Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas 2309-1HDCG

Part No.:
2309-1HDCG
Manufacturer:
Renesas
Category:
Clock Generators, PLLs, Frequency Synthesizers
Package:
16-SOIC (0.154", 3.90mm Width)
Datasheet:
Aetrix2309-1HDCG.pdf
Description:
IC ZD BUFFER 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,382

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

2309-1HDCG from Renesas Electronics is a 3.3V zero-delay clock buffer IC with phase-lock loop (PLL) architecture, distributing one reference clock to nine low-skew outputs (five in Bank A, four in Bank B), operating from 10MHz to 133MHz with <250ps output-to-output skew and <200ps cycle-to-cycle jitter, used in SDRAM clock distribution on PC motherboards and telecom datacom systems.

For engineers reviewing the 2309-1HDCG datasheet, 2309-1HDCG pinout, 2309-1HDCG application, or 2309-1HDCG equivalent, this high-drive variant supports industrial-grade timing integrity in memory subsystems, backplane clock trees, and critical-path delay-sensitive designs where precise I/O alignment and fast PLL lock (<1ms) are required.

Technical Context

The 2309-1HDCG implements an on-chip PLL that locks to the REF input and uses internal feedback from the CLKOUT pin to achieve zero input-output delay; its dual-bank output enable (S1/S2 control) allows independent tri-state of Bank A (CLKA1–CLKA4) and Bank B (CLKB1–CLKB4).

It operates at 3.3V supply (3.0–3.6V), supports both commercial (0°C to +70°C) and industrial (−40°C to +85°C) temperature ranges, and delivers high-drive capability (12mA sink/source per output) enabling direct drive of multiple loads without external buffers.

Key Specifications

ParameterValue and Actual Design Meaning
Supply Voltage3.0–3.6V - Ensures stable operation across standard 3.3V rail tolerances.
Operating Frequency10–133MHz - Supports DDR SDRAM, PCI-X, and high-speed serial link reference clocks.
Output Skew<250ps - Guarantees synchronous edge alignment across all nine outputs for timing-critical memory interfaces.
Cycle-to-Cycle Jitter<200ps - Maintains signal integrity in high-frequency clock trees without added jitter accumulation.
PLL Lock Time<1ms - Enables rapid system initialization after power-up or clock recovery events.
Output Drive Strength±12mA - Drives heavier capacitive loads (e.g., 30pF @ 100MHz) without external buffering.
Input Voltage Range (REF)−0.5V to +5.5V - Accepts 5V-tolerant TTL/CMOS inputs while powered from 3.3V.

Pinout & Package

2309-1HDCG is housed in a 16-pin SOIC package (Green, RoHS-compliant), measuring 10.3mm × 7.5mm × 2.3mm, with standard 1.27mm pitch and surface-mount compatibility.

Pin/TerminalCircuit RoleDesign Meaning
REF (Pin 1)Input Reference Clock5V-tolerant clock input feeding the PLL; threshold at VDD/2.
CLKA1–CLKA4 (Pins 2,3,14,15)Bank A OutputsFour low-skew clocks controlled by S1/S2; weak pull-down when tri-stated.
CLKB1–CLKB4 (Pins 6,7,10,11)Bank B OutputsFour low-skew clocks controlled by S1/S2; independent enable from Bank A.
CLKOUT (Pin 16)Internal Feedback OutputProvides PLL feedback path; loading affects I/O delay tuning for zero-delay alignment.
S1/S2 (Pins 9,8)Output Bank Select InputsControl tri-state state of Bank A and Bank B per function table; weak pull-ups.
VDD (Pins 4,13)Power Supply3.3V core supply; decoupling required at both pins for noise suppression.
GND (Pins 5,12)Ground ReferenceDual ground pins reduce return-path inductance and improve skew performance.

Key Features

FeatureDesign Value
Zero-Delay PLL ArchitectureAligns REF rising edge with CLKOUT rising edge (±350ps), eliminating propagation delay in clock distribution paths.
Independent Bank EnableS1/S2 inputs allow dynamic power gating of Bank A or Bank B, reducing system-level dynamic current by up to 50%.
High-Drive Output Stage±12mA drive per output enables direct connection to ≥8 loads at 66MHz or ≥4 loads at 133MHz (10pF).
No External RC NetworkOn-chip PLL eliminates need for external loop filter components, simplifying layout and improving reliability.
Power-Down ModeDraws ≤25µA when REF = 0MHz and S1/S2 = HIGH, supporting low-power standby states.

Applications

SDRAM Memory SubsystemsTelecom Line Cards

Use Scenario: Distributing synchronized clock signals to multiple SDRAM chips on a DIMM or motherboard.

IC Role / Device Role / Timing Role: Zero-delay clock buffer ensuring matched trace lengths and identical clock arrival times across memory banks.

Use Value: Eliminates setup/hold violations at DDR data rates up to 266MT/s by maintaining <250ps inter-output skew.

Use Scenario: Providing phase-aligned clocks to multiple DSPs, FPGAs, and SerDes on a telecom line card.

IC Role / Device Role / Timing Role: High-drive clock distributor with independent bank control for modular clock domain partitioning.

Use Value: Enables hot-swap isolation of clock domains via S1/S2 without affecting adjacent functional blocks.

Datacom Switch FabricPC Workstation Motherboards

Use Scenario: Driving clock inputs of multiple packet processors and PHYs in a 10G Ethernet switch ASIC cluster.

IC Role / Device Role / Timing Role: Low-jitter (≤200ps) clock repeater with device-to-device skew <700ps for multi-chip synchronization.

Use Value: Prevents timing misalignment between parallel processing paths, reducing packet reordering latency.

Use Scenario: Generating CPU, memory, and peripheral clocks from a single crystal oscillator on x86-based workstations.

IC Role / Device Role / Timing Role: Primary clock buffer with configurable output banks for BIOS-controlled power management.

Use Value: Allows firmware to disable unused clock domains (e.g., PCIe slots) during low-power states without hardware redesign.

Equivalent & Alternatives

The following parts are listed as comparable options for similar zero-delay clock buffer applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IDT2309-1HDCGISame electrical specs and pinout, rated for −40°C to +85°C industrial temperature range.Required for extended-temperature deployments (e.g., outdoor telecom cabinets, industrial controllers).Select when ambient operating temperature exceeds +70°C or requires full industrial qualification.
ICS8302AM-01LFLower drive (±8mA), 8-output (no Bank B), 10–125MHz max, TSSOP-20 package.Lacks independent bank control and high-frequency margin; suitable only for simpler 8-load distributions.Choose only if design uses ≤8 outputs and does not require >125MHz or dual-bank enable functionality.

Compared with IDT2309-1HDCGI, the 2309-1HDCG offers identical performance at lower cost for commercial environments; versus ICS8302AM-01LF, it provides higher drive, broader frequency support, and flexible bank control-critical for SDRAM and multi-ASIC clock trees.

Availability

2309-1HDCG is available at Aetrix Electronics and suitable for SDRAM memory subsystems, telecom line cards, and PC workstation motherboards requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for 2309-1HDCG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and timing solutions for automotive, industrial, and infrastructure markets.

The IDT2309 product line was designed specifically for high-fidelity, zero-delay clock distribution in memory-intensive computing and communications platforms where deterministic timing and low jitter are non-negotiable.

FAQ

What is the maximum operating frequency of the 2309-1HDCG under 30pF load conditions?

The 2309-1HDCG supports up to 100MHz when driving 30pF loads per output, as specified in the switching characteristics tables for both commercial and industrial temperature ranges. At lighter 10pF loads, it achieves full 133MHz operation-making it suitable for DDR2/DDR3 memory clocking and high-speed serial interface references where load capacitance is tightly controlled.

Does the 2309-1HDCG require external passive components to operate its PLL?

No, the 2309-1HDCG integrates a complete PLL with on-chip feedback from the CLKOUT pin, eliminating the need for external resistors or capacitors in the loop filter. This simplifies PCB layout, improves reliability, and ensures consistent lock behavior across voltage and temperature variations without calibration.

How does the 2309-1HDCG achieve zero input-output delay, and what design conditions are required?

The 2309-1HDCG achieves zero I/O delay by aligning the REF input edge with the CLKOUT output edge (±350ps) using internal PLL feedback. To realize true zero delay, all outputs-including CLKOUT-must be equally loaded (e.g., same trace length and termination); unequal loading shifts the delay per the Output Load Difference diagram in the datasheet.

What is the power consumption of the 2309-1HDCG at 66.66MHz with all outputs unloaded?

At 66.66MHz with all outputs unloaded and SEL inputs tied to VDD or GND, the 2309-1HDCG draws ≤35mA supply current in industrial temperature range and ≤32mA in commercial range. Power-down current drops to ≤25µA when REF = 0MHz and S1/S2 = HIGH, enabling ultra-low standby power in battery-backed or energy-conscious systems.

Can the 2309-1HDCG replace the standard-drive IDT2309-1DCG in an existing design?

Yes, the 2309-1HDCG is pin-compatible and functionally identical to the IDT2309-1DCG, with enhanced ±12mA drive strength (vs. ±8mA) and faster rise/fall times (1.5ns vs. 2.5ns). No PCB changes are needed, but verify load capacitance and signal integrity margins-especially at >100MHz-due to increased slew rate and drive capability.

2309-1HDCG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
16-SOIC (0.154", 3.90mm Width)
Packaging:
Tube
Product Status:
Active
Programmable:
Not Verified
Type:
Zero Delay Buffer
PLL:
Yes with Bypass
Input:
LVTTL
Output:
LVTTL
Number of Circuits:
1
Ratio - Input:Output:
1:9
Differential - Input:Output:
No/No
Frequency - Max:
133MHz
Divider/Multiplier:
No/No
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Grade:
-
Qualification:
-
Supplier Device Package:
16-SOIC

2309-1HDCG FAQ

1.How can I place an order for 2309-1HDCG through Aetrix?

Please submit a Request for Quotation (RFQ) for 2309-1HDCG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 2309-1HDCG reliable?

The price and inventory of 2309-1HDCG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 2309-1HDCG is usually 5 days.

3.What payment methods are accepted for 2309-1HDCG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 2309-1HDCG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 2309-1HDCG?

2309-1HDCG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 2309-1HDCG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 2309-1HDCG?

For technical support, including 2309-1HDCG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 2309-1HDCG requirements.

6.How does Aetrix verify that 2309-1HDCG is sourced from the original manufacturer or authorized distributors?

All 2309-1HDCG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 2309-1HDCG meets industry standards.

7.What is the process for return or replacement of 2309-1HDCG?

All 2309-1HDCG units undergo pre-shipment inspection (PSI). If there is an issue with 2309-1HDCG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 2309-1HDCG part is unused and in its original packaging.

Return procedure for 2309-1HDCG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

2309-1HDCG Tags

  • 2309-1HDCG
  • 2309-1HDCG PDF
  • 2309-1HDCG Datasheet
  • 2309-1HDCG Specifications
  • 2309-1HDCG Images
  • Renesas
  • Renesas 2309-1HDCG
  • Buy 2309-1HDCG
  • 2309-1HDCG Price
  • 2309-1HDCG Distributor
  • 2309-1HDCG Supplier
  • 2309-1HDCG Wholesale
Related Products
CD74HCT4046AM96
CD74HCT4046AM96

Texas Instruments

MC14046BDWR2G
MC14046BDWR2G

onsemi

501MILFT
501MILFT

Renesas

CD74HC7046AM
CD74HC7046AM

Texas Instruments

CDCVF2505PWR
CDCVF2505PWR

Texas Instruments

RC19004A100GNL#KB0
RC19004A100GNL#KB0

Renesas

SI5351A-B-GTR
SI5351A-B-GTR

Skyworks Solutions Inc.

CY2305SXI-1T
CY2305SXI-1T

Infineon Technologies

570BILFT
570BILFT

Renesas

CDCE913PWR
CDCE913PWR

Texas Instruments

CY2305SXI-1HT
CY2305SXI-1HT

Infineon Technologies

DS1086LU+T
DS1086LU+T

Analog Devices Inc./Maxim Integrated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER