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Texas Instruments 5962-9062501MRA
- Part No.:
- 5962-9062501MRA
- Manufacturer:
- Texas Instruments
- Package:
- -
- Datasheet:
-
5962-9062501MRA.pdf
- Description:
- SN54BCT244 OCTAL BUFFERS/DRIVERS
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Inventory:3,299
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Product details
Overview
5962-9062501MRA from Texas Instruments is a military-grade octal noninverting 3-state buffer/line driver IC, designed for memory address and bus driving in high-reliability systems. It features dual 4-bit channels with independent active-low output-enable (OE) inputs, 4.5 V to 5.5 V supply operation, −55°C to 125°C temperature range, and CDIP-20 ceramic dual-in-line packaging.
For engineers reviewing the 5962-9062501MRA datasheet, 5962-9062501MRA pinout, 5962-9062501MRA application, or 5962-9062501MRA equivalent, this device is selected for high-impedance bus interfacing, radiation-tolerant logic buffering, and legacy military avionics timing-critical data routing where guaranteed parametric performance across extreme temperature is required.
Technical Context
The 5962-9062501MRA implements BiCMOS circuitry with P-N-P input stages to minimize DC loading on upstream drivers and reduce ICCZ quiescent current. Its two independent 4-bit sections each accept TTL-compatible inputs and drive bus lines with symmetrical enable control.
Each channel supports true 3-state output behavior: outputs go high-impedance when OE is high, and pass A→Y with propagation delays as low as 0.9 ns (tPLH/tPHL min) under loaded conditions. The device meets MIL-STD-883C Class B requirements including ESD protection >2000 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Supply Voltage | 4.5 V to 5.5 V - Ensures compatibility with 5 V TTL and military power rails with ±10% tolerance. |
| Operating Temperature | −55°C to 125°C - Qualified per MIL-PRF-38535 for use in airborne, spaceborne, and ground vehicle control systems. |
| Output Drive (IOL) | 48 mA - Sufficient to drive 50-pF loads with ≤0.55 V VOL at full military temp range, enabling direct connection to legacy bus structures. |
| Propagation Delay | 0.9 ns to 5.3 ns (tPLH/tPHL) - Supports high-speed address/data latching in real-time embedded controllers without added wait states. |
| Input Clamp Current | −18 mA - Protects inputs against overvoltage transients during hot-swap or fault conditions in ruggedized backplanes. |
| ICCZ Quiescent Current | 4 mA max - Low standby power enables use in battery-backed or thermally constrained military subsystems. |
| ESD Rating | >2000 V HBM - Meets MIL-STD-883C Method 3015, reducing risk of field failure in handling and deployment environments. |
Pinout & Package
Ceramic Dual-In-Line Package (CDIP-20), 300-mil body width, hermetically sealed, lead finish per MIL-STD-1835. Pin 1 identified by notch or dot; pins numbered counterclockwise from top-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE | Active-Low Output Enable | Independent control of each 4-bit section; assertion disables Y outputs into high-Z state for bus sharing. |
| 1A1–1A4, 2A1–2A4 | Data Inputs | TTL-compatible inputs accepting 0.8 V VIH threshold; P-N-P structure reduces loading on preceding logic stages. |
| 1Y1–1Y4, 2Y1–2Y4 | Noninverting Outputs | BiCMOS outputs deliver 48 mA sink current with 0.38 V VOL at 48 mA, suitable for driving terminated transmission lines. |
| VCC (Pin 20) | Power Supply | 5 V nominal supply; absolute max 7 V allows margin for transient spikes in harsh electrical environments. |
| GND (Pin 10) | Ground Reference | Common return for all I/O and supply currents; layout requires low-inductance connection to minimize switching noise coupling. |
Key Features
| Feature | Design Value |
|---|---|
| State-of-the-art BiCMOS design | Reduces ICCZ to 4 mA max while maintaining TTL-compatible input thresholds and output drive strength. |
| P-N-P input structure | Lowers DC input loading to <1 µA IIH, preventing signal degradation in fan-out-heavy address decoding trees. |
| 3-state bus interface capability | Enables time-multiplexed sharing of common data/address buses among multiple controllers without external isolation. |
| MIL-STD-883C qualified | Includes screening for mechanical shock, thermal cycling, and burn-in-required for DoD procurement compliance. |
| Ceramic DIP (CDIP) package | Hermetic seal and CTE-matched leads ensure long-term reliability in high-vibration, wide-temperature mission profiles. |
Applications
| Avionics Flight Control Bus | Tactical Radio Baseband Interface |
|---|---|
|
Use Scenario: Buffering and isolating processor-generated address signals to multiple memory modules in fly-by-wire flight computers. IC Role / Device Role / Timing Role: Noninverting 3-state buffer providing deterministic tPLH/tPHL ≤5.3 ns to meet tight timing budgets between CPU and SRAM banks. Use Value: Enables concurrent access to dual memory banks via OE-controlled channel gating, eliminating bus contention without arbitration logic. |
Use Scenario: Driving analog-to-digital converter (ADC) sample clocks and digital upconverter control lines in software-defined radios. IC Role / Device Role / Timing Role: High-drive, low-skew clock and control signal repeater ensuring setup/hold margins are maintained across PCB traces. Use Value: 48 mA output current sustains clean edges into 50-Ω trace impedances, preserving jitter performance critical for IF sampling accuracy. |
| Missile Guidance Processor Backplane | Nuclear Command & Control Data Router |
|
Use Scenario: Interfacing radiation-hardened microcontrollers to EEPROM-based configuration storage and sensor telemetry interfaces. IC Role / Device Role / Timing Role: Memory address driver with guaranteed −55°C to 125°C operation and 2000 V HBM ESD protection. Use Value: Eliminates need for external transient suppressors or level shifters, simplifying board-level hardening for neutron/gamma exposure zones. |
Use Scenario: Isolating command execution logic from secure communication peripherals in hardened command bunkers. IC Role / Device Role / Timing Role: Secure bus gatekeeper using independent OE controls to enforce one-way data flow directionality. Use Value: Physical layer separation prevents electromagnetic leakage paths between classified and unclassified subsystems via controlled high-Z state transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal noninverting 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 5962-9062501M2A | LCCC-20 ceramic package; identical electrical specs but different mechanical footprint and thermal mass. | Preferred for surface-mount assembly in compact, high-vibration platforms where through-hole CDIP is impractical. | Select when board space constraints or automated placement require leadless ceramic chip carrier mounting. |
| 5962-9062501MSA | CFP-20 flatpack package; same temperature range and drive capability, but different lead geometry and sealing method. | Suitable for hybrid microcircuit integration and multi-chip module (MCM) substrates requiring side-brazed interconnects. | Choose for hybrid assemblies requiring gold-plated leads and compatibility with glass-seal or ceramic substrate bonding processes. |
Compared with 5962-9062501MRA, the M2A offers superior high-frequency signal integrity due to lower package inductance, while the MSA provides better thermal dissipation in conduction-cooled hybrids-neither is pin-compatible, requiring layout revision for substitution.
Availability
5962-9062501MRA is available at Aetrix Electronics and suitable for avionics, tactical communications, missile guidance, and nuclear C2 systems requiring stable component supply across extended product lifecycles and defense procurement cycles.
Supply support for 5962-9062501MRA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a U.S.-based semiconductor manufacturer with leadership in analog, embedded processing, and high-reliability logic solutions for aerospace, defense, and industrial markets.
The SN54BCT244 family was developed to deliver military-specified 3-state buffering with BiCMOS speed/power advantages for legacy and new-build defense electronics requiring QML-38535 certification.
FAQ
What is the operating temperature range specified for the 5962-9062501MRA?
The 5962-9062501MRA is characterized for operation from −55°C to 125°C, meeting MIL-PRF-38535 Class B requirements. This full military temperature range ensures reliable functionality in extreme environmental conditions encountered in aircraft, missiles, and ground vehicles-critical for systems where thermal derating cannot be assumed. The 5962-9062501MRA maintains its specified VOH, VOL, and propagation delay parameters across this entire range.
Does the 5962-9062501MRA support TTL-compatible input levels?
Yes, the 5962-9062501MRA accepts standard TTL input voltage thresholds: VIL ≤ 0.8 V and VIH ≥ 2.0 V, verified across −55°C to 125°C. Its P-N-P input stage ensures low DC loading (<1 µA IIH), preserving noise margins when driven by legacy TTL or LVTTL sources. This compatibility is explicitly confirmed in the SCBS006E datasheet's recommended operating conditions table for the 5962-9062501MRA.
What package type is used for the 5962-9062501MRA?
The 5962-9062501MRA uses a Ceramic Dual-In-Line Package (CDIP-20), designated "J" per TI's packaging nomenclature. It features a 300-mil body width, hermetic ceramic construction, and tin-lead leads compliant with MIL-STD-1835. This package is distinct from plastic SOIC (DW), LCCC (FK), or CFP (W) variants in the same SN54BCT244 family.
Can the 5962-9062501MRA drive a 50-pF load at maximum speed?
Yes-the 5962-9062501MRA is tested with CL = 50 pF, R1 = R2 = 500 Ω, and delivers tPLH/tPHL ≤ 5.3 ns (max) across −55°C to 125°C. Its 48 mA low-level output current ensures VOL remains ≤0.55 V under this load, satisfying timing closure for high-speed address/data buses in real-time embedded systems. These values are measured per the switching characteristics table in the official SCBS006E datasheet for the 5962-9062501MRA.
Is the 5962-9062501MRA certified to MIL-STD-883?
Yes, the 5962-9062501MRA is fully qualified to MIL-STD-883C, including Method 3015 for ESD testing (>2000 V HBM) and Methods 2001–2036 for environmental stress screening. As a QML-38535 Class B device, it undergoes lot acceptance testing per MIL-PRF-38535, with full traceability and certificate of compliance provided with each shipment-key for DoD and NASA procurement.
5962-9062501MRA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Logic Type:
- -
- Number of Elements:
- -
- Number of Bits per Element:
- -
- Input Type:
- -
- Output Type:
- -
- Current - Output High, Low:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
5962-9062501MRA FAQ
1.How can I place an order for 5962-9062501MRA through Aetrix?
Please submit a Request for Quotation (RFQ) for 5962-9062501MRA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 5962-9062501MRA reliable?
The price and inventory of 5962-9062501MRA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 5962-9062501MRA is usually 5 days.
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Once your 5962-9062501MRA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 5962-9062501MRA?
For technical support, including 5962-9062501MRA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 5962-9062501MRA requirements.
6.How does Aetrix verify that 5962-9062501MRA is sourced from the original manufacturer or authorized distributors?
All 5962-9062501MRA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 5962-9062501MRA meets industry standards.
7.What is the process for return or replacement of 5962-9062501MRA?
All 5962-9062501MRA units undergo pre-shipment inspection (PSI). If there is an issue with 5962-9062501MRA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 5962-9062501MRA part is unused and in its original packaging.
Return procedure for 5962-9062501MRA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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