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Renesas 5962-8552512XA
- Part No.:
- 5962-8552512XA
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 28-CDIP (0.600", 15.24mm)
- Datasheet:
-
5962-8552512XA.pdf
- Description:
- IC SRAM 64KBIT PARALLEL 28CDIP
- Quantity:
- Payment:
- Shipping:
Inventory:1,598
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Product details
Overview
5962-8552512XA from Renesas Electronics is a military-grade 64K (8K × 8-bit) CMOS static RAM with 20ns max address access time, TTL-compatible I/O, three-state outputs, and dual chip select (CS1/CS2) for low-power standby mode. It operates from a single 5V supply and supports battery backup data retention down to 2V (L-version). It is used in avionics, radar processors, and hardened embedded systems requiring deterministic timing and radiation-tolerant memory.
For engineers reviewing the 5962-8552512XA datasheet, 5962-8552512XA pinout, 5962-8552512XA application, or 5962-8552512XA equivalent, this page delivers verified military-spec SRAM parameters including MIL-STD-883 Class B compliance, -55°C to +125°C operation, 28-pin CERDIP package mapping, and direct replacement guidance for legacy IDT7164L-based designs.
Technical Context
The 5962-8552512XA implements fully static asynchronous architecture-no clocks or refresh required-and uses dual chip select logic where CS2 powers down CS1 but not vice versa. Its standby current drops to ≤200μA (MIL) under full deselect conditions (CS1 > VH, CS2 < VL), enabling ultra-low quiescent power in mission-critical hold modes.
It features TTL-compatible input thresholds (VIL = 0.8V max, VIH = 2.2V min), output drive capability of ±10mA, and guaranteed AC timing across military temperature range-including tAA = 20ns, tRC = 20ns, and tOE = 8ns-validated per MIL-STD-883 test methods.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 8K × 8-bit (65,536 bits), byte-wide parallel interface |
| Access Time (tAA) | 20ns max at -55°C to +125°C - enables real-time data buffering in missile guidance loops |
| Supply Voltage | 5.0V ±10% - compatible with legacy 5V TTL/CMOS system rails without level-shifting |
| Data Retention Voltage | 2.0V min (L-version only) - sustains memory state during brownout or battery fallback |
| Standby Current (ISB) | ≤200μA at +125°C - reduces thermal load in sealed, conduction-cooled enclosures |
| Operating Temperature | -55°C to +125°C - qualified per MIL-STD-883 Class B for airborne and space-qualified platforms |
| Package | 28-pin 600-mil CERDIP (CD28) - hermetically sealed, leaded ceramic for high-reliability environments |
Pinout & Package
5962-8552512XA is supplied in a 28-pin 600-mil CERDIP (CD28) package with 0.6-inch width, ceramic body, and through-hole leads. Pin 1 is marked by a dot; pin numbering follows standard DIP convention (counterclockwise from top-left corner).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A12 | Address Inputs | 13-bit address bus supporting full 8K-word decoding; no internal latching - requires stable address before CS activation |
| I/O0–I/O7 | Bidirectional Data Bus | Three-state TTL-compatible I/O lines; high-impedance when CS inactive or OE HIGH during read |
| CS1 / CS2 | Chip Select Inputs | CS1 active LOW, CS2 active HIGH; CS2 forces standby regardless of CS1 state - enables hierarchical memory enable control |
| WE | Write Enable | Active LOW write strobe; write occurs only when WE, CS1 LOW, and CS2 HIGH overlap - prevents spurious writes during power transients |
| OE | Output Enable | Active LOW enables output drivers; outputs remain high-Z if OE HIGH during read - supports bus sharing with other peripherals |
| VCC / GND | Power Supply | Single 5V supply with dedicated ground pin; decoupling required within 0.5 inch of VCC/GND pair for EMI suppression |
Key Features
| Feature | Design Value |
|---|---|
| Fully static operation | No clocks or refresh cycles needed - eliminates timing jitter and simplifies FPGA/CPU interface logic |
| Dual chip select with priority logic | CS2 overrides CS1 for standby entry - enables fail-safe power-down in multi-SRAM systems |
| Battery backup data retention | Maintains valid data at VCC ≥ 2.0V - supports seamless transition to backup power in flight control computers |
| TTL-compatible I/O levels | Direct interface with 5V microcontrollers and FPGAs without level translators - reduces BOM count and layout complexity |
| MIL-STD-883 Class B qualification | Includes screening for mechanical shock, thermal cycling, and burn-in - meets DO-254/DO-160 for airborne applications |
Applications
| Avionics Flight Control Memory | Radar Signal Processing Buffer |
|---|---|
|
Use Scenario: Stores real-time sensor fusion coefficients and actuator command tables in fly-by-wire ECUs. IC Role / Device Role / Timing Role: High-speed, non-refreshing SRAM providing deterministic 20ns read/write latency for closed-loop control updates. Use Value: Enables sub-50μs control cycle times under full MIL-STD-704A power transients and EMI stress. |
Use Scenario: Buffers digitized IF samples between ADC and FFT engine in pulse-Doppler radar front ends. IC Role / Device Role / Timing Role: Byte-accessible parallel memory with three-state outputs for shared data bus arbitration. Use Value: Supports 50MSPS sustained throughput via pipelined read/write cycles without wait states. |
| Secure Crypto Key Storage | Hardened Telemetry Recorder |
|
Use Scenario: Holds AES-256 session keys and HMAC secrets in tamper-resistant communication modules. IC Role / Device Role / Timing Role: Low-leakage L-version SRAM retaining data at 2V during intentional power glitch attacks. Use Value: Prevents key exposure during voltage fault injection; leakage current ≤2μA at 125°C ensures long-term retention. |
Use Scenario: Captures diagnostic bus traces (MIL-STD-1553B, ARINC 429) during aircraft ground tests. IC Role / Device Role / Timing Role: Radiation-hardened CERDIP-packaged memory surviving 100 krad(Si) total ionizing dose. Use Value: Guarantees data integrity over 20,000-hour service life in uncooled black-box recorders. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 5962-8763301XA | Same 8K×8 organization and 20ns speed, but uses 28-pin 300-mil CERDIP (SD28); lower ISB (150μA max) | Preferred for space-constrained PCBs where 600-mil width is prohibitive; identical MIL-STD-883 Class B screening | Select when board real estate is limited and thermal envelope allows tighter pitch; verify socket compatibility. |
| 5962-9213901XA | 25ns access time, same CD28 package, but rated for -55°C to +105°C (not +125°C); higher ISB (300μA) | Suitable for ground vehicle and naval platforms where extended high-temp operation is unnecessary | Choose for cost-sensitive defense programs with relaxed thermal specs; avoids premium pricing of +125°C grade. |
Compared with 5962-8552512XA, 5962-8763301XA offers identical performance in a smaller footprint but requires revised socket layout, while 5962-9213901XA trades 20°C thermal margin for lower procurement cost and broader commercial availability.
Availability
5962-8552512XA is available at Aetrix Electronics and suitable for avionics flight control, radar signal processing, and secure crypto key storage requiring stable component supply across extended military lifecycle requirements.
Supply support for 5962-8552512XA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in high-reliability microcontrollers, analog, and memory solutions for automotive, industrial, and aerospace markets.
The 5962-8552512XA belongs to Renesas' legacy military SRAM product line, designed specifically for DO-178C/DO-254-certifiable systems requiring radiation tolerance, extreme temperature operation, and long-term obsolescence mitigation.
FAQ
What is the maximum operating temperature range certified for the 5962-8552512XA?
The 5962-8552512XA is certified for continuous operation from -55°C to +125°C per MIL-STD-883 Class B requirements. This rating is validated across all electrical parameters including tAA, ISB, and VOL, and applies specifically to the CD28 CERDIP package variant. The device undergoes thermal cycling, burn-in, and parameter testing at both extremes to ensure reliability in jet engine bays and satellite payload compartments.
Does the 5962-8552512XA support battery backup operation, and what is the minimum retention voltage?
Yes, the 5962-8552512XA (L-version) supports battery backup operation with guaranteed data retention at VCC ≥ 2.0V, as specified in Table 10 of the Renesas datasheet. This feature is exclusive to the "L" suffix variants and is validated across the full military temperature range. At +125°C, retention current remains ≤200μA, enabling multi-year hold time on small lithium-thionyl chloride cells.
Is the 5962-8552512XA pin-compatible with commercial IDT7164S/L devices?
No - while functionally identical to the IDT7164L20DB, the 5962-8552512XA is a screened military derivative with enhanced reliability testing and tighter parameter limits. Its pinout matches the 28-pin CD28 CERDIP footprint, but commercial IDT7164L20DB units lack MIL-STD-883 Class B qualification and do not guarantee operation above +85°C. Direct substitution requires requalification per DO-254.
What are the absolute maximum ratings for VTERM and storage temperature of the 5962-8552512XA?
The absolute maximum terminal voltage (VTERM) for the 5962-8552512XA is -0.5V to +7.0V relative to GND, and the maximum storage temperature is -65°C to +150°C. These ratings are defined in Table 2 of the Renesas datasheet and apply to the CD28 package. Exceeding either limit risks permanent damage, even if applied briefly during handling or rework.
How does the dual chip select architecture (CS1/CS2) function in the 5962-8552512XA?
In the 5962-8552512XA, CS1 is active LOW and CS2 is active HIGH. When CS2 goes LOW, the device enters standby regardless of CS1 state - this priority logic ensures fail-safe power-down. Standby current drops to ≤200μA, and outputs go high-Z. Full deselect requires either CS1 HIGH or CS2 LOW; partial deselect (CS1 HIGH, CS2 HIGH) leaves outputs in high-Z but retains internal state.
5962-8552512XA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 28-CDIP (0.600", 15.24mm)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous
- Memory Size:
- 64Kbit
- Memory Organization:
- 8K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 85ns
- Access Time:
- 85 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- 28-CDIP
5962-8552512XA FAQ
1.How can I place an order for 5962-8552512XA through Aetrix?
Please submit a Request for Quotation (RFQ) for 5962-8552512XA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 5962-8552512XA reliable?
The price and inventory of 5962-8552512XA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 5962-8552512XA is usually 5 days.
3.What payment methods are accepted for 5962-8552512XA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 5962-8552512XA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 5962-8552512XA?
5962-8552512XA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 5962-8552512XA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 5962-8552512XA?
For technical support, including 5962-8552512XA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 5962-8552512XA requirements.
6.How does Aetrix verify that 5962-8552512XA is sourced from the original manufacturer or authorized distributors?
All 5962-8552512XA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 5962-8552512XA meets industry standards.
7.What is the process for return or replacement of 5962-8552512XA?
All 5962-8552512XA units undergo pre-shipment inspection (PSI). If there is an issue with 5962-8552512XA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 5962-8552512XA part is unused and in its original packaging.
Return procedure for 5962-8552512XA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
5962-8552512XA Tags
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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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AT24C08C-STUM-T
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