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Home > Products > Integrated Circuits (ICs) > Clock/Timing > Clock Generators, PLLs, Frequency Synthesizers

Renesas 2309A-1HPGG

Name: 2309A-1HPGG
Brand: Renesas
SKU: 2309A-1HPGG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 2309A-1HPGG

Manufacturer:: Renesas

Category:: Clock Generators, PLLs, Frequency Synthesizers

Package:: 16-TSSOP (0.173", 4.40mm Width)

Datasheet:: 2309A-1HPGG.pdf

Description:: IC ZD BUFFER 16TSSOP

Quantity:: RFQ Add To RFQ list

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Product details

Overview

2309A-1HPGG from Renesas Electronics is a 3.3V zero-delay clock buffer IC with integrated PLL, distributing one reference clock to nine outputs (five in Bank A, four in Bank B) across 10–133 MHz. It delivers <250 ps output-to-output skew, <200 ps cycle-to-cycle jitter, and supports commercial temperature range (0°C to +70°C) in a 16-pin TSSOP package for SDRAM and PC motherboard timing applications.

For engineers reviewing the 2309A-1HPGG datasheet, 2309A-1HPGG pinout, 2309A-1HPGG application, or 2309A-1HPGG equivalent, this device is selected for low-skew, high-frequency clock distribution where phase alignment between REF and CLKOUT is critical, and where separate bank-level output enable control and high-drive capability are required.

Technical Context

The 2309A-1HPGG implements an on-chip PLL with internal feedback sourced from the CLKOUT pin to achieve zero input-output delay. Its dual-bank architecture allows independent enable control via S1/S2 select inputs, supporting flexible clock gating per bank.

It operates at 3.3 V (3.0–3.6 V), features 50% ±10% duty cycle at 66.66 MHz, and enters power-down mode (<12 µA ICC) when REF is inactive - with tri-stated outputs and automatic PLL shutdown.

Key Specifications

Parameter	Value and Actual Design Meaning
Operating Frequency	10–133 MHz (10 pF load); enables high-speed SDRAM and telecom clocking
Output Skew	<250 ps (all outputs equally loaded); ensures synchronous timing across multi-lane interfaces
Cycle-to-Cycle Jitter	<200 ps (at 66.66 MHz); meets tight timing margin requirements in DDR systems
Supply Voltage	3.0–3.6 V; compatible with standard 3.3 V logic rails and noise margins
Power-Down Current	<12 µA (Commercial temp); reduces system standby power without external control logic
Output Drive Strength	High-drive (-1H variant): ±12 mA; drives heavier capacitive loads without external buffers
Input Voltage Range (REF)	–0.5 V to +5.5 V; 5 V tolerant, simplifies interfacing with mixed-voltage clock sources

Pinout & Package

2309A-1HPGG is supplied in a 16-pin TSSOP package (4.4 mm × 5.0 mm, 0.65 mm pitch), optimized for space-constrained PCB layouts while maintaining thermal performance up to +70°C ambient.

Pin/Terminal	Circuit Role	Design Meaning
REF (Pin 1)	Input reference clock	5 V tolerant; threshold at VDD/2; PLL lock source
CLKA1–CLKA4 (Pins 2,3,14,15)	Bank A clock outputs	Four low-skew outputs enabled together via S1/S2
CLKB1–CLKB4 (Pins 6,7,10,11)	Bank B clock outputs	Four low-skew outputs enabled independently from Bank A
CLKOUT (Pin 16)	PLL feedback output	Internally connected to PLL; loading affects I/O delay calibration
S1/S2 (Pins 9,8)	Select inputs	Control Bank A/B enable state per FUNCTION TABLE; weak pull-ups
VDD (Pins 4,13)	Power supply	3.3 V supply with decoupling required at both pins
GND (Pins 5,12)	Ground	Dual ground pins reduce switching noise and improve skew consistency

Key Features

Feature	Design Value
Zero I/O delay architecture	Phase alignment between REF and CLKOUT achieved via on-chip PLL feedback, eliminating external delay compensation
Independent bank enable control	S1/S2 inputs allow dynamic gating of Bank A (CLKA1–4) and Bank B (CLKB1–4) without affecting other bank or PLL operation
High-drive output capability	±12 mA drive strength supports direct connection to ≥10 pF loads at 133 MHz without signal integrity degradation
Automatic power-down mode	Tri-states all outputs and draws <12 µA when REF = 0 MHz; no external enable sequencing required
Load-dependent skew tuning	Adjusting CLKOUT load relative to other outputs fine-tunes input-output delay - enabling precise board-level timing calibration

Applications

SDRAM Memory Interfaces	PC Motherboard Clock Distribution
Use Scenario: Distributing synchronized clock signals to multiple SDRAM chips on a DIMM module or memory controller interface. IC Role / Device Role / Timing Role: Zero-delay clock buffer providing phase-aligned, low-skew clocks to all SDRAM address/command/control lines. Use Value: Enables stable DDR timing margins at 133 MHz by maintaining <250 ps inter-output skew and <200 ps jitter under loaded conditions.	Use Scenario: Generating parallel clock domains for CPU, chipset, and peripheral buses on desktop/server motherboards. IC Role / Device Role / Timing Role: High-drive clock fanout buffer delivering clean, low-jitter clocks to multiple synchronous subsystems. Use Value: Eliminates need for discrete RC networks or additional PLL stages, reducing BOM count and layout complexity while meeting Intel/AMD platform timing specs.
Telecom Line Card Timing	Critical Path Delay-Sensitive Systems
Use Scenario: Providing synchronized clocks to DSPs, FPGAs, and SerDes transceivers in carrier-grade line cards. IC Role / Device Role / Timing Role: Low-jitter clock distribution hub ensuring deterministic latency across processing and interface blocks. Use Value: Maintains sub-nanosecond timing coherence across distributed logic, directly supporting SONET/SDH and CPRI timing budgets.	Use Scenario: Minimizing propagation delay uncertainty in real-time control loops, test equipment, or high-speed data acquisition. IC Role / Device Role / Timing Role: Precision zero-delay repeater aligning input and output edges with ±350 ps max delay variation (t6A). Use Value: Removes variable trace-length-induced skew, enabling deterministic timing closure in FPGA-based measurement or safety-critical logic.

SDRAM Memory Interfaces

PC Motherboard Clock Distribution

Use Scenario: Distributing synchronized clock signals to multiple SDRAM chips on a DIMM module or memory controller interface.

IC Role / Device Role / Timing Role: Zero-delay clock buffer providing phase-aligned, low-skew clocks to all SDRAM address/command/control lines.

Use Value: Enables stable DDR timing margins at 133 MHz by maintaining <250 ps inter-output skew and <200 ps jitter under loaded conditions.

Use Scenario: Generating parallel clock domains for CPU, chipset, and peripheral buses on desktop/server motherboards.

IC Role / Device Role / Timing Role: High-drive clock fanout buffer delivering clean, low-jitter clocks to multiple synchronous subsystems.

Use Value: Eliminates need for discrete RC networks or additional PLL stages, reducing BOM count and layout complexity while meeting Intel/AMD platform timing specs.

Telecom Line Card Timing

Critical Path Delay-Sensitive Systems

Use Scenario: Providing synchronized clocks to DSPs, FPGAs, and SerDes transceivers in carrier-grade line cards.

IC Role / Device Role / Timing Role: Low-jitter clock distribution hub ensuring deterministic latency across processing and interface blocks.

Use Value: Maintains sub-nanosecond timing coherence across distributed logic, directly supporting SONET/SDH and CPRI timing budgets.

Use Scenario: Minimizing propagation delay uncertainty in real-time control loops, test equipment, or high-speed data acquisition.

IC Role / Device Role / Timing Role: Precision zero-delay repeater aligning input and output edges with ±350 ps max delay variation (t6A).

Use Value: Removes variable trace-length-induced skew, enabling deterministic timing closure in FPGA-based measurement or safety-critical logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar zero-delay clock buffer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IDT2309A-1HDCG	Same electrical specs and pinout; differs only in SOIC-16 package instead of TSSOP-16	Preferred for through-hole prototyping or legacy SOIC footprints; same thermal and timing behavior	Select when board layout uses SOIC land pattern or requires higher mechanical robustness
ICS8302AM-01LFT	Lower max frequency (100 MHz), no PLL bypass mode, different pin assignment (no CLKOUT feedback pin)	Lacks load-tunable delay and true zero-delay calibration; suited for fixed-load, lower-frequency fanout	Choose only if 133 MHz operation and skew tuning are not required; verify pin compatibility before substitution

Compared with IDT2309A-1HDCG and ICS8302AM-01LFT, the 2309A-1HPGG uniquely combines TSSOP packaging, 133 MHz capability, and CLKOUT-based skew calibration - making it optimal for space-constrained, high-frequency designs requiring field-adjustable timing alignment.

Availability

2309A-1HPGG is available at Aetrix Electronics and suitable for SDRAM memory interfaces, PC motherboard clock distribution, and telecom line card timing requiring stable component supply across commercial temperature range (0°C to +70°C).

Supply support for 2309A-1HPGG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and timing solutions for automotive, industrial, and infrastructure markets.

The IDT2309A product line - acquired from Integrated Device Technology - delivers high-performance zero-delay clock buffers targeting high-speed digital systems where deterministic, low-skew clock distribution is essential.

FAQ

What is the maximum operating frequency of the 2309A-1HPGG?

The 2309A-1HPGG supports up to 133 MHz with a 10 pF load, and up to 100 MHz with a 30 pF load. This high-frequency capability is enabled by its high-drive (-1H) output stage and optimized PLL loop design, making the 2309A-1HPGG suitable for DDR2/DDR3 memory clocking and high-speed serial interface timing.

Does the 2309A-1HPGG require an external RC network for PLL operation?

No, the 2309A-1HPGG does not require an external RC network. Its PLL is fully integrated with on-chip feedback sourced from the CLKOUT pin, eliminating external components and reducing board area and BOM cost - a key advantage confirmed in the official Renesas datasheet for the 2309A-1HPGG.

How does the 2309A-1HPGG achieve zero input-output delay?

The 2309A-1HPGG achieves zero I/O delay by locking its internal PLL to the REF input and using CLKOUT as the feedback node. When all outputs - including CLKOUT - are equally loaded, the phase alignment between REF and each output is maintained within ±350 ps (t6A), enabling true zero-delay operation without external delay lines or calibration circuitry.

What is the function of the S1 and S2 pins on the 2309A-1HPGG?

The S1 (Pin 9) and S2 (Pin 8) inputs on the 2309A-1HPGG control the enable state of Bank A (CLKA1–4) and Bank B (CLKB1–4) outputs per the FUNCTION TABLE. These pins have weak internal pull-ups, allowing simple logic-level control or open-circuit default operation - a feature used in dynamic power management of the 2309A-1HPGG across multiple clock domains.

Is the 2309A-1HPGG pin-compatible with other variants in the IDT2309A family?

Yes, the 2309A-1HPGG is pin-compatible with all 16-pin IDT2309A variants, including 2309A-1DCG, 2309A-1HDCGI, and 2309A-1DCGI. All share identical pin numbering, function mapping, and electrical behavior - differing only in package type (TSSOP vs. SOIC) and temperature grade (Commercial vs. Industrial), as documented for the 2309A-1HPGG in the Renesas datasheet.

2309A-1HPGG Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 16-TSSOP (0.173", 4.40mm Width)

Packaging:: Tube

Product Status:: Active

Programmable:: Not Verified

Type:: Zero Delay Buffer

PLL:: Yes with Bypass

Input:: LVTTL

Output:: LVTTL

Number of Circuits:: 1

Ratio - Input:Output:: 1:9

Differential - Input:Output:: No/No

Frequency - Max:: 133MHz

Divider/Multiplier:: No/No

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: 0°C ~ 70°C

Mounting Type:: Surface Mount

Grade:: -

Qualification:: -

Supplier Device Package:: 16-TSSOP

2309A-1HPGG FAQ

1.How can I place an order for 2309A-1HPGG through Aetrix?

Please submit a Request for Quotation (RFQ) for 2309A-1HPGG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 2309A-1HPGG reliable?

The price and inventory of 2309A-1HPGG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 2309A-1HPGG is usually 5 days.

3.What payment methods are accepted for 2309A-1HPGG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 2309A-1HPGG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 2309A-1HPGG?

2309A-1HPGG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 2309A-1HPGG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 2309A-1HPGG?

For technical support, including 2309A-1HPGG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 2309A-1HPGG requirements.

6.How does Aetrix verify that 2309A-1HPGG is sourced from the original manufacturer or authorized distributors?

All 2309A-1HPGG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 2309A-1HPGG meets industry standards.

7.What is the process for return or replacement of 2309A-1HPGG?

All 2309A-1HPGG units undergo pre-shipment inspection (PSI). If there is an issue with 2309A-1HPGG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 2309A-1HPGG part is unused and in its original packaging.

Return procedure for 2309A-1HPGG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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