Toshiba Semiconductor and Storage 2SD1223,L1XGQ(O
- Part No.:
- 2SD1223,L1XGQ(O
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Single Bipolar Transistors
- Package:
- -
- Datasheet:
-
2SD1223,L1XGQ(O.pdf
- Description:
- TRANSISTOR NPN DARL PWMOLD
- Quantity:
- Payment:

- Shipping:

Inventory:9,314
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
2SD1223,L1XGQ(O) from Toshiba is a silicon NPN epitaxial Darlington transistor designed for high-gain switching and power amplification. It delivers hFE ≥ 2000 at IC = 1 A, VCE = 2 V; VCE(sat) ≤ 1.5 V at IC = 3 A, IB = 6 mA; and supports VCEO = 80 V, IC = 4 A - enabling robust hammer drive and pulse motor control in industrial actuators.
For engineers reviewing the 2SD1223,L1XGQ(O) datasheet, 2SD1223,L1XGQ(O) pinout, 2SD1223,L1XGQ(O) application, or 2SD1223,L1XGQ(O) equivalent, key selection criteria include DC current gain stability across temperature, saturation voltage under pulsed load conditions, safe operating area (SOA) derating at Tc > 25°C, and complementary pairing with 2SB908 for push-pull output stages.
Technical Context
This Darlington transistor uses Toshiba's PCT (Planar Complementary Transistor) process to achieve high hFE with low base drive requirements. Its internal structure integrates a driver and output transistor with built-in base-emitter resistors (~4.5 kΩ and ~300 Ω), reducing external component count in switching circuits.
It operates in common-emitter configuration with guaranteed V(BR)CEO = 80 V and junction temperature rating up to 150°C. Switching performance is characterized by ton = 0.2 μs and tf = 0.6 μs under IB1 = −IB2 = 6 mA, supporting fast turn-off in pulse motor drivers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO | 80 V - Maximum collector-emitter voltage before breakdown; defines usable rail voltage headroom in switching applications. |
| hFE (min) | 2000 at VCE = 2 V, IC = 1 A - Enables low-base-current drive for high-side loads without additional pre-driver stages. |
| VCE(sat) (max) | 1.5 V at IC = 3 A, IB = 6 mA - Limits conduction loss to ≤4.5 W at full rated current, critical for thermal management in compact designs. |
| IC (max) | 4 A continuous - Supports peak motor stall currents in solenoid and hammer drive systems without secondary protection. |
| PC | 15 W at Tc = 25°C - Requires heatsinking above ambient; SOA curves show pulsed capability up to 3× IC for <1 ms. |
| Tj (max) | 150°C - Specifies maximum junction temperature; derating required above 25°C ambient per PC–Ta curve. |
Pinout & Package
Package: TO-126 (TOSHIBA 2-7J1A, JEITA-compliant, 0.36 g typical weight). Three-terminal through-hole package with collector tab electrically connected to collector pin.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Collector (Tab) | Main current output path, thermally coupled to heatsink | Electrically tied to metal tab; must be isolated from chassis unless circuit ground reference permits. |
| Base | Control input for Darlington pair | Internal resistive bias network (~4.5 kΩ to driver emitter); accepts TTL/CMOS-compatible logic-level drive. |
| Emitter | Common return node for collector and base paths | Internally connected to driver transistor emitter; forms low-impedance return for load current. |
Key Features
| Feature | Design Value |
|---|---|
| High DC current gain | hFE ≥ 2000 at IC = 1 A enables direct microcontroller GPIO drive without buffer transistors. |
| Low saturation voltage | VCE(sat) ≤ 1.5 V at 3 A reduces power dissipation and improves efficiency in battery-powered pulse motors. |
| Complementary pairing | Matched as NPN counterpart to 2SB908 PNP Darlington for symmetrical Class B amplifier or H-bridge output stages. |
| Thermal robustness | Junction temperature rating of 150°C supports operation in enclosed industrial enclosures with limited airflow. |
Applications
| Hammer Drive Control | Pulse Motor Driver |
|---|---|
Use Scenario: Electromechanical hammer actuation in vending machines and industrial stamping tools requiring rapid on/off cycles with high peak force. IC Role / Device Role / Timing Role: Main switching element controlling coil current; driven by PWM signal with fast fall time (tf = 0.6 μs) to minimize residual magnetic hold. Use Value: Low VCE(sat) minimizes coil heating during repeated 100-ms pulses; high hFE allows direct MCU GPIO control without level-shifting. | Use Scenario: Open-loop stepping control in printer head positioning and CNC tool changers where precise angular displacement is achieved via current pulses. IC Role / Device Role / Timing Role: High-current switch delivering 3 A pulses to motor phase windings; operated in common-emitter mode with freewheeling diode clamp. Use Value: Fast switching (ton = 0.2 μs) ensures accurate pulse width timing; SOA compliance supports repetitive 10-ms pulses at full current. |
| Power Amplifier Stage | Relay/Solenoid Driver |
Use Scenario: Linear audio output stage in low-fidelity intercom systems or alarm tone generators requiring 2–3 W undistorted output into 8 Ω loads. IC Role / Device Role / Timing Role: Class AB output transistor biased with fixed emitter resistors; handles both positive half-cycle conduction and heat dissipation. Use Value: High hFE stabilizes quiescent current against β variation; VCEO = 80 V accommodates 24 V rail with margin for inductive kickback. | Use Scenario: Driving 24 VDC industrial relays and latching solenoids in PLC I/O modules where load inductance causes high-voltage flyback spikes. IC Role / Device Role / Timing Role: Single-ended switch interfacing microcontroller outputs to inductive loads; collector connected to relay coil, emitter grounded. Use Value: VCEO = 80 V withstands >50 V flyback transients; integrated base resistors simplify PCB layout and reduce component count. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Darlington transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 2SD1802 | VCEO = 100 V, hFE ≥ 1000 (IC = 1 A), higher PC = 20 W | Better voltage margin for 48 V systems; lower gain requires stronger base drive | Preferred when operating above 36 V supply or needing extended SOA at elevated Tc. |
| MJD122 | TO-252 surface-mount package, VCEO = 100 V, hFE ≥ 1000, VCE(sat) ≤ 1.5 V | SMT-compatible; lacks integrated base resistors; requires external bias network | Chosen for automated assembly and space-constrained PCBs where discrete base bias is acceptable. |
Compared with 2SD1223,L1XGQ(O), 2SD1802 offers higher voltage tolerance but reduced current gain, while MJD122 provides SMT compatibility at the cost of added external components - both require redesign of base drive and thermal layout, and neither is pin-compatible.
Availability
2SD1223,L1XGQ(O) is available at Aetrix Electronics and suitable for hammer drive, pulse motor drive, and power amplifier applications requiring stable component supply, long-lifecycle support, and traceable RoHS-compliant sourcing.
Supply support for 2SD1223,L1XGQ(O) includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and logic ICs for industrial, automotive, and consumer applications.
The 2SD1223,L1XGQ(O) belongs to Toshiba's legacy PCT-process Darlington transistor family, engineered specifically for high-reliability electromechanical switching in factory automation and office equipment.
FAQ
What is the maximum continuous collector current for the 2SD1223,L1XGQ(O)?
The 2SD1223,L1XGQ(O) supports a maximum continuous collector current of 4 A at case temperature Tc = 25°C. Derating is required above this temperature per the PC–Ta curve; at Tc = 75°C, allowable IC drops to approximately 2.5 A. This rating applies under proper heatsinking conditions using a ceramic substrate (50 × 50 × 0.8 mm) or infinite heat sink. The 2SD1223,L1XGQ(O) also supports short-duration pulsed currents up to 12 A for ≤1 ms.
Does the 2SD1223,L1XGQ(O) have built-in base resistors?
Yes, the 2SD1223,L1XGQ(O) integrates two internal base-emitter resistors: ≈4.5 kΩ between base and driver emitter, and ≈300 Ω between driver emitter and output emitter. These resistors enable simplified TTL/CMOS-level drive and improve turn-off speed by actively discharging stored base charge. This eliminates the need for external base pull-down resistors in most switching configurations, distinguishing the 2SD1223,L1XGQ(O) from standard bipolar transistors.
Is the 2SD1223,L1XGQ(O) RoHS compliant?
The 2SD1223,L1XGQ(O) is RoHS compliant per EU Directive 2011/65/EU. Marking includes [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]] depending on lot; underlined lot numbers indicate RoHS-compliant production. Toshiba confirms environmental compliance for this part number, and Aetrix Electronics supplies only RoHS-compliant units with full material declarations available upon request for the 2SD1223,L1XGQ(O).
What is the safe operating area (SOA) limitation for the 2SD1223,L1XGQ(O) at 100°C case temperature?
At Tc = 100°C, the 2SD1223,L1XGQ(O)'s SOA is significantly reduced: maximum continuous IC drops to ~1.2 A at VCE = 10 V, and pulsed capability is limited to ~3.5 A for 10 ms. The SOA boundary follows linear derating from the 25°C curve, and operation beyond these limits risks secondary breakdown. Designers must consult Figure 4 (Safe Operating Area) in the official Toshiba datasheet to validate operating points for the 2SD1223,L1XGQ(O) under thermal stress.
How does the 2SD1223,L1XGQ(O) compare to its complementary PNP counterpart 2SB908?
The 2SD1223,L1XGQ(O) and 2SB908 form a matched Darlington pair: same VCEO (80 V), comparable hFE (2000 vs. 1500 min), and symmetric VCE(sat) (1.5 V vs. 1.6 V). They share identical TO-126 packaging and thermal characteristics, enabling balanced push-pull amplifier or H-bridge designs. The 2SD1223,L1XGQ(O) serves as the high-side switch in such topologies, while 2SB908 handles low-side conduction - their coordinated use minimizes crossover distortion and thermal mismatch in the 2SD1223,L1XGQ(O)/2SB908 pair.
2SD1223,L1XGQ(O Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- *
- Package/Case:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- -
- Current - Collector (Ic) (Max):
- -
- Voltage - Collector Emitter Breakdown (Max):
- -
- Vce Saturation (Max) @ Ib, Ic:
- -
- Current - Collector Cutoff (Max):
- -
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- -
- Power - Max:
- -
- Frequency - Transition:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
2SD1223,L1XGQ(O FAQ
1.How can I place an order for 2SD1223,L1XGQ(O through Aetrix?
Please submit a Request for Quotation (RFQ) for 2SD1223,L1XGQ(O on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 2SD1223,L1XGQ(O reliable?
The price and inventory of 2SD1223,L1XGQ(O are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 2SD1223,L1XGQ(O is usually 5 days.
3.What payment methods are accepted for 2SD1223,L1XGQ(O?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 2SD1223,L1XGQ(O transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 2SD1223,L1XGQ(O?
2SD1223,L1XGQ(O orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 2SD1223,L1XGQ(O order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 2SD1223,L1XGQ(O?
For technical support, including 2SD1223,L1XGQ(O datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 2SD1223,L1XGQ(O requirements.
6.How does Aetrix verify that 2SD1223,L1XGQ(O is sourced from the original manufacturer or authorized distributors?
All 2SD1223,L1XGQ(O products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 2SD1223,L1XGQ(O meets industry standards.
7.What is the process for return or replacement of 2SD1223,L1XGQ(O?
All 2SD1223,L1XGQ(O units undergo pre-shipment inspection (PSI). If there is an issue with 2SD1223,L1XGQ(O, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 2SD1223,L1XGQ(O part is unused and in its original packaging.
Return procedure for 2SD1223,L1XGQ(O:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
2SD1223,L1XGQ(O Tags

-
MMBT3906LT1G
onsemi

-
MMBT3904-7-F
Diodes Incorporated

-
MMBT3904LT1G
onsemi

-
MMBT3906-7-F
Diodes Incorporated

-
MMBT3904-TP
Micro Commercial Co

-
MMBT2222A-7-F
Diodes Incorporated

-
BC846BLT1G
onsemi

-
BC847B,215
Nexperia USA Inc.

-
SMMBT3904LT1G
onsemi

-
MMBT2222A-TP
Micro Commercial Co

-
MMBTA06LT1G
onsemi

-
MMBT2222ALT1G
onsemi
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

