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Home > Products > Integrated Circuits (ICs) > Clock/Timing > Clock Generators, PLLs, Frequency Synthesizers

Renesas 2308-4DCG

Name: 2308-4DCG
Brand: Renesas
SKU: 2308-4DCG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 2308-4DCG

Manufacturer:: Renesas

Category:: Clock Generators, PLLs, Frequency Synthesizers

Package:: 16-SOIC (0.154", 3.90mm Width)

Datasheet:: 2308-4DCG.pdf

Description:: IC MULT ZDB 16SOIC

Quantity:: RFQ Add To RFQ list

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Product details

Overview

2308-4DCG from Renesas Electronics is a 3.3V zero-delay clock multiplier IC implementing a high-speed phase-lock loop (PLL) for clock distribution and multiplication. It delivers two banks of four outputs each, supports 2× input frequency multiplication on both banks, operates from 10MHz to 133.3MHz, achieves <200ps output-to-output skew, and targets SDRAM timing-critical applications in PC motherboards and telecom infrastructure.

For engineers reviewing the 2308-4DCG datasheet, 2308-4DCG pinout, 2308-4DCG application, or 2308-4DCG equivalent, this page provides verified functional identity, confirmed SOIC-16 package mapping, validated bank-synchronized 2× multiplication behavior, real-world skew/jitter specs under 15–30pF loads, and direct alternatives with documented frequency and drive-level differences.

Technical Context

The 2308-4DCG uses an externally closed PLL loop via the FBK pin to align output phase with the REF input clock-enabling true zero-delay operation across its 10–133.3MHz range. Its dual-bank architecture (CLKA1–CLKA4 and CLKB1–CLKB4) allows independent enable control per bank and supports identical 2× multiplication on both banks, as specified in the Available Options table.

Control logic interprets S1/S2 select inputs to place output banks in tri-state mode or route REF directly to outputs in test mode. Power-down mode activates when REF is absent, reducing current draw to ≤12μA (commercial) or ≤25μA (industrial), with outputs forced high-impedance.

Key Specifications

Parameter	Value and Actual Design Meaning
Input Frequency Range	10 MHz to 133.3 MHz - supports SDRAM and high-speed datacom clocking without external prescaling
Output Multiplication	2× on both Bank A and Bank B - enables synchronous doubling of reference clock for memory interface timing
Output Skew	<200 ps - ensures tight timing alignment across all eight outputs when equally loaded
Cycle-to-Cycle Jitter	≤200 ps at 66.67 MHz / 15 pF - meets stringent jitter budgets for DDR memory clock trees
Supply Voltage	3.0 V to 3.6 V - compatible with standard 3.3V logic rails and industrial voltage tolerances
Operating Temperature	0°C to +70°C - commercial-grade rating suitable for PC motherboard and workstation environments
Package	16-pin SOIC - surface-mount footprint with proven thermal and signal integrity for dense PCB layouts

Pinout & Package

2308-4DCG is supplied in a 16-pin Small Outline Integrated Circuit (SOIC) package with standard 1.27 mm pitch, 10.3 mm × 7.5 mm body size, and gull-wing leads. Pin numbering follows JEDEC MS-012AC, top-view orientation.

Pin/Terminal	Circuit Role	Design Meaning
REF (Pin 1)	Reference Clock Input	5V-tolerant input accepting 10–133.3 MHz clock; drives internal PLL and serves as timing reference for zero-delay alignment
CLKA1–CLKA4 (Pins 2,3,14,15)	Bank A Clock Outputs	Four synchronized 2× multiplied outputs; individually weak-pulled down; share common enable via S1/S2 decoding
CLKB1–CLKB4 (Pins 6,7,10,11)	Bank B Clock Outputs	Four synchronized 2× multiplied outputs; identical timing behavior to Bank A; supports independent tri-state control
FBK (Pin 16)	PLL Feedback Input	External feedback node-must be driven by one output to close PLL loop and achieve zero delay; loading affects input-output delay calibration
S1/S2 (Pins 9,8)	Bank Select Inputs	Two-bit control enabling tri-state mode per bank or direct REF pass-through in test mode; weak pull-ups ensure defined state at power-up
VDD (Pins 4,13)	Power Supply	Dual 3.3V supply pins reduce IR drop and improve noise immunity across high-frequency switching outputs
GND (Pins 5,12)	Ground	Dual ground pins provide low-inductance return paths for eight high-speed CMOS outputs

Key Features

Feature	Design Value
Zero-delay PLL architecture	Aligns output edges with REF input using external FBK connection-eliminates fixed propagation delay in clock distribution networks
Dual independent output banks	Enables separate enable/disable control for Bank A and Bank B-supports staggered memory initialization or isolated subsystem clocking
No external RC network required	Integrates all PLL loop components internally-reduces BOM count, layout area, and tuning complexity versus discrete oscillator solutions
Test mode with direct REF pass-through	Bypasses PLL to route REF directly to outputs-facilitates system-level clock path validation without PLL lock dependency
Low-power shutdown	Draws ≤12 μA when REF = 0 MHz and S1/S2 = HIGH-minimizes standby power in idle or sleep states

Applications

SDRAM Timing Control	Telecom Line Card Clocking
Use Scenario: Distributing synchronized 2× clock signals to multiple SDRAM chips on a high-density memory module. IC Role / Device Role / Timing Role: Zero-delay clock multiplier generating matched 2× clocks for address/command and data strobe paths with sub-200ps skew. Use Value: Eliminates cumulative clock tree delay, enabling tighter setup/hold margins and higher memory bus speeds up to 133.3 MHz.	Use Scenario: Providing phase-aligned clock outputs for multiple DSPs and FPGAs on a telecom line card requiring deterministic latency. IC Role / Device Role / Timing Role: Dual-bank 2× clock generator delivering identical frequency and phase across processing clusters with minimal inter-device skew. Use Value: Ensures coherent sampling and frame synchronization across distributed signal processing units without external delay compensation.
Datacom Switch Fabric Sync	PC Motherboard High-Speed I/O
Use Scenario: Driving clock inputs of SerDes PHYs and packet buffer controllers in a 10G Ethernet switch ASIC design. IC Role / Device Role / Timing Role: Low-jitter (≤200ps) 2× clock source feeding parallel clock domains while maintaining strict cycle-to-cycle stability. Use Value: Reduces bit error rate (BER) by minimizing clock-induced timing uncertainty in high-speed serial link receivers.	Use Scenario: Generating dual 2× clocks for PCIe root complex and SATA controller clock domains on a desktop motherboard. IC Role / Device Role / Timing Role: Single-chip solution replacing discrete buffers and multipliers-simplifies layout and reduces layer count in constrained board space. Use Value: Achieves timing compliance for multiple high-speed interfaces using one compact SOIC-16 device with shared PLL resource.

SDRAM Timing Control

Telecom Line Card Clocking

Use Scenario: Distributing synchronized 2× clock signals to multiple SDRAM chips on a high-density memory module.

IC Role / Device Role / Timing Role: Zero-delay clock multiplier generating matched 2× clocks for address/command and data strobe paths with sub-200ps skew.

Use Value: Eliminates cumulative clock tree delay, enabling tighter setup/hold margins and higher memory bus speeds up to 133.3 MHz.

Use Scenario: Providing phase-aligned clock outputs for multiple DSPs and FPGAs on a telecom line card requiring deterministic latency.

IC Role / Device Role / Timing Role: Dual-bank 2× clock generator delivering identical frequency and phase across processing clusters with minimal inter-device skew.

Use Value: Ensures coherent sampling and frame synchronization across distributed signal processing units without external delay compensation.

Datacom Switch Fabric Sync

PC Motherboard High-Speed I/O

Use Scenario: Driving clock inputs of SerDes PHYs and packet buffer controllers in a 10G Ethernet switch ASIC design.

IC Role / Device Role / Timing Role: Low-jitter (≤200ps) 2× clock source feeding parallel clock domains while maintaining strict cycle-to-cycle stability.

Use Value: Reduces bit error rate (BER) by minimizing clock-induced timing uncertainty in high-speed serial link receivers.

Use Scenario: Generating dual 2× clocks for PCIe root complex and SATA controller clock domains on a desktop motherboard.

IC Role / Device Role / Timing Role: Single-chip solution replacing discrete buffers and multipliers-simplifies layout and reduces layer count in constrained board space.

Use Value: Achieves timing compliance for multiple high-speed interfaces using one compact SOIC-16 device with shared PLL resource.

Equivalent & Alternatives

The following parts are listed as comparable options for similar clock multiplication applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IDT2308-2DCG	Supports mixed multiplication: Bank A = 1×, Bank B = 2× - not symmetric 2× like 2308-4DCG	Used where asymmetric clock domain scaling is required (e.g., core logic vs. I/O interface)	Select when separate 1× and 2× outputs are needed; avoid if identical 2× on both banks is mandatory
IDT2308-4DCGI	Identical functionality and pinout, but rated for -40°C to +85°C industrial temperature range	Required for extended-temperature deployments such as base station equipment or industrial controllers	Choose for harsh-environment applications; otherwise 2308-4DCG suffices for commercial systems

Compared with IDT2308-2DCG, 2308-4DCG provides uniform 2× multiplication across both banks-critical for symmetric memory interfaces-while IDT2308-4DCGI offers identical electrical performance with broader thermal tolerance, making it the only drop-in replacement for temperature-critical use cases.

Availability

2308-4DCG is available at Aetrix Electronics and suitable for SDRAM timing control, telecom line card clocking, datacom switch fabric sync, and PC motherboard high-speed I/O applications requiring stable component supply, consistent SOIC-16 sourcing, and commercial-temperature reliability.

Supply support for 2308-4DCG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and timing solutions for automotive, industrial, and enterprise applications.

The IDT2308 family-including 2308-4DCG-is part of Renesas' legacy timing portfolio acquired from IDT, designed specifically for high-speed, low-skew clock distribution in memory-intensive systems like SDRAM modules and telecom infrastructure.

FAQ

What is the exact output multiplication ratio supported by the 2308-4DCG?

2308-4DCG supports 2× multiplication on both Bank A and Bank B outputs. As confirmed in the "Available Options for IDT2308" table, the -4 variant is explicitly defined to deliver 2× Reference frequency on either bank. This differs from variants like -2 (1×/2×) or -3 (2×/4×), making 2308-4DCG optimal for symmetric doubled-clock applications such as dual-channel SDRAM interfaces.

Does the 2308-4DCG require an external feedback resistor or capacitor to operate?

No, the 2308-4DCG does not require any external RC network. Its PLL loop is closed externally by connecting one of its own outputs (e.g., CLKA1 or CLKB1) to the FBK pin-no passive components are needed. This is explicitly stated in the Features section and validated across both commercial and industrial DC/switching specifications, simplifying design and improving long-term stability.

What is the maximum load capacitance the 2308-4DCG can drive at 133.3 MHz?

At 133.3 MHz, the 2308-4DCG supports a maximum load capacitance of 15 pF per output, as specified in the Operating Conditions tables for both commercial and industrial grades. Exceeding this value may degrade rise/fall times and increase jitter beyond the guaranteed 100 ps cycle-to-cycle spec measured under those conditions.

How does the 2308-4DCG enter power-down mode, and what is its quiescent current?

The 2308-4DCG enters power-down mode automatically when the REF input clock stops (0 MHz) and both S1 and S2 inputs are held HIGH. In this state, all outputs go high-impedance and the device draws ≤12 μA, as specified in the Commercial DC Electrical Characteristics table under IDD_PD. This low-current mode aids power-sensitive system designs during idle or suspend cycles.

Is the 2308-4DCG pin-compatible with other IDT2308 variants such as the -1DCG or -2DCG?

Yes, all IDT2308 variants-including 2308-4DCG, 2308-1DCG, and 2308-2DCG-are fully pin-compatible in the same SOIC-16 or TSSOP-16 packages. Pin functions, locations, and electrical characteristics (e.g., VDD, GND, REF, FBK, S1/S2, and all CLKA/CLKB outputs) are identical across the family. Functional differences arise solely from internal configuration (multiplication ratios, drive strength), not pinout or packaging.

2308-4DCG Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 16-SOIC (0.154", 3.90mm Width)

Packaging:: Tube

Product Status:: Obsolete

Programmable:: Not Verified

Type:: Multiplier, Zero Delay Buffer

PLL:: Yes with Bypass

Input:: LVTTL

Output:: LVTTL

Number of Circuits:: 1

Ratio - Input:Output:: 1:8

Differential - Input:Output:: No/No

Frequency - Max:: 133.3MHz

Divider/Multiplier:: No/Yes

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: 0°C ~ 70°C

Mounting Type:: Surface Mount

Grade:: -

Qualification:: -

Supplier Device Package:: 16-SOIC

2308-4DCG FAQ

1.How can I place an order for 2308-4DCG through Aetrix?

Please submit a Request for Quotation (RFQ) for 2308-4DCG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 2308-4DCG reliable?

The price and inventory of 2308-4DCG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 2308-4DCG is usually 5 days.

3.What payment methods are accepted for 2308-4DCG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 2308-4DCG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 2308-4DCG?

2308-4DCG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 2308-4DCG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 2308-4DCG?

For technical support, including 2308-4DCG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 2308-4DCG requirements.

6.How does Aetrix verify that 2308-4DCG is sourced from the original manufacturer or authorized distributors?

All 2308-4DCG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 2308-4DCG meets industry standards.

7.What is the process for return or replacement of 2308-4DCG?

All 2308-4DCG units undergo pre-shipment inspection (PSI). If there is an issue with 2308-4DCG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 2308-4DCG part is unused and in its original packaging.

Return procedure for 2308-4DCG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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