Texas Instruments 3530ECUSAGRM

Overview

3530ECUSAGRM from Texas Instruments is a 423-ball s-PBGA packaged OMAP3530 applications processor featuring a 720-MHz ARM Cortex-A8 core, 520-MHz TMS320C64x+ DSP, and PowerVR SGX graphics accelerator - enabling high-resolution video playback, camera image processing, and Linux/Android-based UI rendering in portable media players and navigation devices.

For engineers reviewing the 3530ECUSAGRM datasheet, 3530ECUSAGRM pinout, 3530ECUSAGRM application, or 3530ECUSAGRM equivalent, this page delivers verified package mapping (CUS suffix), confirmed 720-MHz MPU clock, validated 520-MHz DSP frequency, integrated IVA2.2 subsystem, and functional distinctions versus OMAP3525 - all critical for thermal layout, memory interface design, and OS porting decisions.

Technical Context

The 3530ECUSAGRM implements a heterogeneous dual-core architecture: the ARM Cortex-A8 executes HLOS tasks (Linux, Android) with NEON SIMD acceleration, while the C64x+ DSP offloads real-time imaging, audio, and video codecs via the IVA2.2 subsystem. It integrates dedicated hardware accelerators for camera ISP, display composition, and video scaling.

Unlike the CBB/CBC variants, the CUS package omits POP interface support, disables HSUSB3_TLL and MM_FSUSB3, removes GPMC chip-selects gpmc_ncs1/ncs2 and wait pins gpmc_wait1/wait2, and restricts McBSP3/McBSP4 signal muxing - directly impacting external memory expansion and high-speed peripheral connectivity options.

Key Specifications

Pinout & Package

3530ECUSAGRM uses a 423-ball s-PBGA package (CUS suffix) with 0.65-mm ball pitch on top and 0.5-mm on bottom. The package excludes POP interface pads and has reduced GPMC signal availability versus CBB/CBC variants.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Compared with OMAP3525ECUSAGRM and AM3517BZCNA3, the 3530ECUSAGRM uniquely combines full IVA2.2 imaging acceleration, PowerVR SGX graphics, and CUS-package compatibility - making it the only option among the three capable of simultaneous HD video encode, 3D UI rendering, and industrial-grade thermal operation without external co-processors.

Availability

3530ECUSAGRM is available at Aetrix Electronics and suitable for portable media players, automotive navigation systems, and digital video cameras requiring stable component supply, long-term lifecycle support, and qualified industrial-temperature-grade silicon.

Supply support for 3530ECUSAGRM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in high-performance mobile processors and power-efficient system-on-chip solutions.

The OMAP3530 product line was engineered for multimedia-rich portable devices demanding integrated video, imaging, and graphics acceleration - targeting Android/Linux-based consumer electronics where computational density and thermal efficiency are critical.

FAQ

What is the maximum operating frequency of the ARM Cortex-A8 core in the 3530ECUSAGRM?

The 3530ECUSAGRM supports an ARM Cortex-A8 core clock speed of up to 720 MHz under recommended operating conditions. This frequency is validated across commercial and extended temperature grades and enables real-time execution of Android frameworks and complex UI rendering stacks. The 3530ECUSAGRM achieves this performance using adaptive voltage scaling managed by SmartReflex technology to maintain stability and thermal compliance.

Does the 3530ECUSAGRM include a PowerVR SGX graphics accelerator?

Yes, the 3530ECUSAGRM includes the PowerVR SGX graphics accelerator, delivering up to 10 MPoly/sec performance and supporting OpenGL ES 1.1 and 2.0 APIs. This distinguishes it from the OMAP3525 variant and enables hardware-accelerated 3D UIs, gaming, and video compositing. The 3530ECUSAGRM's SGX block is fully integrated and shares L2 cache with the MPU subsystem for low-latency texture access.

How many general-purpose I/O pins does the 3530ECUSAGRM provide?

The 3530ECUSAGRM supports up to 188 general-purpose I/O pins, though pin multiplexing limits simultaneous availability. All GPIOs are shared with peripheral functions (e.g., UART, McBSP, McSPI), requiring careful pad configuration in hardware design. The CUS package retains full GPIO count versus CBB/CBC variants, unlike some other OMAP3 family members that reduce GPIO availability in smaller packages.

What memory interfaces are supported by the 3530ECUSAGRM?

The 3530ECUSAGRM supports two primary memory interfaces: the SDRAM Controller (SDRC) for LPDDR/SDRAM and the General Purpose Memory Controller (GPMC) for NAND/NOR flash, SRAM, and FPGA glue logic. In the CUS package, eight GPMC chip-selects are available (ncs0, ncs3–ncs7), but ncs1 and ncs2 are omitted - a key constraint for multi-chip memory designs.

Is the 3530ECUSAGRM compatible with Android operating system?

Yes, the 3530ECUSAGRM is explicitly supported by Android, as documented in TI's SPRS507H datasheet revision history. It provides the necessary hardware blocks - including ARM Cortex-A8, NEON SIMD, PowerVR SGX, and IVA2.2 imaging accelerators - to run Android 2.x through 4.x versions with optimized BSPs. Android support was added to the official documentation in the October 2013 revision, confirming production readiness for mobile OS deployment.