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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Microchip Technology 23K256T-E/ST

Name: 23K256T-E/ST
Brand: Microchip Technology
SKU: 23K256T-E/ST
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 23K256T-E/ST

Manufacturer:: Microchip Technology

Category:: Memory

Package:: 8-TSSOP (0.173", 4.40mm Width)

Datasheet:: 23K256T-E/ST.pdf

Description:: IC SRAM 256KBIT SPI 20MHZ 8TSSOP

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Inventory:1,000

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Product details

Overview

23K256T-E/ST from Microchip Technology Inc. is a 256 Kbit (32,768 × 8-bit) low-power SPI serial SRAM with automotive-grade temperature support (−40°C to +125°C), 20 MHz max clock frequency, 32-byte page size, and HOLD pin for interrupt-safe bus suspension. It operates from 2.7–3.6 V and delivers 3 mA read current at 1 MHz, serving as nonvolatile-adjacent fast-access memory in engine control units, ADAS sensor buffers, and infotainment subsystems.

For engineers reviewing the 23K256T-E/ST datasheet, 23K256T-E/ST pinout, 23K256T-E/ST application, or 23K256T-E/ST equivalent, key selection criteria include its automotive-temp-rated TSSOP-8 package, SPI-compatible timing compliance up to 20 MHz, standby current ≤4 µA at +85°C, and HOLD functionality enabling deterministic host interrupt handling without command retransmission.

Technical Context

The 23K256T-E/ST implements a true serial SRAM architecture with an 8-bit instruction register and MSB-first SPI protocol compliance. It supports three user-configurable operation modes-Byte (default), Page (32-byte auto-increment within page), and Sequential (full-array wraparound)-all controlled via two bits in a writable STATUS register.

Its HOLD pin operates synchronously with SCK: assertion requires SCK low, and resumption also requires SCK low; during HOLD, SI/SO/SCK enter high-impedance state while CS remains asserted, preserving internal address and mode state. The device powers on in Standby mode (CS = high) and requires no external write-enable or address latches.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Size	32,768 × 8-bit (256 Kbit); enables compact buffering of sensor logs or firmware patch data without parallel bus overhead
Supply Voltage	2.7–3.6 V; compatible with automotive 3.3 V rail systems and tolerant of battery voltage transients
Max Clock Frequency	20 MHz at VCC = 3.0 V (I-temp); supports high-throughput data streaming in real-time control loops
Page Size	32 bytes; matches typical CAN FD frame payload and MCU cache line sizes for efficient burst writes
Standby Current	≤4 µA at +85°C; extends battery life in always-on vehicle modules such as telematics wake-up receivers
Data Retention Voltage	1.2 V minimum; ensures RAM contents survive brown-out events down to critical supply thresholds
Operating Temperature	−40°C to +125°C (Automotive E-grade); qualified for under-hood and transmission-control module environments

Pinout & Package

8-lead TSSOP (ST) package, 3.0 mm × 4.4 mm body, 0.65 mm pitch, RoHS-compliant matte tin finish.

Pin/Terminal	Circuit Role	Design Meaning
1 - CS	Chip Select Input	Active-low enable; drives SO to high-Z when deasserted, enabling multi-device SPI bus sharing
2 - SO	Serial Data Output	Tri-state output; data valid after SCK falling edge; high-Z during HOLD or CS high
3 - NC	No Connect	Internally unconnected; must remain floating or tied to GND per Microchip layout guidelines
4 - VSS	Ground	Primary return path for all I/O and core logic; requires low-inductance connection to system ground plane
5 - SI	Serial Data Input	Instruction/address/data input; sampled on SCK rising edge; high-Z during HOLD
6 - SCK	Serial Clock Input	Synchronous master clock; defines timing for SI sampling and SO update edges
7 - HOLD	Hold Input	Active-low pause control; suspends ongoing SPI transaction without resetting address pointer or mode state
8 - VCC	Supply Voltage	Core and I/O power; requires local 100 nF ceramic decoupling placed ≤2 mm from pin

Key Features

Feature	Design Value
Automotive Temperature Grade	Qualified for −40°C to +125°C operation per AEC-Q100 stress test requirements, enabling use in powertrain and chassis ECUs
HOLD Pin with Synchronous Control	Enables deterministic interruption of SPI transfers-host can service higher-priority interrupts and resume mid-sequence without address loss or reinitialization
Three Configurable Access Modes	Byte (single-location), Page (32-byte burst within page), and Sequential (wraparound full-array) modes selectable via STATUS register bits 7–6
Low Standby Current	≤4 µA at +85°C allows integration into always-on domains (e.g., CAN wake-up buffers) without compromising system quiescent power budget
Pb-Free & Halogen-Free Packaging	TSSOP-8 package meets J-STD-020 moisture sensitivity level 3 and RoHS Directive 2011/65/EU requirements

Applications

Engine Control Unit (ECU) Data Logging	Advanced Driver Assistance Systems (ADAS) Sensor Buffering
Use Scenario: Capturing real-time crankshaft position, throttle angle, and O2 sensor readings during transient engine events for post-failure diagnostics. IC Role / Device Role / Timing Role: High-speed, low-latency SRAM buffer interfacing directly with PIC® MCU SPI port; replaces slower EEPROM for volatile runtime logging. Use Value: 20 MHz clock enables 2.5 MB/s sustained write throughput-sufficient to capture 16-bit sensor streams at 150 kHz without dropping samples.	Use Scenario: Temporarily storing raw pixel data from radar or camera preprocessing units before compression or CAN FD transmission. IC Role / Device Role / Timing Role: Burst-capable serial memory acting as first-stage FIFO between image sensor interface and DSP; leverages Page mode for 32-byte aligned transfers. Use Value: 32-byte page size aligns with CAN FD's 64-byte payload, allowing two back-to-back reads per frame with minimal CPU overhead.
Infotainment System UI State Cache	Telematics Control Unit (TCU) Wake-Up Event Buffer
Use Scenario: Preserving navigation map tile prefetch state, audio playlist metadata, and touchscreen gesture history across low-power sleep cycles. IC Role / Device Role / Timing Role: Fast-access SRAM holding UI context data; accessed via SPI from ARM-based application processor during wake-from-sleep transitions. Use Value: ≤4 µA standby current at +85°C prevents measurable battery drain during 72-hour parked state, meeting OEM parasitic load targets.	Use Scenario: Capturing GPS coordinates, cellular signal strength, and diagnostic trouble codes during periodic wake-up intervals while vehicle is off. IC Role / Device Role / Timing Role: Low-voltage-tolerant memory (1.2 V retention) retaining critical event data during battery brown-outs or deep-sleep voltage sag. Use Value: Guaranteed data retention down to 1.2 V ensures no loss of last-known location or fault code even during cranking-induced voltage dips.

Engine Control Unit (ECU) Data Logging

Advanced Driver Assistance Systems (ADAS) Sensor Buffering

Use Scenario: Capturing real-time crankshaft position, throttle angle, and O2 sensor readings during transient engine events for post-failure diagnostics.

IC Role / Device Role / Timing Role: High-speed, low-latency SRAM buffer interfacing directly with PIC® MCU SPI port; replaces slower EEPROM for volatile runtime logging.

Use Value: 20 MHz clock enables 2.5 MB/s sustained write throughput-sufficient to capture 16-bit sensor streams at 150 kHz without dropping samples.

Use Scenario: Temporarily storing raw pixel data from radar or camera preprocessing units before compression or CAN FD transmission.

IC Role / Device Role / Timing Role: Burst-capable serial memory acting as first-stage FIFO between image sensor interface and DSP; leverages Page mode for 32-byte aligned transfers.

Use Value: 32-byte page size aligns with CAN FD's 64-byte payload, allowing two back-to-back reads per frame with minimal CPU overhead.

Infotainment System UI State Cache

Telematics Control Unit (TCU) Wake-Up Event Buffer

Use Scenario: Preserving navigation map tile prefetch state, audio playlist metadata, and touchscreen gesture history across low-power sleep cycles.

IC Role / Device Role / Timing Role: Fast-access SRAM holding UI context data; accessed via SPI from ARM-based application processor during wake-from-sleep transitions.

Use Value: ≤4 µA standby current at +85°C prevents measurable battery drain during 72-hour parked state, meeting OEM parasitic load targets.

Use Scenario: Capturing GPS coordinates, cellular signal strength, and diagnostic trouble codes during periodic wake-up intervals while vehicle is off.

IC Role / Device Role / Timing Role: Low-voltage-tolerant memory (1.2 V retention) retaining critical event data during battery brown-outs or deep-sleep voltage sag.

Use Value: Guaranteed data retention down to 1.2 V ensures no loss of last-known location or fault code even during cranking-induced voltage dips.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial SRAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY14V104Q2L-BAI	4 Mbit nvSRAM with integrated lithium battery backup; 5V-tolerant I/O; 45 ns access time; SOIC-28 package	Provides nonvolatile storage without external backup circuitry; suited for black-box recording where power loss must not erase data	Select when data persistence beyond power removal is required; avoid if board space or cost sensitivity precludes larger SOIC-28 footprint
IS25LP080D-JBLE	8 Mbit Quad SPI NOR Flash; 133 MHz QSPI clock; 3-byte addressing; WSON-8 package	Offers higher density and execute-in-place capability but lacks true SRAM random-write performance and byte-level write endurance	Select for firmware storage or static configuration tables; avoid for high-frequency dynamic data buffering due to erase/write latency and wear leveling constraints

Compared with CY14V104Q2L-BAI and IS25LP080D-JBLE, the 23K256T-E/ST delivers deterministic sub-microsecond write latency, unlimited write cycles, and automotive-qualified TSSOP-8 packaging-making it optimal for time-critical, high-endurance volatile buffering where external backup or flash-like density is unnecessary.

Availability

23K256T-E/ST is available at Aetrix Electronics and suitable for automotive control units, ADAS sensor interfaces, and telematics modules requiring stable component supply across extended product lifecycles.

Supply support for 23K256T-E/ST includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a U.S.-based semiconductor manufacturer specializing in microcontrollers, analog devices, and memory solutions for industrial, automotive, and consumer markets.

The 23K256T-E/ST belongs to Microchip's 23X256 SPI Serial SRAM family, designed specifically to provide automotive-grade, low-power, pin-efficient memory expansion for resource-constrained microcontroller systems requiring fast, reliable, and interrupt-resilient data buffering.

FAQ

What is the maximum clock frequency supported by the 23K256T-E/ST, and under what conditions?

The 23K256T-E/ST supports a maximum clock frequency of 20 MHz when operating at VCC = 3.0 V over the industrial temperature range (−40°C to +85°C). At automotive temperature (−40°C to +125°C), the maximum rated frequency is 16 MHz per Table 1-2 AC Characteristics. This specification is validated under CL = 100 pF and input rise/fall times ≤5 ns. Exceeding these limits may cause timing violations or data corruption in the 23K256T-E/ST.

Does the 23K256T-E/ST require external pull-up resistors on its SPI lines?

The 23K256T-E/ST does not require external pull-up resistors on SI, SO, or SCK-its inputs meet standard SPI voltage thresholds (VIH ≥ 0.7×VCC, VIL ≤ 0.2×VCC), and SO is actively driven or tri-stated. However, CS and HOLD should be pulled up externally (typically 10 kΩ to VCC) to ensure defined logic states during power-up and reset, preventing unintended activation or hold behavior in the 23K256T-E/ST.

How does the HOLD function operate in the 23K256T-E/ST, and what are its timing constraints?

The HOLD function in the 23K256T-E/ST pauses an active SPI transaction without resetting the internal address pointer or mode state. To activate HOLD, the pin must be driven low while SCK is low; to resume, HOLD must be returned high while SCK remains low. During HOLD, SI/SO/SCK enter high-impedance state. Setup/hold times are 10 ns each (Table 1-3), and the 23K256T-E/ST must remain selected (CS low) throughout.

What is the purpose of the NC pin (Pin 3) on the 23K256T-E/ST TSSOP package?

Pin 3 on the 23K256T-E/ST TSSOP package is designated NC (No Connect) and is internally unconnected. Microchip specifies that this pin must not be soldered to any net on the PCB-it should remain floating or be tied to ground only if required by mechanical or thermal design rules, per DS22100F-page 13. Connecting NC to VCC or driving it actively may cause undefined behavior or damage the 23K256T-E/ST.

Can the 23K256T-E/ST retain data during a complete power loss?

No-the 23K256T-E/ST is a volatile SRAM and loses all stored data when VCC drops below the data retention voltage (1.2 V minimum per D011). It does not include onboard nonvolatile backup. For persistent storage across power cycles, external mechanisms such as supercapacitors, batteries, or companion nvSRAM/EEPROM must be used. The 23K256T-E/ST guarantees data retention only while VCC remains ≥1.2 V, not during total power removal.

23K256T-E/ST Specifications

Product attributes: Attribute value

Manufacturer:: Microchip Technology

Series:: -

Package/Case:: 8-TSSOP (0.173", 4.40mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM

Memory Size:: 256Kbit

Memory Organization:: 32K x 8

Memory Interface:: SPI

Clock Frequency:: 20 MHz

Write Cycle Time - Word, Page:: -

Access Time:: -

Voltage - Supply:: 2.7V ~ 3.6V

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 8-TSSOP

23K256T-E/ST FAQ

1.How can I place an order for 23K256T-E/ST through Aetrix?

Please submit a Request for Quotation (RFQ) for 23K256T-E/ST on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 23K256T-E/ST reliable?

The price and inventory of 23K256T-E/ST are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 23K256T-E/ST is usually 5 days.

3.What payment methods are accepted for 23K256T-E/ST?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 23K256T-E/ST transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 23K256T-E/ST?

23K256T-E/ST orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 23K256T-E/ST order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 23K256T-E/ST?

For technical support, including 23K256T-E/ST datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 23K256T-E/ST requirements.

6.How does Aetrix verify that 23K256T-E/ST is sourced from the original manufacturer or authorized distributors?

All 23K256T-E/ST products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 23K256T-E/ST meets industry standards.

7.What is the process for return or replacement of 23K256T-E/ST?

All 23K256T-E/ST units undergo pre-shipment inspection (PSI). If there is an issue with 23K256T-E/ST, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 23K256T-E/ST part is unused and in its original packaging.

Return procedure for 23K256T-E/ST:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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