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Home > Products > Integrated Circuits (ICs) > Clock/Timing > Clock Buffers, Drivers

Renesas 2309NZ-1HDCG

Name: 2309NZ-1HDCG
Brand: Renesas
SKU: 2309NZ-1HDCG
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 2309NZ-1HDCG

Manufacturer:: Renesas

Category:: Clock Buffers, Drivers

Package:: 16-SOIC (0.154", 3.90mm Width)

Datasheet:: 2309NZ-1HDCG.pdf

Description:: IC CLK BUF 1:9 133.33MHZ 16SOIC

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Product details

Overview

2309NZ-1HDCG from Renesas Electronics is a nine-output 3.3V clock buffer IC designed for high-speed clock distribution in SDRAM-based mobile and desktop PC systems. It features one input to nine outputs, DC–133.33 MHz operation, <250 ps output-to-output skew, 8.7 ns propagation delay, and consumes <32 mA at 66.6 MHz with unloaded outputs - enabling DIMM/SO-DIMM timing support.

For engineers reviewing the 2309NZ-1HDCG datasheet, 2309NZ-1HDCG pinout, 2309NZ-1HDCG application, or 2309NZ-1HDCG equivalent, key selection criteria include low-power mobile clock buffering, tight skew control for synchronous memory interfaces, 3.3V supply compatibility, SOIC-16 packaging, and industrial temperature range availability via variant suffixes.

Technical Context

The 2309NZ-1HDCG implements a single-ended CMOS clock fanout architecture with dedicated VDD/GND pin pairs (pins 4/5, 8/9, 13/12) to minimize noise coupling and EMI. Its input threshold is VDD/2, supporting standard 3.3V logic levels across commercial (0°C to +70°C) and industrial (−40°C to +85°C) ranges.

All nine outputs drive capacitive loads up to 30 pF below 100 MHz and 15 pF up to 133.33 MHz, with rise/fall times ≤1.5 ns and guaranteed VOH ≥2.4 V / VOL ≤0.4 V at ±8 mA load - ensuring robust signal integrity for DDR SDRAM clock trees and PLL feedback paths.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply Voltage	3.0–3.6 V - compatible with standard 3.3V rail; absolute max rating −0.5 to +4.6 V prevents damage during transient events.
Operating Frequency	DC to 133.33 MHz - supports full-speed DDR SDRAM clocking and PLL reference distribution without frequency limitation.
Propagation Delay	1–8.7 ns - ensures predictable timing margin in critical clock paths; measured at VDD/2 crossing point.
Output-to-Output Skew	<250 ps - enables simultaneous edge alignment across multiple DIMMs or SO-DIMMs for synchronized memory access.
Supply Current	<32 mA at 66.6 MHz (unloaded) - meets mobile platform power budgets while maintaining full functionality.
Input Capacitance	≤7 pF - minimizes loading on upstream clock source, preserving signal integrity and reducing jitter contribution.
Output Drive Strength	±8 mA - sufficient to drive standard 50 Ω transmission lines or 30 pF loads typical of SDRAM address/control buses.

Pinout & Package

2309NZ-1HDCG is packaged in a 16-pin SOIC (Small Outline Integrated Circuit) with 1.27 mm pitch, RoHS-compliant and green-processed per ordering code DCG. The package supports surface-mount assembly and thermal dissipation up to 0.7 W in still air.

Pin/Terminal	Circuit Role	Design Meaning
BUF_IN (Pin 1)	Clock Input	Single-ended CMOS input with VDD/2 threshold; accepts DC–133.33 MHz clocks for fanout distribution.
OUTPUT1–OUTPUT9 (Pins 2,3,6,7,10,11,14,15,16)	Clock Outputs	Nine identical buffered outputs; eight drive DIMMs/SO-DIMMs, one provides feedback to external or chipset PLL.
VDD (Pins 4,8,13)	Digital Supply	Three independent 3.3V supply pins reduce IR drop and improve PSRR across high-frequency switching.
GND (Pins 5,9,12)	Ground Return	Three dedicated ground pins lower impedance return path and suppress simultaneous switching noise (SSN).

Key Features

Feature	Design Value
Low-Power Clock Fanout	Consumes <32 mA at 66.6 MHz - extends battery life in mobile PCs and reduces thermal load in compact desktop designs.
Tight Output Skew Control	<250 ps skew across all nine outputs - eliminates timing misalignment between memory modules in dual-channel configurations.
Noise-Optimized Power Layout	Multiple VDD/GND pin pairs - decouples supply domains and suppresses high-frequency noise coupling into sensitive clock paths.
SDRAM Memory Interface Ready	Supports DC–133.33 MHz with 30 pF load - matches JEDEC timing requirements for DDR/DDR2 SDRAM clock distribution.
Industrial Temperature Support	Variant available up to +85°C ambient - enables use in extended-temperature embedded computing and industrial control systems.

Applications

Mobile PC Memory Subsystem	Desktop PC SDRAM Clock Tree
Use Scenario: Distributing system clock to two DDR SDRAM DIMMs and providing feedback to northbridge PLL in ultraportable laptops. IC Role / Device Role / Timing Role: Nine-output clock buffer with one dedicated PLL feedback output and eight memory-module clock drivers. Use Value: Enables synchronized memory access across dual-channel DIMMs while meeting sub-32 mA power budget for battery longevity.	Use Scenario: Driving clock signals to four SO-DIMM slots and chipset PLL in space-constrained mini-ITX motherboards. IC Role / Device Role / Timing Role: High-fanout 3.3V clock buffer delivering matched-edge timing to multiple memory interfaces. Use Value: Eliminates need for discrete clock splitters; <250 ps skew ensures setup/hold compliance across all SO-DIMM slots.
Industrial Embedded Controller	Communications Baseband Timing
Use Scenario: Providing stable, low-skew clock to SDRAM and FPGA configuration interface in fanless industrial PLCs operating at −40°C to +85°C. IC Role / Device Role / Timing Role: Industrial-grade clock buffer with validated performance over full temperature range and robust ESD immunity. Use Value: Maintains timing accuracy under thermal stress; multiple VDD/GND pins prevent noise-induced data corruption in noisy factory environments.	Use Scenario: Generating synchronized clock references for baseband processor, ADC/DAC, and memory in wireless infrastructure equipment. IC Role / Device Role / Timing Role: Low-jitter fanout buffer feeding multiple subsystems from a common oscillator or synthesizer. Use Value: 8.7 ns propagation delay and ≤1.5 ns edge rates ensure deterministic latency across signal chain components.

Mobile PC Memory Subsystem

Desktop PC SDRAM Clock Tree

Use Scenario: Distributing system clock to two DDR SDRAM DIMMs and providing feedback to northbridge PLL in ultraportable laptops.

IC Role / Device Role / Timing Role: Nine-output clock buffer with one dedicated PLL feedback output and eight memory-module clock drivers.

Use Value: Enables synchronized memory access across dual-channel DIMMs while meeting sub-32 mA power budget for battery longevity.

Use Scenario: Driving clock signals to four SO-DIMM slots and chipset PLL in space-constrained mini-ITX motherboards.

IC Role / Device Role / Timing Role: High-fanout 3.3V clock buffer delivering matched-edge timing to multiple memory interfaces.

Use Value: Eliminates need for discrete clock splitters; <250 ps skew ensures setup/hold compliance across all SO-DIMM slots.

Industrial Embedded Controller

Communications Baseband Timing

Use Scenario: Providing stable, low-skew clock to SDRAM and FPGA configuration interface in fanless industrial PLCs operating at −40°C to +85°C.

IC Role / Device Role / Timing Role: Industrial-grade clock buffer with validated performance over full temperature range and robust ESD immunity.

Use Value: Maintains timing accuracy under thermal stress; multiple VDD/GND pins prevent noise-induced data corruption in noisy factory environments.

Use Scenario: Generating synchronized clock references for baseband processor, ADC/DAC, and memory in wireless infrastructure equipment.

IC Role / Device Role / Timing Role: Low-jitter fanout buffer feeding multiple subsystems from a common oscillator or synthesizer.

Use Value: 8.7 ns propagation delay and ≤1.5 ns edge rates ensure deterministic latency across signal chain components.

Equivalent & Alternatives

The following parts are listed as comparable options for similar clock buffer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IDT2309-1HDCG	Same pinout and electrical specs; lacks "Z" suffix indicating lead-free/RoHS-compliant construction.	Not suitable for RoHS-regulated production; may require requalification for new designs.	Select 2309NZ-1HDCG for new designs requiring compliant materials and long-term supply assurance.
ICS553M-01ILF	Eight outputs, 3.3V, 133 MHz max; no dedicated PLL feedback output; different pinout (20-pin TSSOP).	Limited fanout count and incompatible footprint; requires PCB redesign.	Consider only if nine outputs and SOIC-16 are non-critical; verify skew and drive strength match for target memory interface.

Compared with IDT2309-1HDCG and ICS553M-01ILF, the 2309NZ-1HDCG delivers RoHS compliance, nine fully matched outputs in SOIC-16, and a dedicated PLL feedback path - making it optimal for new SDRAM clock tree implementations where layout reuse and regulatory compliance are mandatory.

Availability

2309NZ-1HDCG is available at Aetrix Electronics and suitable for mobile PC memory subsystems, desktop SDRAM clock trees, and industrial embedded controllers requiring stable component supply, RoHS compliance, and commercial temperature grade performance.

Supply support for 2309NZ-1HDCG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and timing solutions for automotive, industrial, and enterprise applications.

The IDT2309 family was developed by IDT (acquired by Renesas in 2019) specifically for high-fidelity, low-power clock distribution in memory-intensive computing platforms - emphasizing skew control, EMI resilience, and SDRAM interface compatibility.

FAQ

What is the maximum operating frequency supported by the 2309NZ-1HDCG?

The 2309NZ-1HDCG supports clock frequencies from DC up to 133.33 MHz, verified across both commercial (0°C to +70°C) and industrial (−40°C to +85°C) temperature ranges. This range covers standard DDR and DDR2 SDRAM clocking requirements and aligns with common chipset PLL feedback frequencies. Operation beyond 133.33 MHz is not characterized or guaranteed for the 2309NZ-1HDCG.

Does the 2309NZ-1HDCG support industrial temperature operation?

The 2309NZ-1HDCG is specified for commercial temperature range (0°C to +70°C). For industrial operation (−40°C to +85°C), the variant 2309NZ-1HDCGI is available - identical in function and pinout but qualified across the extended range. The 2309NZ-1HDCG itself is not tested or rated for operation below 0°C or above +70°C.

How many outputs does the 2309NZ-1HDCG provide, and what are their roles?

The 2309NZ-1HDCG provides nine CMOS-compatible outputs. Eight are intended for driving memory modules (e.g., two DIMMs or four SO-DIMMs), and the ninth serves as a dedicated feedback path to an external or chipset PLL. All outputs are electrically identical, with matched propagation delay and skew, enabling flexible routing based on board layout constraints.

What package type is used for the 2309NZ-1HDCG?

The 2309NZ-1HDCG uses a 16-pin Small Outline Integrated Circuit (SOIC) package with 1.27 mm lead pitch, RoHS-compliant and green-processed (lead-free). The ordering code "DCG" explicitly denotes this SOIC packaging and commercial temperature grade. It is not available in TSSOP or QFN variants under this part number.

What is the supply current consumption of the 2309NZ-1HDCG at typical operating conditions?

The 2309NZ-1HDCG draws less than 32 mA when operating at 66.6 MHz with unloaded outputs, per commercial-grade DC electrical characteristics. Under loaded conditions (e.g., 30 pF per output), total supply current increases proportionally but remains within safe thermal limits for the SOIC package. IDD is specified up to 35 mA for industrial-grade variants.

2309NZ-1HDCG Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 16-SOIC (0.154", 3.90mm Width)

Packaging:: Tube

Product Status:: Active

Type:: Fanout Buffer (Distribution)

Number of Circuits:: 1

Ratio - Input:Output:: 1:9

Differential - Input:Output:: No/No

Input:: LVTTL

Output:: LVTTL

Frequency - Max:: 133.33 MHz

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: 0°C ~ 70°C

Mounting Type:: Surface Mount

Grade:: -

Qualification:: -

Supplier Device Package:: 16-SOIC

2309NZ-1HDCG FAQ

1.How can I place an order for 2309NZ-1HDCG through Aetrix?

Please submit a Request for Quotation (RFQ) for 2309NZ-1HDCG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 2309NZ-1HDCG reliable?

The price and inventory of 2309NZ-1HDCG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 2309NZ-1HDCG is usually 5 days.

3.What payment methods are accepted for 2309NZ-1HDCG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 2309NZ-1HDCG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 2309NZ-1HDCG?

2309NZ-1HDCG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 2309NZ-1HDCG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 2309NZ-1HDCG?

For technical support, including 2309NZ-1HDCG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 2309NZ-1HDCG requirements.

6.How does Aetrix verify that 2309NZ-1HDCG is sourced from the original manufacturer or authorized distributors?

All 2309NZ-1HDCG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 2309NZ-1HDCG meets industry standards.

7.What is the process for return or replacement of 2309NZ-1HDCG?

All 2309NZ-1HDCG units undergo pre-shipment inspection (PSI). If there is an issue with 2309NZ-1HDCG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 2309NZ-1HDCG part is unused and in its original packaging.

Return procedure for 2309NZ-1HDCG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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