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Renesas 2308-5HPGGI

Part No.:
2308-5HPGGI
Manufacturer:
Renesas
Category:
Clock Generators, PLLs, Frequency Synthesizers
Package:
16-TSSOP (0.173", 4.40mm Width)
Datasheet:
Aetrix2308-5HPGGI.pdf
Description:
IC MULT ZDB 16TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,842

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Product details

Overview

2308-5HPGGI from Renesas Electronics is a 3.3V zero-delay clock multiplier IC implementing a high-speed phase-lock loop (PLL) for precise clock distribution and multiplication. It supports 10–133.3 MHz input frequency, delivers reference/2 output on both banks, features eight CMOS outputs (4 per bank), and operates across –40°C to +85°C industrial temperature range in 16-pin TSSOP package - used in SDRAM timing control and telecom backplane synchronization.

For engineers reviewing the 2308-5HPGGI datasheet, 2308-5HPGGI pinout, 2308-5HPGGI application, or 2308-5HPGGI equivalent, key selection criteria include its fixed ÷2 output ratio per bank, external feedback architecture for skew control, low 200 ps cycle-to-cycle jitter at 133.3 MHz (15 pF), and industrial-grade reliability with tri-state enable per bank.

Technical Context

The 2308-5HPGGI implements an externally closed PLL using the FBK pin to align output phase with REF input, achieving true zero delay by matching propagation path delays. Its dual-bank architecture (CLKA1–CLKA4 and CLKB1–CLKB4) allows independent enable/disable via S1/S2 control logic, supporting test-mode direct-through clocking and automatic power-down when REF is absent.

This variant is specifically configured for reference/2 output on both banks (per IDT2308-5H specification), with high-drive capability (12 mA sink/source), 1.25 ns fall time (30 pF load), and optimized for 15 pF loads up to 133.3 MHz input - distinct from -1/-2/-3/-4 variants offering 1x/2x/4x options.

Key Specifications

Parameter Value and Actual Design Meaning
Input Frequency Range10 MHz to 133.3 MHz - supports high-speed SDRAM and telecom line-rate clocks.
Output ConfigurationReference/2 on both Bank A and Bank B - fixed division ratio, no internal pre-scaler variation.
Output Drive Strength±12 mA - enables driving heavier capacitive loads or multiple fanouts without buffers.
Output Skew (same bank)<200 ps - ensures tight timing alignment across four outputs within one bank.
Cycle-to-Cycle Jitter100 ps at 133.3 MHz (15 pF load) - critical for jitter-sensitive SerDes and memory interfaces.
Supply Voltage3.0 V to 3.6 V - compatible with standard 3.3 V rail; monotonic ramp-up required for reliable PLL lock.
Operating Temperature–40°C to +85°C - qualified for industrial embedded and base station applications.

Pinout & Package

2308-5HPGGI is housed in a 16-pin Thin Shrink Small Outline Package (TSSOP), 4.4 mm × 5.0 mm body, 0.65 mm pitch, RoHS-compliant and Pb-free ("G" suffix). Pin 1 is REF (5 V-tolerant reference clock input); pins 2–3, 14–15 are Bank A outputs; pins 6–7, 10–11 are Bank B outputs; pins 4 and 13 are VDD (3.3 V); pins 5 and 12 are GND; pins 8–9 are S2/S1 select inputs; pin 16 is FBK (external PLL feedback input).

Pin/Terminal Circuit Role Design Meaning
REF (Pin 1)Reference Clock Input5 V-tolerant single-ended input; drives PLL core; monotonic VDD ramp required for stable lock.
CLKA1–CLKA4 (Pins 2,3,14,15)Bank A Output GroupCMOS outputs delivering REF/2; individually loaded but skewed <200 ps when equally terminated.
CLKB1–CLKB4 (Pins 6,7,10,11)Bank B Output GroupCMOS outputs delivering REF/2; independent enable via S1/S2; same timing specs as Bank A.
FBK (Pin 16)External PLL Feedback InputConnects to any output to close loop; loading mismatch vs. other outputs directly adjusts REF-to-output delay.
S1/S2 (Pins 9,8)Bank Control Select InputsWeak pull-up inputs decoding output enable state: HH = both banks active; LH = Bank A only; HL = Bank B only; LL = tri-state all outputs.
VDD (Pins 4,13)Power Supply3.3 V supply with 0.1 µF bypass per pin; total IDD ≤70 mA at 100 MHz (high-drive mode).
GND (Pins 5,12)Ground ReferenceDual ground pins minimize ground bounce; required for specified jitter and skew performance.

Key Features

Feature Design Value
Externally closed PLL architectureEnables precise skew tuning via FBK pin loading - no fixed internal delay path limits design flexibility.
Dual independent output banksEach bank (A/B) has four outputs with separate enable control - supports staggered power-up or domain isolation.
High-drive output stage (±12 mA)Drives up to 15 pF at 133.3 MHz without external buffers - reduces BOM count in dense PCB layouts.
Automatic power-down modeDraws <25 µA when REF = 0 MHz and S1=S2=HIGH - eliminates need for external enable sequencing in standby.
Industrial temperature qualificationSpecified from –40°C to +85°C with full electrical performance - suitable for uncontrolled ambient deployments.

Applications

SDRAM Memory Subsystem Telecom Line Card Timing

Use Scenario: Synchronizing DDR SDRAM clock domains across multiple memory chips on a single DIMM or controller interface.

IC Role / Device Role / Timing Role: Zero-delay clock multiplier generating matched REF/2 clocks for address/command and data strobe paths.

Use Value: Eliminates cumulative trace delay skew between memory controller and DRAMs, enabling stable 133 MHz operation without manual trace length matching.

Use Scenario: Distributing synchronized low-jitter clocks to multiple SERDES lanes and framer ICs on a telecom line card.

IC Role / Device Role / Timing Role: High-drive clock fanout buffer with deterministic phase alignment across eight outputs.

Use Value: Maintains <200 ps inter-output skew under 15 pF load, meeting SONET/SDH jitter budget requirements for OC-48 and beyond.

Data Center Server Motherboard Industrial PLC Backplane

Use Scenario: Providing phase-aligned clocks to CPU, chipset, and peripheral controllers on high-density server motherboards.

IC Role / Device Role / Timing Role: Dual-bank clock multiplier enabling independent enable/disable of CPU-domain vs. I/O-domain clocks.

Use Value: Reduces dynamic power by tri-stating unused banks during low-power states, while preserving timing integrity during transitions.

Use Scenario: Delivering robust clock signals across long backplane traces in programmable logic controller chassis.

IC Role / Device Role / Timing Role: Industrial-temperature clock multiplier with external feedback for trace-length compensation.

Use Value: Compensates for PCB trace delay variations across 200+ mm backplanes via FBK pin loading adjustment, ensuring sub-nanosecond alignment.

Equivalent & Alternatives

The following parts are listed as comparable options for similar clock multiplication applications.

Alternative Part Technical Difference Application Difference Selection Advice
IDT2308-5HDCGISame function and electrical specs, but in 16-pin SOIC package (5.3 mm × 10.2 mm vs. TSSOP's 4.4 mm × 5.0 mm).SOIC footprint requires more board area; less suitable for space-constrained telecom modules.Select 2308-5HPGGI for high-density layouts; choose -5HDCGI only if legacy SOIC compatibility is mandatory.
ICS853S05IFixed 1:2 LVDS clock divider (not PLL-based); no external feedback; 3.3 V supply; 200 ps skew; –40°C to +85°C.Lacks zero-delay PLL flexibility - cannot compensate for board trace delays; limited to point-to-point LVDS loads.Use ICS853S05I only in cost-sensitive, fixed-layout LVDS systems where external skew tuning is unnecessary.

Compared with IDT2308-5HDCGI, 2308-5HPGGI saves >50% board area and improves thermal dissipation in airflow-limited enclosures; compared with ICS853S05I, it provides adjustable zero-delay operation essential for multi-drop clock trees with variable trace lengths.

Availability

2308-5HPGGI is available at Aetrix Electronics and suitable for SDRAM memory subsystems, telecom line cards, server motherboards, industrial PLC backplanes, and critical-path delay designs requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 2308-5HPGGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and timing solutions, with deep expertise in high-reliability industrial and automotive electronics.

The IDT2308 family - acquired from Integrated Device Technology - was designed for high-speed, low-skew clock distribution in memory, telecom, and computing infrastructure where deterministic phase alignment is non-negotiable.

FAQ

What is the maximum input frequency supported by the 2308-5HPGGI?

The 2308-5HPGGI supports a maximum input frequency of 133.33 MHz, as confirmed in the switching characteristics table for -5H devices under 20 pF load conditions. This limit applies regardless of output configuration since the -5H variant is fixed at REF/2 output ratio on both banks, and the PLL core is rated for this input rate across the full industrial temperature range.

Does the 2308-5HPGGI require an external RC network for PLL operation?

No, the 2308-5HPGGI does not require an external RC network. Its PLL is designed for external feedback via the FBK pin, eliminating the need for passive loop-filter components. This simplifies layout, improves repeatability, and avoids temperature drift associated with discrete RC elements - a key differentiator from older clock multiplier architectures.

How is zero delay achieved in the 2308-5HPGGI, and what determines its accuracy?

Zero delay in the 2308-5HPGGI is achieved by closing the PLL feedback loop externally through the FBK pin connected to one output. Delay accuracy depends on matched loading between the FBK-driven output and all other outputs - equal 15 pF loads yield <±250 ps REF-to-output delay (t6), while load mismatches shift delay predictably per the Output Load Difference Chart in the datasheet.

Can both output banks of the 2308-5HPGGI be disabled independently?

Yes, the 2308-5HPGGI supports independent bank disable via the S1 and S2 select inputs. Per the Function Table, setting S2=L/S1=H disables Bank B only, while S2=H/S1=L disables Bank A only. Both banks enter tri-state when S2=L/S1=L, and both remain active when S2=H/S1=H - enabling flexible power sequencing and domain isolation in complex systems.

What is the power-down current specification for the 2308-5HPGGI at industrial temperature?

At industrial temperature (–40°C to +85°C), the 2308-5HPGGI draws ≤25 µA in power-down mode (REF = 0 MHz, S1 = S2 = HIGH), as specified in the DC Electrical Characteristics – Industrial table. This ultra-low quiescent current enables energy-efficient standby operation without requiring external enable circuitry or voltage gating.

2308-5HPGGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
16-TSSOP (0.173", 4.40mm Width)
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Type:
Multiplier, Zero Delay Buffer
PLL:
Yes with Bypass
Input:
LVTTL
Output:
LVTTL
Number of Circuits:
1
Ratio - Input:Output:
1:8
Differential - Input:Output:
No/No
Frequency - Max:
133.3MHz
Divider/Multiplier:
Yes/No
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Grade:
-
Qualification:
-
Supplier Device Package:
16-TSSOP

2308-5HPGGI FAQ

1.How can I place an order for 2308-5HPGGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 2308-5HPGGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 2308-5HPGGI reliable?

The price and inventory of 2308-5HPGGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 2308-5HPGGI is usually 5 days.

3.What payment methods are accepted for 2308-5HPGGI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 2308-5HPGGI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 2308-5HPGGI?

2308-5HPGGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 2308-5HPGGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 2308-5HPGGI?

For technical support, including 2308-5HPGGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 2308-5HPGGI requirements.

6.How does Aetrix verify that 2308-5HPGGI is sourced from the original manufacturer or authorized distributors?

All 2308-5HPGGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 2308-5HPGGI meets industry standards.

7.What is the process for return or replacement of 2308-5HPGGI?

All 2308-5HPGGI units undergo pre-shipment inspection (PSI). If there is an issue with 2308-5HPGGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 2308-5HPGGI part is unused and in its original packaging.

Return procedure for 2308-5HPGGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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