Microchip Technology 23LCV1024-I/P
- Part No.:
- 23LCV1024-I/P
- Manufacturer:
- Microchip Technology
- Category:
- Memory
- Package:
- 8-DIP (0.300", 7.62mm)
- Datasheet:
-
23LCV1024-I/P.pdf
- Description:
- IC SRAM 1MBIT SPI/DUAL 8DIP
- Quantity:
- Payment:

- Shipping:

Inventory:268
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
23LCV1024-I/P from Microchip Technology is a 1 Mbit (128K × 8) industrial-grade SPI Serial SRAM with battery backup support, SDI dual-interface capability, and 2.5–5.5 V operation. It delivers 20 MHz clock rate, 3 mA read current at 5.5 V/20 MHz, and 4 µA standby current at +85°C, enabling nonvolatile data retention in power-loss scenarios for embedded control logging and configuration storage.
For engineers reviewing the 23LCV1024-I/P datasheet, 23LCV1024-I/P pinout, 23LCV1024-I/P application, or 23LCV1024-I/P equivalent, this page provides verified electrical specs, package mapping to 8-lead PDIP, confirmed SDI/SPI mode behavior, VBAT switchover threshold (1.6–2.0 V), and real-world timing parameters including 25 ns CS setup and 25 ns output valid delay.
Technical Context
The 23LCV1024-I/P implements a true serial SRAM architecture with dedicated SI/SO pins for standard SPI mode and shared SIO0/SIO1 pins for SDI mode-enabling 2-bit-per-clock transfers when configured via EDIO/RSTIO commands. Its internal 24-bit address counter supports byte, page (32-byte), and sequential access modes, with automatic rollover at 1FFFFh.
It integrates an internal voltage-switching circuit that transitions from VCC to VBAT (pin 7) when supply drops below VTRIP (1.6–2.0 V), preserving RAM contents down to 1.0 V VDR. The device powers on in standby mode and requires CS low-to-high transition to initiate active operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 1 Mbit (128K × 8) organization - supports full memory map addressing up to 0x1FFFF |
| Interface | SPI-compatible with SDI dual-I/O mode - enables faster throughput than standard SPI when master supports dual I/O |
| Max Clock Frequency | 20 MHz - ensures ≤50 ns cycle time for high-speed microcontroller interfacing |
| VCC Range | 2.5 V to 5.5 V - compatible with 3.3 V and 5 V logic systems without level shifting |
| VBAT Support | 1.4 V to 3.6 V with 1.6–2.0 V VTRIP - enables coin-cell backup without external supervisor IC |
| Read Current | 3 mA typical at 5.5 V/20 MHz - defines worst-case power budget during active burst reads |
| Standby Current | 4 µA typical at +85°C - enables multi-year battery-backed retention in low-power monitoring nodes |
Pinout & Package
23LCV1024-I/P is packaged in an 8-lead PDIP (Plastic Dual In-line Package) with 300 mil body width, lead pitch of 0.100", and RoHS-compliant matte tin plating. Pin 3 is NC (No Connect); all other pins match SOIC/TSSOP functional assignments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS (Pin 1) | Chip Select Input | Active-low enable - must be held low for entire SPI/SDI transaction; forces SO into high-Z when high |
| SO/SIO1 (Pin 2) | Serial Output / SDI Data Line 1 | Outputs data in SPI mode; serves as second data line in SDI mode (MSB-first dual-bit transfer) |
| NC (Pin 3) | No Connect | Internally unconnected - must remain floating or tied to GND per design guidelines |
| VSS (Pin 4) | Ground Reference | Primary return path for VCC and VBAT supplies - requires low-impedance PCB connection |
| SI/SIO0 (Pin 5) | Serial Input / SDI Data Line 0 | Accepts instructions/addresses/data in SPI mode; serves as first data line in SDI mode |
| SCK (Pin 6) | Serial Clock Input | Edge-triggered synchronization - latches SI on rising edge, updates SO on falling edge |
| VBAT (Pin 7) | External Backup Supply | Provides retention power when VCC < VTRIP - internal switch isolates VCC and VBAT domains |
| VCC (Pin 8) | Primary Power Supply | Supplies core logic and memory array - must be stable within 2.5–5.5 V during all operations |
Key Features
| Feature | Design Value |
|---|---|
| Zero Write Time | Eliminates write-cycle delays - data is stored immediately upon CS deassertion, no wait states required |
| Unlimited Read/Write Cycles | Enables continuous logging in data acquisition systems without endurance wear-out concerns |
| Page and Sequential Access Modes | Supports efficient 32-byte page writes or full-array streaming - reduces firmware overhead vs. byte-by-byte transfers |
| SDI Dual-Interface Mode | Doubles effective data rate over SPI by transferring two bits per clock - requires EDIO command entry |
| Industrial Temperature Range | -40°C to +85°C operation - validated for use in automotive ECUs, industrial PLCs, and outdoor telemetry units |
Applications
| Industrial Data Logger | Medical Device Configuration Store |
|---|---|
Use Scenario: Continuous sensor sampling with periodic flash-offload; retains last 10 minutes of raw ADC data during brownout. IC Role / Device Role / Timing Role: Primary volatile buffer with seamless VCC→VBAT switchover - acts as deterministic latency-free memory extension for MCU. Use Value: Eliminates need for EEPROM wear-leveling or FRAM cost premium while guaranteeing sub-millisecond write commit and 10+ year coin-cell retention. |
Use Scenario: Storing calibrated sensor offsets, user preferences, and audit logs in portable diagnostic equipment. IC Role / Device Role / Timing Role: Nonvolatile configuration register bank - powered by VBAT during battery-only operation and synchronized via SPI from ARM Cortex-M4. Use Value: Enables instant-on resume after power cycling with zero boot-time initialization delay for critical calibration data. |
| Smart Energy Meter Firmware Cache | Automotive Body Control Module Event Log |
Use Scenario: Caching firmware update fragments and metering registers during OTA upgrade under unstable grid conditions. IC Role / Device Role / Timing Role: High-reliability intermediate storage - accepts burst writes at 20 MHz and maintains integrity during 100 ms VCC dropout. Use Value: Prevents partial-update corruption by ensuring atomic write completion before VCC collapse, using internal VTRIP hysteresis. |
Use Scenario: Recording door lock/unlock events, window position history, and fault codes in BCMs with 12 V battery backup. IC Role / Device Role / Timing Role: Battery-backed event FIFO - uses sequential mode to append timestamped entries without address management overhead. Use Value: Delivers deterministic 1 µs write latency and 4 µA quiescent draw - extends coin-cell life beyond 5 years in always-on vehicle modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 23LC1024-I/P | No VBAT pin or internal switchover circuit - lacks battery backup functionality | Requires external supervisor or capacitor hold-up for short-term retention | Select only if backup is handled externally and cost reduction is primary goal |
| FM24CL16B-G | F-RAM technology - 16 Kbit density, 10¹⁴ write cycles, no write delay, but no SDI mode | Lower density limits large-buffer use; eliminates write endurance concerns but lacks dual-I/O speed boost | Prefer for ultra-high-write-count applications where 1 Mbit capacity is not required |
Compared with 23LCV1024-I/P, the 23LC1024-I/P saves cost but forfeits autonomous VBAT retention, while the FM24CL16B-G offers infinite endurance at lower density and without SDI acceleration - making 23LCV1024-I/P the sole choice for high-speed, high-capacity, self-contained battery-backed serial SRAM.
Availability
23LCV1024-I/P is available at Aetrix Electronics and suitable for industrial data loggers, medical device configuration stores, and smart energy meter firmware caches requiring stable component supply across extended production lifecycles.
Supply support for 23LCV1024-I/P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontrollers, analog components, and memory solutions, headquartered in Chandler, Arizona, with global manufacturing and support infrastructure.
The 23LCV1024 belongs to Microchip's serial SRAM product line, designed specifically for applications demanding fast, reliable, battery-backed volatile memory with SPI compatibility and industrial temperature resilience.
FAQ
What is the VTRIP voltage range for 23LCV1024-I/P, and how does it affect backup switching?
The VTRIP specification for 23LCV1024-I/P is 1.6 V (min) to 2.0 V (max) at 25°C. When VCC falls below this threshold, the internal switch automatically transfers power sourcing from VCC to VBAT (pin 7), preserving SRAM contents without software intervention. This hysteresis prevents oscillation near the trip point and ensures clean, glitch-free retention activation - a key differentiator from discrete supervisor-based solutions.
Does 23LCV1024-I/P support true dual-I/O (SDI) mode, and how is it enabled?
Yes, 23LCV1024-I/P supports SDI mode using pins SIO0 (SI) and SIO1 (SO) to transfer two bits per clock cycle. It is enabled by issuing the EDIO instruction (0x3B) after CS assertion. Once entered, all subsequent operations use dual-I/O until RSTIO (0xFF) resets the interface. SDI mode doubles effective throughput versus standard SPI but requires master-side protocol alignment - confirmed in DS25156A Figures 4-1 through 4-4.
What is the maximum clock frequency supported by 23LCV1024-I/P, and under what conditions is it guaranteed?
The 23LCV1024-I/P guarantees 20 MHz maximum clock frequency across the full industrial temperature range (-40°C to +85°C) and VCC range (2.5 V to 5.5 V). This is validated per AC Characteristic Table 1-2 (Param No. 1, FCLK), with timing margins maintained for all setup/hold requirements including TCSS (25 ns CS setup) and TV (25 ns output valid).
How does the 23LCV1024-I/P handle page boundaries during Page Write mode?
In Page Write mode (MODE[7:6] = 10), the 23LCV1024-I/P auto-increments its internal address pointer for each byte written, but wraps to the start of the same 32-byte page upon reaching the page boundary - not to the next page. This prevents unintended cross-page overwrites and enforces strict 32-byte alignment, simplifying firmware buffer management for fixed-size logging buffers.
Is pin 3 (NC) on the 23LCV1024-I/P PDIP package required to be left floating, or can it be grounded?
Pin 3 on the 23LCV1024-I/P PDIP package is designated NC (No Connect) and must remain unconnected - neither tied to VSS nor pulled high. Microchip's DS25156A-page 12 explicitly states "NC" in the Pin Function Table and cautions against routing or biasing this pin, as it is internally unconnected and grounding it may introduce parasitic coupling or violate package test protocols.
23LCV1024-I/P Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 8-DIP (0.300", 7.62mm)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous
- Memory Size:
- 1Mbit
- Memory Organization:
- 128K x 8
- Memory Interface:
- SPI - Dual I/O
- Clock Frequency:
- 20 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- 8-PDIP
23LCV1024-I/P FAQ
1.How can I place an order for 23LCV1024-I/P through Aetrix?
Please submit a Request for Quotation (RFQ) for 23LCV1024-I/P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 23LCV1024-I/P reliable?
The price and inventory of 23LCV1024-I/P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 23LCV1024-I/P is usually 5 days.
3.What payment methods are accepted for 23LCV1024-I/P?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 23LCV1024-I/P transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 23LCV1024-I/P?
23LCV1024-I/P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 23LCV1024-I/P order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 23LCV1024-I/P?
For technical support, including 23LCV1024-I/P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 23LCV1024-I/P requirements.
6.How does Aetrix verify that 23LCV1024-I/P is sourced from the original manufacturer or authorized distributors?
All 23LCV1024-I/P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 23LCV1024-I/P meets industry standards.
7.What is the process for return or replacement of 23LCV1024-I/P?
All 23LCV1024-I/P units undergo pre-shipment inspection (PSI). If there is an issue with 23LCV1024-I/P, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 23LCV1024-I/P part is unused and in its original packaging.
Return procedure for 23LCV1024-I/P:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
23LCV1024-I/P Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

