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Home > Products > Integrated Circuits (ICs) > Clock/Timing > Clock Buffers, Drivers

Renesas 2309NZ-1HPGG8

Name: 2309NZ-1HPGG8
Brand: Renesas
SKU: 2309NZ-1HPGG8
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 2309NZ-1HPGG8

Manufacturer:: Renesas

Category:: Clock Buffers, Drivers

Package:: 16-TSSOP (0.173", 4.40mm Width)

Datasheet:: 2309NZ-1HPGG8.pdf

Description:: IC CLK BUF 1:9 133.33MHZ 16TSSOP

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Product details

Overview

2309NZ-1HPGG8 from Renesas Electronics is a nine-output 3.3V clock buffer IC designed for high-speed clock distribution in mobile and desktop PC systems with SDRAM support. It delivers DC–133.33 MHz operation, <8.7 ns input-to-output propagation delay, <250 ps output-to-output skew, and consumes <32 mA at 66.6 MHz with unloaded outputs-enabling reliable DIMM/SO-DIMM timing control.

For engineers reviewing the 2309NZ-1HPGG8 datasheet, 2309NZ-1HPGG8 pinout, 2309NZ-1HPGG8 application, or 2309NZ-1HPGG8 equivalent, key selection criteria include commercial-temperature SOIC/TSSOP-compatible clock buffering with low EMI, high drive capability, and precise skew control for memory subsystems.

Technical Context

The 2309NZ-1HPGG8 implements a single-input, nine-output fanout architecture optimized for SDRAM clock tree distribution. Its BUF_IN accepts DC–133.33 MHz clocks with VDD/2 threshold logic, and all nine outputs drive loads up to 30 pF below 100 MHz or 15 pF above-supporting two DIMMs or four SO-DIMMs plus one PLL feedback path.

No internal PLL or frequency synthesis is present; it is a pure buffer with fixed gain and rail-to-rail CMOS output swing. Multiple VDD (pins 4, 8, 13) and GND (pins 5, 9, 12) pins reduce switching noise and improve EMI performance in dense PCB layouts.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply Voltage	3.0–3.6 V - ensures compatibility with standard 3.3V memory subsystem rails and avoids overvoltage stress.
Operating Frequency	DC to 133.33 MHz - supports full SDR/DDR SDRAM clock rates including 66.67 MHz, 100 MHz, and 133.33 MHz modes.
Propagation Delay	1–8.7 ns - guarantees deterministic timing margin for setup/hold calculations in memory controller interfaces.
Output-to-Output Skew	<250 ps - enables simultaneous edge alignment across multiple DIMM slots without external deskew compensation.
Supply Current	<32 mA at 66.6 MHz (unloaded) - meets mobile platform power budgets while maintaining signal integrity.
Input Capacitance	≤7 pF - minimizes loading on upstream clock sources such as chipset PLLs or crystal oscillators.
Output Drive	±8 mA (VOL/VOH tested) - sufficient to drive 30 pF loads at ≤100 MHz with clean edges and minimal overshoot.

Pinout & Package

2309NZ-1HPGG8 is packaged in a 16-pin TSSOP (Thin Shrink Small Outline Package), lead-free and RoHS-compliant, optimized for space-constrained mobile and embedded PCB layouts.

Pin/Terminal	Circuit Role	Design Meaning
BUF_IN (Pin 1)	Clock Input	Single-ended CMOS input with VDD/2 threshold; accepts DC–133.33 MHz reference clocks from PLLs or oscillators.
OUTPUT1–OUTPUT9 (Pins 2,3,6,7,10,11,14,15,16)	Buffered Clock Outputs	Nine identical CMOS outputs; eight drive DIMM/SO-DIMM address/control lines, one provides feedback to external PLL.
VDD (Pins 4,8,13)	Digital Supply	Three independent 3.3V supply pins reduce IR drop and improve noise immunity across high-frequency switching.
GND (Pins 5,9,12)	Ground Return	Three dedicated ground pins minimize ground bounce and ensure stable reference for all outputs.

Key Features

Feature	Design Value
Low-EMI Layout Support	Multiple VDD/GND pins placed symmetrically to suppress simultaneous switching noise in memory clock trees.
High-Frequency Fanout	Guaranteed operation up to 133.33 MHz with controlled rise/fall times (≤1.5 ns) and tight skew (<250 ps).
Mobile-Optimized Power	Sub-32 mA supply current at 66.6 MHz enables use in battery-sensitive platforms without thermal derating.
Flexible Memory Interface	Configurable for two DIMMs or four SO-DIMMs, with dedicated ninth output for PLL feedback loop closure.

Applications

SDRAM Memory Subsystem	Mobile PC Clock Distribution
Use Scenario: Distributing synchronized clock signals to dual-channel DDR SDRAM modules in notebook platforms. IC Role / Device Role / Timing Role: Nine-output clock buffer providing matched-delay, low-skew clocks to memory controllers and DIMM slots. Use Value: Eliminates need for discrete clock fanout ICs or layout-based matching; maintains <250 ps inter-output skew across temperature.	Use Scenario: Driving clock inputs for LPDDR SO-DIMMs and baseband processor interfaces in ultra-thin laptops. IC Role / Device Role / Timing Role: Low-power 3.3V clock repeater enabling compact, thermally efficient memory timing architecture. Use Value: <32 mA active current at 66.6 MHz reduces system-level power consumption without sacrificing timing accuracy.
Desktop Motherboard Reference Clock	Industrial Embedded SDRAM Interface
Use Scenario: Generating parallel clock outputs for CPU, GPU, and memory controller reference clocks on ATX motherboards. IC Role / Device Role / Timing Role: Fanout buffer delivering phase-aligned clocks from a single oscillator source to multiple subsystems. Use Value: 8.7 ns propagation delay and DC–133.33 MHz bandwidth support legacy and modern SDRAM timing requirements.	Use Scenario: Providing robust clock distribution in industrial HMIs with extended-temperature SDRAM modules. IC Role / Device Role / Timing Role: Commercial-grade buffer operating reliably from 0°C to +70°C in fanless embedded enclosures. Use Value: Multiple VDD/GND pins and low EMI design ensure stable operation in electrically noisy factory environments.

SDRAM Memory Subsystem

Mobile PC Clock Distribution

Use Scenario: Distributing synchronized clock signals to dual-channel DDR SDRAM modules in notebook platforms.

IC Role / Device Role / Timing Role: Nine-output clock buffer providing matched-delay, low-skew clocks to memory controllers and DIMM slots.

Use Value: Eliminates need for discrete clock fanout ICs or layout-based matching; maintains <250 ps inter-output skew across temperature.

Use Scenario: Driving clock inputs for LPDDR SO-DIMMs and baseband processor interfaces in ultra-thin laptops.

IC Role / Device Role / Timing Role: Low-power 3.3V clock repeater enabling compact, thermally efficient memory timing architecture.

Use Value: <32 mA active current at 66.6 MHz reduces system-level power consumption without sacrificing timing accuracy.

Desktop Motherboard Reference Clock

Industrial Embedded SDRAM Interface

Use Scenario: Generating parallel clock outputs for CPU, GPU, and memory controller reference clocks on ATX motherboards.

IC Role / Device Role / Timing Role: Fanout buffer delivering phase-aligned clocks from a single oscillator source to multiple subsystems.

Use Value: 8.7 ns propagation delay and DC–133.33 MHz bandwidth support legacy and modern SDRAM timing requirements.

Use Scenario: Providing robust clock distribution in industrial HMIs with extended-temperature SDRAM modules.

IC Role / Device Role / Timing Role: Commercial-grade buffer operating reliably from 0°C to +70°C in fanless embedded enclosures.

Use Value: Multiple VDD/GND pins and low EMI design ensure stable operation in electrically noisy factory environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar clock buffer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
IDT2309NZ-1HDCG8	Same die, SOIC-16 package instead of TSSOP-16; slightly larger footprint and higher thermal resistance.	Better suited for through-hole prototyping or legacy board designs with SOIC footprints.	Select when board layout already accommodates SOIC or requires easier hand-soldering.
ICS553M-01T	Eight-output, 3.3V buffer with 100 MHz max frequency and 350 ps skew; no ninth feedback output.	Limited to simpler memory configurations without PLL feedback path requirement.	Choose only if ninth output is unused and lower skew tolerance (350 ps vs. 250 ps) is acceptable.

Compared with IDT2309NZ-1HDCG8 and ICS553M-01T, the 2309NZ-1HPGG8 uniquely combines TSSOP space efficiency, nine-output flexibility including PLL feedback, and sub-250 ps skew-making it optimal for next-generation compact SDRAM timing designs requiring both density and precision.

Availability

2309NZ-1HPGG8 is available at Aetrix Electronics and suitable for mobile PC design, SDRAM memory subsystems, and industrial embedded systems requiring stable component supply with consistent TSSOP-16 packaging and commercial-temperature performance.

Supply support for 2309NZ-1HPGG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and timing solutions for automotive, industrial, and infrastructure markets.

The IDT2309NZ family-acquired from Integrated Device Technology-is engineered specifically for high-fidelity, low-power clock distribution in memory-intensive computing platforms, emphasizing skew control, EMI resilience, and SDRAM interface compliance.

FAQ

What is the maximum operating frequency supported by the 2309NZ-1HPGG8?

The 2309NZ-1HPGG8 supports clock frequencies from DC to 133.33 MHz, fully covering standard SDRAM, DDR, and early DDR2 memory bus speeds. This specification is guaranteed across the commercial temperature range (0°C to +70°C) with appropriate load capacitance (≤30 pF below 100 MHz, ≤15 pF above). The 2309NZ-1HPGG8 achieves this using optimized CMOS output drivers and low-propagation-delay internal routing.

Does the 2309NZ-1HPGG8 require external termination resistors?

No, the 2309NZ-1HPGG8 does not require external series or parallel termination resistors for standard operation. Its CMOS outputs are designed to drive typical PCB traces and memory device inputs directly under specified load conditions (≤30 pF). However, impedance-matched routing and proper VDD/GND decoupling (0.1 µF per VDD pin) are recommended to maintain signal integrity and minimize reflections at higher frequencies.

How many of the nine outputs on the 2309NZ-1HPGG8 are intended for DIMM/SO-DIMM driving?

Eight of the nine outputs on the 2309NZ-1HPGG8 are designated for driving DIMM or SO-DIMM clock inputs-supporting either two standard DIMMs or four SO-DIMMs. The ninth output (OUTPUT9) is explicitly intended for feedback to an external or chipset PLL, enabling closed-loop clock synchronization. This functional split is documented in the IDT2309NZ datasheet and reflected in the 2309NZ-1HPGG8's pin mapping and application diagrams.

What is the supply current consumption of the 2309NZ-1HPGG8 at 100 MHz?

The 2309NZ-1HPGG8's supply current is not explicitly characterized at 100 MHz in the official datasheet; however, IDD is specified as ≤32 mA at 66.66 MHz (unloaded) and ≤35 mA at 66.66 MHz under industrial conditions. At 100 MHz, current draw increases proportionally with frequency and load-expect ~40–45 mA with typical 15 pF loads. For precise power modeling, refer to the 2309NZ-1HPGG8's dynamic current vs. frequency curves in the Renesas application note AN-851.

Can the 2309NZ-1HPGG8 be used in industrial temperature applications?

The 2309NZ-1HPGG8 is rated for the commercial temperature range (0°C to +70°C) only. For industrial operation (–40°C to +85°C), Renesas offers the 2309NZ-1HPGGI8 variant-identical functionality and pinout but qualified across the extended range. Using the 2309NZ-1HPGG8 outside its specified ambient range may result in timing violations, increased skew, or parametric failure; always match the 2309NZ-1HPGG8 to commercial-environment designs.

2309NZ-1HPGG8 Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 16-TSSOP (0.173", 4.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Type:: Fanout Buffer (Distribution)

Number of Circuits:: 1

Ratio - Input:Output:: 1:9

Differential - Input:Output:: No/No

Input:: LVTTL

Output:: LVTTL

Frequency - Max:: 133.33 MHz

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: 0°C ~ 70°C

Mounting Type:: Surface Mount

Grade:: -

Qualification:: -

Supplier Device Package:: 16-TSSOP

2309NZ-1HPGG8 FAQ

1.How can I place an order for 2309NZ-1HPGG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 2309NZ-1HPGG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 2309NZ-1HPGG8 reliable?

The price and inventory of 2309NZ-1HPGG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 2309NZ-1HPGG8 is usually 5 days.

3.What payment methods are accepted for 2309NZ-1HPGG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 2309NZ-1HPGG8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 2309NZ-1HPGG8?

2309NZ-1HPGG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 2309NZ-1HPGG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 2309NZ-1HPGG8?

For technical support, including 2309NZ-1HPGG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 2309NZ-1HPGG8 requirements.

6.How does Aetrix verify that 2309NZ-1HPGG8 is sourced from the original manufacturer or authorized distributors?

All 2309NZ-1HPGG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 2309NZ-1HPGG8 meets industry standards.

7.What is the process for return or replacement of 2309NZ-1HPGG8?

All 2309NZ-1HPGG8 units undergo pre-shipment inspection (PSI). If there is an issue with 2309NZ-1HPGG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 2309NZ-1HPGG8 part is unused and in its original packaging.

Return procedure for 2309NZ-1HPGG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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