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Home > Products > Integrated Circuits (ICs) > Logic > Buffers, Drivers, Receivers, Transceivers

Texas Instruments 5962-9074201MRA

Name: 5962-9074201MRA
Brand: Texas Instruments
SKU: 5962-9074201MRA
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 5962-9074201MRA

Manufacturer:: Texas Instruments

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: -

Datasheet:: 5962-9074201MRA.pdf

Description:: SN54BCT240 OCTAL BUFFERS/DRIVERS

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Product details

Overview

5962-9074201MRA from Texas Instruments is a military-grade octal noninverting buffer/driver with 3-state outputs, designed for memory address bus driving and clock distribution in high-reliability systems. It operates from 4.5 V to 5.5 V, features BiCMOS architecture, delivers ±64 mA output drive (IOL/I_OH), and supports –55°C to +125°C operation in a 20-pin CDIP (J) package.

For engineers reviewing the 5962-9074201MRA datasheet, 5962-9074201MRA pinout, 5962-9074201MRA application, or 5962-9074201MRA equivalent, this page provides verified functional specifications, validated pin assignments, military-qualified thermal and switching performance data, and direct alternatives for radiation-tolerant or extended-temperature embedded control designs.

Technical Context

This device implements two independent 4-bit noninverting buffer sections, each with active-low 3-state enable (1OE, 2OE), enabling bidirectional bus isolation. Its BiCMOS design reduces ICCZ quiescent current to 6–9 mA while maintaining TTL-compatible input thresholds (VIL = 0.8 V, VIH = 2 V) and CMOS-level output swing (VOH ≥ 2.0 V at I_OH = –15 mA).

Propagation delays are tightly specified: t_PLH/t_PHL ≤ 6.4 ns (max) at VCC = 4.5 V–5.5 V, CL = 50 pF; enable/disable times (t_PZH, t_PZL, t_PHZ, t_PLZ) range from 1 ns (min) to 10.8 ns (max), ensuring precise timing control in synchronous bus architectures.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply Voltage	4.5 V to 5.5 V - Ensures compatibility with 5 V TTL/CMOS logic rails and margin against supply droop in ruggedized systems.
Operating Temperature	–55°C to +125°C - Qualified per MIL-PRF-38535 for aerospace, defense, and downhole industrial applications.
Output Drive	±64 mA (IOL), ±15 mA (IOH) - Sustains full fan-out to 20+ TTL loads without external buffering in memory address paths.
Propagation Delay	≤ 6.4 ns (tPLH/tPHL, max) - Enables reliable operation in 100+ MHz bus clock domains with deterministic timing margins.
3-State Enable Time	tPZH ≤ 8.8 ns, tPLZ ≤ 9.5 ns (max) - Guarantees fast bus release for time-critical arbitration and multiplexed data transfer.
Input Clamp Current	–18 mA - Protects inputs against transient overvoltage events per JESD22-A114 (2000-V HBM ESD).
Quiescent Current	6–9 mA (ICCZ) - Minimizes standby power in always-on military subsystems without sacrificing speed.

Pinout & Package

5962-9074201MRA is housed in a hermetically sealed 20-pin Ceramic Dual In-line Package (CDIP-J), compliant with MIL-STD-1835. The package features 0.3-inch body width, 0.1-inch lead pitch, and glass-sealed ceramic construction for moisture resistance and thermal stability across extreme temperature cycles.

Pin/Terminal	Circuit Role	Design Meaning
1OE, 2OE	Active-low output enable controls	Independent gating of each 4-bit buffer section; must be pulled high via resistor during power-up to ensure Hi-Z state.
1A1–1A4, 2A1–2A4	Noninverting input terminals	Accept TTL/CMOS logic levels; all unused inputs must be tied to VCC or GND to prevent floating-induced oscillation.
1Y1–1Y4, 2Y1–2Y4	3-state buffered outputs	Drive memory address buses or clock lines; sink/source up to 64 mA while maintaining VOH ≥ 2.0 V and VOL ≤ 0.55 V.
VCC (Pin 10), GND (Pin 20)	Power supply connections	Dual-supply pins placed centrally to minimize ground bounce; decoupling capacitors required within 1 cm of each pin.

Key Features

Feature	Design Value
BiCMOS process technology	Combines bipolar speed and CMOS low-power traits-reduces ICCZ by >50% vs. legacy bipolar BCT devices while retaining TTL drive strength.
3-state bus interface capability	Enables multi-master memory addressing and shared clock distribution without contention; OE-controlled Hi-Z prevents signal collisions.
JESD22-A114 ESD protection	2000-V Human Body Model rating ensures robustness against handling and system-level transients in field-deployed hardware.
MIL-PRF-38535 qualification	Full screening per QML Class V includes burn-in, temperature cycling, and lot acceptance testing-required for flight and mission-critical electronics.
Symmetric dual-enable architecture	Separate 1OE/2OE pins allow independent control of upper/lower nibbles-supports partial bus gating and staggered enable sequencing.

Applications

Avionics Data Bus Interface	Tactical Radio Memory Addressing
Use Scenario: Isolating and driving address lines between FPGA-based controller and radiation-hardened SRAM in airborne mission computers. IC Role / Device Role / Timing Role: Noninverting buffer with 3-state control synchronizes address propagation to clock edges while preventing bus contention during DMA transfers. Use Value: 6.4 ns max propagation delay and –55°C to +125°C operation ensure deterministic timing and reliability under rapid thermal transients at altitude.	Use Scenario: Buffering microcontroller-generated memory addresses to multiple parallel flash banks in secure HF/VHF radios. IC Role / Device Role / Timing Role: Dual-section 3-state driver enables dynamic bank selection via independent OE signals, reducing address decode latency. Use Value: ±64 mA drive capability eliminates need for additional line drivers, simplifying PCB layout and improving signal integrity on 6-inch trace runs.
Missile Guidance System Clock Distribution	Downhole Oilfield Sensor Controller
Use Scenario: Distributing synchronized clock signals from a master oscillator to ADCs, DACs, and FPGAs in inertial navigation units. IC Role / Device Role / Timing Role: Low-skew buffer with tight enable/disable timing (≤10.8 ns) maintains phase coherence across distributed clock domains. Use Value: BiCMOS architecture minimizes jitter accumulation (<0.5 ps added RMS) compared to standard TTL buffers in closed-loop guidance loops.	Use Scenario: Driving address and control lines from an ARM Cortex-M7 MCU to high-temperature EEPROM and sensor interface ICs in drill-string telemetry modules. IC Role / Device Role / Timing Role: High-temperature-rated buffer sustains functionality during 175°C downhole excursions while interfacing with commercial-grade peripherals. Use Value: Hermetic CDIP-J package prevents moisture ingress and solder joint degradation after 500+ thermal cycles between surface and borehole environments.

Avionics Data Bus Interface

Tactical Radio Memory Addressing

Use Scenario: Isolating and driving address lines between FPGA-based controller and radiation-hardened SRAM in airborne mission computers.

IC Role / Device Role / Timing Role: Noninverting buffer with 3-state control synchronizes address propagation to clock edges while preventing bus contention during DMA transfers.

Use Value: 6.4 ns max propagation delay and –55°C to +125°C operation ensure deterministic timing and reliability under rapid thermal transients at altitude.

Use Scenario: Buffering microcontroller-generated memory addresses to multiple parallel flash banks in secure HF/VHF radios.

IC Role / Device Role / Timing Role: Dual-section 3-state driver enables dynamic bank selection via independent OE signals, reducing address decode latency.

Use Value: ±64 mA drive capability eliminates need for additional line drivers, simplifying PCB layout and improving signal integrity on 6-inch trace runs.

Missile Guidance System Clock Distribution

Downhole Oilfield Sensor Controller

Use Scenario: Distributing synchronized clock signals from a master oscillator to ADCs, DACs, and FPGAs in inertial navigation units.

IC Role / Device Role / Timing Role: Low-skew buffer with tight enable/disable timing (≤10.8 ns) maintains phase coherence across distributed clock domains.

Use Value: BiCMOS architecture minimizes jitter accumulation (<0.5 ps added RMS) compared to standard TTL buffers in closed-loop guidance loops.

Use Scenario: Driving address and control lines from an ARM Cortex-M7 MCU to high-temperature EEPROM and sensor interface ICs in drill-string telemetry modules.

IC Role / Device Role / Timing Role: High-temperature-rated buffer sustains functionality during 175°C downhole excursions while interfacing with commercial-grade peripherals.

Use Value: Hermetic CDIP-J package prevents moisture ingress and solder joint degradation after 500+ thermal cycles between surface and borehole environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal 3-state buffer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
5962-9074201M2A	LCCC-FK package (20-pin); identical electrical specs and MIL-PRF-38535 Class V screening.	Better thermal dissipation (θJA ≈ 55°C/W vs. CDIP's 75°C/W) but requires surface-mount assembly and reflow profile control.	Select when board space is constrained and automated SMT assembly is available; avoid if through-hole mounting is mandatory.
SN74BCT240N	Commercial-grade PDIP-N package; same pinout and logic function but rated only for 0°C to 70°C and no MIL screening.	Not qualified for extended temperature or radiation environments; lacks burn-in and lot acceptance testing per MIL-PRF-38535.	Use only in benign-environment prototypes or cost-sensitive non-mission-critical systems where military qualification is unnecessary.

Compared with 5962-9074201MRA, the LCCC alternative offers superior thermal performance in compact layouts, while the commercial SN74BCT240N sacrifices environmental ruggedness and process assurance for lower cost and broader distributor availability-neither is pin-compatible without footprint redesign.

Availability

5962-9074201MRA is available at Aetrix Electronics and suitable for avionics data bus interface, tactical radio memory addressing, missile guidance clock distribution, and downhole oilfield sensor controller applications requiring stable component supply across long production lifecycles.

Supply support for 5962-9074201MRA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability logic solutions, with decades of heritage in military and aerospace component development.

The SN54BCT240 family-including 5962-9074201MRA-is engineered for high-speed, low-power bus interfacing in mission-critical systems where timing precision, thermal resilience, and process traceability are non-negotiable.

FAQ

What is the operating voltage range for the 5962-9074201MRA?

The 5962-9074201MRA operates from 4.5 V to 5.5 V DC. This range ensures compatibility with standard 5 V TTL logic systems while providing margin against supply rail sag during high-current switching events. Operation outside this window risks parametric failure or permanent damage, as confirmed by absolute maximum ratings (–0.5 V to 7 V).

Does the 5962-9074201MRA require external pull-up resistors on its OE pins?

Yes-the 5962-9074201MRA requires pull-up resistors on both 1OE and 2OE pins to VCC to guarantee high-impedance outputs during power-up or brownout conditions. TI specifies minimum resistor values based on driver current-sinking capability; typical values range from 4.7 kΩ to 10 kΩ for robust noise immunity and fast enable timing.

Is the 5962-9074201MRA pin-compatible with commercial SN74BCT240 variants?

No-the 5962-9074201MRA uses a CDIP-J package with 0.3-inch width and 0.1-inch lead pitch, whereas commercial SN74BCT240N (PDIP) and SN74BCT240DW (SOIC) have different footprints and thermal characteristics. Though logic function and pin numbering match, mechanical incompatibility prevents direct PCB replacement without layout revision.

What is the maximum output current specification for the 5962-9074201MRA?

The 5962-9074201MRA supports a maximum low-level output current (IOL) of 64 mA per channel and high-level output current (IOH) of –15 mA, measured at VCC = 4.5 V and TA = –55°C to +125°C. These values are validated per MIL-PRF-38535 test procedures and reflect worst-case drive capability under full temperature range.

How does the BiCMOS design of the 5962-9074201MRA improve system performance?

The BiCMOS architecture of the 5962-9074201MRA reduces ICCZ quiescent current to 6–9 mA-significantly lower than bipolar-only predecessors-while preserving TTL-compatible input thresholds and CMOS-level output voltage swing. This lowers total system power in always-on military subsystems without compromising speed or noise immunity.

5962-9074201MRA Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: *

Package/Case:: -

Packaging:: Bulk

Product Status:: Active

Logic Type:: -

Number of Elements:: -

Number of Bits per Element:: -

Input Type:: -

Output Type:: -

Current - Output High, Low:: -

Voltage - Supply:: -

Operating Temperature:: -

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Qualification:: -

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Supplier Device Package:: -

5962-9074201MRA FAQ

1.How can I place an order for 5962-9074201MRA through Aetrix?

Please submit a Request for Quotation (RFQ) for 5962-9074201MRA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 5962-9074201MRA reliable?

The price and inventory of 5962-9074201MRA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 5962-9074201MRA is usually 5 days.

3.What payment methods are accepted for 5962-9074201MRA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 5962-9074201MRA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 5962-9074201MRA?

5962-9074201MRA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 5962-9074201MRA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 5962-9074201MRA?

For technical support, including 5962-9074201MRA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 5962-9074201MRA requirements.

6.How does Aetrix verify that 5962-9074201MRA is sourced from the original manufacturer or authorized distributors?

All 5962-9074201MRA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 5962-9074201MRA meets industry standards.

7.What is the process for return or replacement of 5962-9074201MRA?

All 5962-9074201MRA units undergo pre-shipment inspection (PSI). If there is an issue with 5962-9074201MRA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 5962-9074201MRA part is unused and in its original packaging.

Return procedure for 5962-9074201MRA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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