Nexperia USA Inc. 2PC4617RM,315

Overview

2PC4617RM from Nexperia is an NPN general purpose transistor in a leadless ultra-small SOT883 package (1.0 × 0.6 × 0.5 mm), rated for 50 V V_CEO, 100 mA DC collector current, and 180–390 h_FE at I_C = 1 mA, V_CE = 6 V. It serves as a compact switching or amplification device in space-constrained portable electronics such as digital cameras and PCMCIA cards.

For engineers reviewing the 2PC4617RM datasheet, 2PC4617RM pinout, 2PC4617RM application, or 2PC4617RM equivalent, key selection criteria include its ultra-small footprint (1.3 × 0.9 mm board area), low V_CE(sat) of ≤200 mV at I_C = 50 mA/I_B = 5 mA, f_T of 100 MHz, thermal resistance of 290 K/W on FR4 with 1 cm² collector pad, and compatibility with automated SMT assembly.

Technical Context

This transistor operates as a silicon NPN bipolar junction device optimized for low-voltage, medium-frequency signal switching and linear amplification. Its SOT883 package enables high-density PCB layouts while maintaining thermal performance comparable to SOT23 via optimized copper pad design.

It features a maximum junction temperature of 150 °C, storage temperature range of −65 to +150 °C, and exhibits low leakage: ICBO ≤ 100 nA at V_CB = 30 V and ≤5 μA at T_j = 150 °C. The transition frequency (f_T) of 100 MHz supports operation up to medium-frequency AC applications.

Key Specifications

Pinout & Package

SOT883 is a leadless ultra-small plastic package measuring 1.0 × 0.6 × 0.5 mm, with three solderable lands on the bottom surface. Board space requirement is 1.3 × 0.9 mm. Mounting requires FR4 PCB with defined copper pad geometry per Nexperia standard footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN general purpose transistor applications.

Compared with BC846BW and MMBT3904LT1G, the 2PC4617RM delivers the smallest board footprint and highest h_FE bin among these three, making it optimal for miniaturized, battery-sensitive designs where voltage stress stays below 50 V and thermal management relies on optimized pad layout.

Availability

2PC4617RM is available at Aetrix Electronics and suitable for digital camera modules, PCMCIA interface power control, and PDA display subsystems requiring stable component supply, long-term manufacturability, and RoHS-compliant packaging.

Supply support for 2PC4617RM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global leader in discrete, logic, and PowerMOS semiconductors, formed in 2017 from the former NXP Standard Products business, with focus on automotive, industrial, computing, consumer, and wearable markets.

The 2PC4617RM belongs to Nexperia's general-purpose transistor portfolio, designed specifically for space-constrained, low-power portable electronics where ultra-small size, predictable gain, and robust SMT reliability are critical.

FAQ

Is the 2PC4617RM pin-compatible with other SOT883 transistors?

Yes - all SOT883-packaged NPN transistors share identical 3-land pinout (1=base, 2=emitter, 3=collector) and mechanical footprint. However, electrical parameters such as h_FE, V_CE(sat), and f_T vary between part numbers, so functional substitution requires verification against circuit requirements.

What is the recommended PCB pad layout for thermal performance?

Nexperia specifies a 1 cm² copper pad connected to pin 3 (collector) on a single-sided FR4 board with 60 μm copper thickness. This layout achieves R_{th j-a} = 290 K/W. Smaller pads increase thermal resistance and require derating of P_tot per the datasheet's ambient temperature curves.

Does the 2PC4617RM support Pb-free reflow soldering?

Yes - the device is qualified for standard Pb-free reflow profiles (JEDEC J-STD-020), including peak temperatures up to 260 °C. The SOT883 package uses matte tin plating over nickel, compatible with both no-clean and water-soluble fluxes used in high-volume SMT lines.

How does the 2PC4617RM's h_FE bin compare to the 2PC4617QM and 2PC4617SM variants?

The 2PC4617RM is the mid-bin variant with h_FE = 180–390 at I_C = 1 mA, V_CE = 6 V. The QM version is low-bin (120–270), and SM is high-bin (270–560). All share identical absolute maximum ratings and package; binning enables precise base drive design without oversizing resistors.