ps - guarantees tight timing alignment across all four outputs within Bank A or Bank B |
| Cycle-to-Cycle Jitter | ≤200 ps at 66.67 MHz (15 pF load) - meets stringent timing budget requirements for high-speed memory interfaces |
| Operating Temperature | –40°C to +85°C - qualified for industrial embedded and telecom infrastructure environments |
| Package | 16-pin SOIC - surface-mount compatible with standard PCB assembly processes and thermal profiles |
| Output Drive | Standard drive (8 mA sink/source) - optimized for 30 pF loads below 100 MHz and 15 pF above |
Pinout & Package
2308-3DCGI is housed in a 16-pin Small Outline Integrated Circuit (SOIC) package with standard 1.27 mm pitch and 10.3 mm × 7.5 mm body dimensions. Pin numbering follows JEDEC MS-012AC, top-view orientation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (REF) | Reference Clock Input | 5 V-tolerant input accepting 10–133 MHz clock; drives PLL core and determines all output frequencies |
| 2–3, 14–15 (CLKA1–CLKA4) | Bank A Clock Outputs | Four LVCMOS outputs configured as 2× REF (Bank A); weak pull-down for bus contention safety |
| 4, 13 (VDD) | Power Supply | Dual 3.3 V supply pins reduce IR drop and improve PSRR across high-frequency switching |
| 5, 12 (GND) | Ground | Dual ground pins provide low-impedance return paths for both output banks and minimize ground bounce |
| 6–7, 10–11 (CLKB1–CLKB4) | Bank B Clock Outputs | Four LVCMOS outputs configured as 4× REF (Bank B); phase relationship to REF is deterministic only when FBK sourced from Bank B |
| 8 (S2), 9 (S1) | Bank Select Inputs | Logic-level inputs decoding output bank state (tri-state/driven); weak pull-up for default-driven behavior |
| 16 (FBK) | PLL Feedback Input | External feedback node-must be driven by one output to close PLL loop and achieve zero delay; loading mismatch directly affects REF-to-output delay |
Key Features
| Feature | Design Value |
|---|---|
| Externally closed PLL | Enables user-defined delay tuning via FBK pin sourcing-critical for board-level skew compensation and trace-length matching |
| Dual independent output banks | Allows simultaneous generation of 2× and 4× clock domains (e.g., core logic and I/O interface clocks) with separate enable control |
| No external RC network required | Reduces BOM count and layout area; eliminates calibration drift and temperature sensitivity of passive components |
| Power-down mode | Draws <25 μA when REF = 0 MHz and S1/S2 = HIGH-supports low-power system states without external gating |
| Test mode bypass | Disables PLL and routes REF directly to outputs-enables functional validation of downstream logic without PLL lock dependency |
Applications
| SDRAM Timing Control | Telecom Backplane Fanout |
|---|---|
Use Scenario: Generating synchronized 2× and 4× clocks for DDR SDRAM command/address and data strobe paths on industrial control motherboards. IC Role / Device Role / Timing Role: Zero-delay clock multiplier providing phase-aligned CLK and DQS clocks with sub-200 ps skew across memory channels. Use Value: Eliminates setup/hold violations caused by propagation delay mismatches between clock domains, enabling reliable 133 MHz SDRAM operation. |
Use Scenario: Distributing a single 125 MHz reference across multiple line cards in a carrier-grade Ethernet switch chassis. IC Role / Device Role / Timing Role: High-fanout clock buffer with configurable multiplication, delivering matched-skew clocks to SERDES PHYs and MAC controllers. Use Value: Maintains deterministic inter-card timing alignment via FBK routing from a designated output, reducing bit-error-rate in multi-lane links. |
| Datacom Switch Fabric Clocking | Industrial PC Motherboard Clock Tree |
Use Scenario: Driving clock inputs for packet processing ASICs and switch fabric controllers requiring 100 MHz and 200 MHz domains from one source. IC Role / Device Role / Timing Role: Dual-bank multiplier generating 2× REF on Bank A and 4× REF on Bank B-both locked to same REF source. Use Value: Enables synchronous clock domain crossing with minimal jitter accumulation, supporting deterministic latency in cut-through switching. |
Use Scenario: Providing CPU, chipset, and peripheral clocks on ruggedized industrial PCs operating in extended temperature environments. IC Role / Device Role / Timing Role: Industrial-temperature-rated clock multiplier ensuring stable timing under thermal cycling and voltage variation. Use Value: Guarantees continuous operation from –40°C to +85°C without clock failure or PLL unlock events during ambient transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar clock multiplier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IDT2308-3DCG | Commercial temperature range (0°C to +70°C); identical pinout, functionality, and electrical specs except temp grade | Suitable for non-industrial environments like office equipment or lab instruments where ambient stays within commercial limits | Select when cost sensitivity outweighs extended temperature need and system thermal profile is controlled |
| ICS853S02I | Single 2× output bank (4 outputs), no Bank B 4× mode; lower max frequency (125 MHz); different pinout and FBK implementation | Limited to single-multiple clock trees; lacks dual-bank flexibility and 133 MHz support required for DDR3/DDR4 SDRAM | Choose only if design requires only 2× multiplication and space-constrained TSSOP-20 packaging is acceptable |
Compared with IDT2308-3DCG and ICS853S02I, the 2308-3DCGI uniquely combines industrial temperature operation, dual-bank 2x/4x multiplication, and SOIC-16 compatibility-making it the only direct fit for ruggedized SDRAM and telecom timing where both extended temp and flexible clock ratio generation are mandatory.
Availability
2308-3DCGI is available at Aetrix Electronics and suitable for SDRAM timing control, telecom backplane fanout, datacom switch fabric clocking, industrial PC motherboard clock trees, and critical path delay designs requiring stable component supply across extended temperature ranges.
Supply support for 2308-3DCGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and timing solutions for automotive, industrial, and infrastructure markets.
The IDT2308 family-including 2308-3DCGI-is part of Renesas' legacy IDT timing portfolio, designed specifically for high-reliability clock distribution in industrial and telecom systems demanding zero-delay synchronization and multi-ratio flexibility.
FAQ
What clock multiplication ratios does the 2308-3DCGI support?
Per the IDT2308-3 variant specification, the 2308-3DCGI supports Bank A at 2× REF frequency and Bank B at 4× REF frequency. This configuration is fixed for the -3 suffix; Bank B output phase is deterministic only when FBK is sourced from Bank B. The device does not support 1× or 3× ratios.
Does the 2308-3DCGI require external passive components to operate?
No, the 2308-3DCGI requires no external RC network for PLL operation. Its PLL loop is closed externally via the FBK pin, which must be connected to one of the eight outputs. Only standard 0.1 µF VDD bypass capacitors per supply pin are needed for stable operation.
How is zero delay achieved in the 2308-3DCGI?
Zero delay in the 2308-3DCGI is achieved by aligning the phase of output clocks to the REF input using an externally closed PLL. The FBK pin must be driven by one output; when all outputs-including the FBK source-are equally loaded, the input-to-output delay cancels to near zero (±250 ps typical).
What is the maximum output load capacitance supported by the 2308-3DCGI?
The 2308-3DCGI supports up to 30 pF load capacitance for output frequencies below 100 MHz, and up to 15 pF for frequencies from 100 MHz to 133.3 MHz. Exceeding these values degrades rise/fall times, increases jitter, and may cause PLL instability or skew violation.
Can the 2308-3DCGI operate with a 2.5 V supply?
No, the 2308-3DCGI is specified only for 3.0 V to 3.6 V operation. Its absolute maximum VDD rating is +4.6 V, but DC characteristics (VIH/VIL, VOL/VOH, IDD) and AC performance (jitter, skew, frequency) are guaranteed exclusively within the 3.0–3.6 V range per datasheet operating conditions.
2308-3DCGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 16-SOIC (0.154", 3.90mm Width)
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Type:
- Multiplier, Zero Delay Buffer
- PLL:
- Yes with Bypass
- Input:
- LVTTL
- Output:
- LVTTL
- Number of Circuits:
- 1
- Ratio - Input:Output:
- 1:8
- Differential - Input:Output:
- No/No
- Frequency - Max:
- 133.3MHz
- Divider/Multiplier:
- No/Yes
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C
- Mounting Type:
- Surface Mount
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 16-SOIC
2308-3DCGI FAQ
1.How can I place an order for 2308-3DCGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 2308-3DCGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 2308-3DCGI reliable?
The price and inventory of 2308-3DCGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 2308-3DCGI is usually 5 days.
3.What payment methods are accepted for 2308-3DCGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 2308-3DCGI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 2308-3DCGI?
2308-3DCGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 2308-3DCGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 2308-3DCGI?
For technical support, including 2308-3DCGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 2308-3DCGI requirements.
6.How does Aetrix verify that 2308-3DCGI is sourced from the original manufacturer or authorized distributors?
All 2308-3DCGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 2308-3DCGI meets industry standards.
7.What is the process for return or replacement of 2308-3DCGI?
All 2308-3DCGI units undergo pre-shipment inspection (PSI). If there is an issue with 2308-3DCGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 2308-3DCGI part is unused and in its original packaging.
Return procedure for 2308-3DCGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
2308-3DCGI Tags
-
CD74HCT4046AM96
Texas Instruments
-
MC14046BDWR2G
onsemi
-
501MILFT
Renesas
-
CD74HC7046AM
Texas Instruments
-
CDCVF2505PWR
Texas Instruments
-
RC19004A100GNL#KB0
Renesas
-
SI5351A-B-GTR
Skyworks Solutions Inc.
-
CY2305SXI-1T
Infineon Technologies
-
570BILFT
Renesas
-
CDCE913PWR
Texas Instruments
-
CY2305SXI-1HT
Infineon Technologies
-
DS1086LU+T
Analog Devices Inc./Maxim Integrated
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
