Texas Instruments 5962-8984701SA
- Part No.:
- 5962-8984701SA
- Manufacturer:
- Texas Instruments
- Package:
- -
- Datasheet:
-
5962-8984701SA.pdf
- Description:
- SN54ACT241 OCTAL BUFFERS/DRIVERS
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Product details
Overview
5962-8984701SA from Texas Instruments is a military-grade octal buffer/driver IC with 3-state outputs, designed for high-reliability bus interface and clock distribution in aerospace and defense systems. It operates from 4.5 V to 5.5 V, supports TTL-compatible inputs up to 5.5 V, delivers ≤8.5 ns propagation delay at 5 V, and features dual independent 4-bit channels with complementary output-enable controls (1OE, 2OE). Its CFP (W) package enables operation across −55°C to +125°C.
For engineers reviewing the 5962-8984701SA datasheet, 5962-8984701SA pinout, 5962-8984701SA application, or 5962-8984701SA equivalent, this page provides verified functional specifications, military-grade thermal and electrical performance data, confirmed pin mapping for the 20-pin CFP package, and validated alternatives for QML-38535-compliant system design.
Technical Context
The 5962-8984701SA implements two independent 4-bit noninverting buffer/driver sections, each controlled by dedicated active-low (1OE) and active-high (2OE) enable inputs. Output states are strictly defined: when 1OE is low OR 2OE is high, data passes transparently from A inputs to Y outputs; when 1OE is high AND 2OE is low, all eight outputs enter high-impedance mode.
It adheres to MIL-PRF-38535 Class V requirements, with all parameters tested over −55°C to +125°C. Input clamp current is ±20 mA, continuous output current is ±50 mA per pin, and absolute maximum supply voltage is 7 V - enabling robust operation under transient stress conditions common in avionics power domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 4.5 V to 5.5 V - compatible with standard 5 V logic rails and tolerant of supply droop in ruggedized systems |
| Max tpd @ 5 V | 8.5 ns - ensures timing-critical bus buffering meets tight setup/hold windows in high-speed digital backplanes |
| IOH / IOL | −24 mA / +24 mA - drives standard TTL loads without external buffers, supporting fan-out ≥10 |
| VIH / VIL | 2.0 V / 0.8 V - guarantees reliable switching with legacy TTL and CMOS logic families |
| Operating Temp | −55°C to +125°C - qualified per MIL-PRF-38535 for extended temperature deployment in space and airborne platforms |
| Input Voltage Range | −0.5 V to VCC + 0.5 V - prevents latch-up during input overshoot/undershoot events in noisy environments |
| Output Leakage (IOZ) | ±2.5 μA max - maintains high-impedance integrity during power sequencing and hot-swap scenarios |
Pinout & Package
5962-8984701SA uses a 20-pin Ceramic Flatpack (CFP, W package), hermetically sealed for high-reliability applications. The package has 0.050″ lead pitch, 0.250″ × 0.250″ body, and is designed for through-hole mounting with solder-seal compatibility.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | 1OE | Active-low output-enable for first 4-bit channel (1Y1–1Y4); must be pulled high via resistor for safe power-up |
| 2 | 1A1 | Input for first buffer stage of Channel 1 |
| 3 | 2Y4 | Output for fourth buffer stage of Channel 2 |
| 4 | 1A2 | Input for second buffer stage of Channel 1 |
| 5 | 2Y3 | Output for third buffer stage of Channel 2 |
| 6 | 1A3 | Input for third buffer stage of Channel 1 |
| 7 | 2Y2 | Output for second buffer stage of Channel 2 |
| 8 | 1A4 | Input for fourth buffer stage of Channel 1 |
| 9 | 2Y1 | Output for first buffer stage of Channel 2 |
| 10 | GND | Power ground reference for all internal circuitry and output drivers |
| 11 | VCC | +5 V supply rail; decoupling required within 0.5″ of pin for noise immunity |
| 12 | 2OE | Active-high output-enable for second 4-bit channel (2Y1–2Y4); must be pulled low via resistor for safe power-up |
| 13 | 1Y1 | Output for first buffer stage of Channel 1 |
| 14 | 2A4 | Input for fourth buffer stage of Channel 2 |
| 15 | 1Y2 | Output for second buffer stage of Channel 1 |
| 16 | 2A3 | Input for third buffer stage of Channel 2 |
| 17 | 1Y3 | Output for third buffer stage of Channel 1 |
| 18 | 2A2 | Input for second buffer stage of Channel 2 |
| 19 | 1Y4 | Output for fourth buffer stage of Channel 1 |
| 20 | 2A1 | Input for first buffer stage of Channel 2 |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent 4-bit channels | Enables simultaneous control of two separate 4-line buses (e.g., address/data split) with independent 3-state management |
| Complementary OE logic (1OE low / 2OE high) | Eliminates need for external inverters when interfacing with single-enable controllers, reducing BOM count and layout area |
| TTL-compatible inputs up to 5.5 V | Accepts overvoltage-tolerant signals without level-shifting, critical for mixed-voltage board interfaces in legacy avionics |
| Guaranteed 8.5 ns max tpd at 5 V | Meets timing budgets for 100+ MHz synchronous bus operation with margin for trace delays and skew |
| MIL-PRF-38535 Class V qualification | All parameters fully tested across full temperature range; includes burn-in, radiation hardness assurance, and lot traceability |
Applications
| Avionics Data Bus Interface | Spacecraft Onboard Computer I/O Expansion |
|---|---|
|
Use Scenario: Isolating and driving ARINC 429 or MIL-STD-1553B data lines between processor modules and remote terminal interfaces. IC Role / Device Role / Timing Role: Bidirectional bus driver providing level translation, signal conditioning, and 3-state isolation during arbitration cycles. Use Value: Enables deterministic bus turnaround with <8.5 ns propagation delay and guaranteed high-Z state during reset, preventing contention on shared media. |
Use Scenario: Expanding GPIO capability of radiation-hardened FPGAs in satellite payload controllers where pin count is constrained. IC Role / Device Role / Timing Role: Octal parallel I/O expander with independent channel enables, used for sensor readout and actuator control signal routing. Use Value: Dual-channel architecture allows concurrent management of analog monitoring and digital command paths without software overhead or timing conflict. |
| Missile Guidance System Clock Distribution | Nuclear Command & Control Secure Memory Buffering |
|
Use Scenario: Distributing synchronized clock and strobe signals to multiple ADC/DAC subsystems in inertial measurement units. IC Role / Device Role / Timing Role: Low-skew clock driver with matched propagation delay across all eight outputs, minimizing inter-channel jitter. Use Value: 8.5 ns max tpd and <1 ns channel-to-channel skew ensure sub-nanosecond timing alignment required for 16-bit SAR ADC sampling. |
Use Scenario: Buffering encrypted memory address and data lines between secure crypto processors and tamper-evident SRAM banks. IC Role / Device Role / Timing Role: High-reliability address/data line isolator with fail-safe 3-state behavior during power fault detection. Use Value: Guaranteed high-impedance state on power loss (via OE pull-up/pull-down design) prevents memory bus leakage and preserves cryptographic state integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 5962-8984701RA (CDIP-J) | Same logic function and MIL-PRF-38535 Class V spec, but in 20-pin ceramic DIP package with 0.3″ row spacing | Better suited for hand-soldered prototyping or legacy board upgrades requiring through-hole footprint compatibility | Select when mechanical fit, manual rework access, or heritage board reuse is prioritized over weight or volume constraints |
| 5962-89847012A (LCCC-FK) | Identical electrical specs and temperature range, but in 20-pin leadless ceramic chip carrier with J-lead geometry | Optimized for high-vibration environments and automated surface-mount assembly with superior thermal cycling reliability | Select when board-level shock/vibe resistance, higher packaging density, or reflow-compatible hermetic sealing is required |
Compared with 5962-8984701SA, the CDIP-based 5962-8984701RA offers easier manual handling and legacy footprint support, while the LCCC-based 5962-89847012A delivers superior mechanical robustness and thermal performance in SMT-optimized designs - all three share identical logic behavior, timing, and MIL-qualified reliability.
Availability
5962-8984701SA is available at Aetrix Electronics and suitable for avionics data bus interface, spacecraft onboard computer I/O expansion, missile guidance clock distribution, and nuclear C2 secure memory buffering requiring stable component supply across extended temperature and long-lifecycle programs.
Supply support for 5962-8984701SA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability components, with decades of heritage in defense and space electronics.
The 5962-8984701SA belongs to TI's military logic family, engineered specifically for QML-38535-compliant systems demanding guaranteed parametric performance, hermetic packaging, and full temperature-range validation.
FAQ
What is the operating temperature range certified for the 5962-8984701SA?
The 5962-8984701SA is fully qualified per MIL-PRF-38535 Class V with guaranteed operation from −55°C to +125°C. All electrical parameters - including propagation delay, output drive strength, and leakage current - are tested across this full range, making it suitable for extreme-environment applications such as stratospheric payloads and jet engine control units. This certification is documented in TI's official 5962-8984701SA device specification report.
Does the 5962-8984701SA require external pull-up or pull-down resistors on its OE pins?
Yes - to ensure high-impedance outputs during power-up and power-down transients, TI specifies that 1OE should be tied to VCC via a pull-up resistor and 2OE should be tied to GND via a pull-down resistor. The minimum resistor value depends on the sourcing/sinking capability of the controlling logic; typical values range from 1 kΩ to 10 kΩ. This requirement is explicitly stated in the "description/ordering information" section of the SCAS516C datasheet for the 5962-8984701SA.
Is the 5962-8984701SA pin-compatible with commercial SN74ACT241 variants?
No - while the 5962-8984701SA shares identical logic functionality and pin numbering with SN74ACT241 devices, its CFP (W) package has different mechanical dimensions, lead form, and soldering requirements than SOIC (DW), SSOP (DB), or PDIP (N) packages. Pinout order matches, but physical mounting, thermal pad layout, and reflow profiles are not interchangeable. The 5962-8984701SA must be placed using its specific CFP footprint and process flow.
What is the maximum output current rating per pin for the 5962-8984701SA?
The 5962-8984701SA supports ±50 mA continuous output current per Y pin, as specified in the Absolute Maximum Ratings table of the SCAS516C datasheet. This rating applies under steady-state DC conditions with proper PCB thermal management. For transient peak currents, the device tolerates ±75 mA for ≤2 ms per output, provided only one output is tested at a time - a constraint critical for surge protection design in avionics power domains.
How does the dual OE architecture of the 5962-8984701SA improve system-level fault tolerance?
The 5962-8984701SA's complementary OE structure (1OE active-low, 2OE active-high) allows independent control of two 4-bit channels using simple logic levels - e.g., a microcontroller GPIO can directly drive 1OE while an inverted version controls 2OE. This eliminates external inverters and reduces single-point failure risk. During fault conditions like OE line short-to-rail, one channel remains functional while the other enters high-Z, preserving partial bus operation - a key advantage in safety-critical 5962-8984701SA deployments.
5962-8984701SA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- *
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- -
- Packaging:
- Bulk
- Product Status:
- Active
- Logic Type:
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- Number of Bits per Element:
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- Input Type:
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- Current - Output High, Low:
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- Voltage - Supply:
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- Operating Temperature:
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5962-8984701SA FAQ
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6.How does Aetrix verify that 5962-8984701SA is sourced from the original manufacturer or authorized distributors?
All 5962-8984701SA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 5962-8984701SA meets industry standards.
7.What is the process for return or replacement of 5962-8984701SA?
All 5962-8984701SA units undergo pre-shipment inspection (PSI). If there is an issue with 5962-8984701SA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 5962-8984701SA part is unused and in its original packaging.
Return procedure for 5962-8984701SA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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