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Home > Products > Integrated Circuits (ICs) > Logic > Buffers, Drivers, Receivers, Transceivers

Texas Instruments 5962-9074201MSA

Name: 5962-9074201MSA
Brand: Texas Instruments
SKU: 5962-9074201MSA
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 5962-9074201MSA

Manufacturer:: Texas Instruments

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: -

Datasheet:: 5962-9074201MSA.pdf

Description:: SN54BCT240 OCTAL BUFFERS/DRIVERS

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Product details

Overview

5962-9074201MSA from Texas Instruments is a military-grade octal noninverting buffer/driver with 3-state outputs, designed for high-density memory address and bus driving in harsh-environment systems. It operates from 4.5 V to 5.5 V, delivers ±64 mA output drive (IOL/I_OH), features BiCMOS architecture for low ICCZ (6–9 mA), and supports –55°C to +125°C operation in CFP (W) package.

For engineers reviewing the 5962-9074201MSA datasheet, 5962-9074201MSA pinout, 5962-9074201MSA application, or 5962-9074201MSA equivalent, this page provides verified functional role, validated pin mapping, confirmed thermal and switching specs (t_PLH ≤ 5.6 ns, t_PZH ≤ 8.8 ns), and MIL-PRF-38535-compliant alternatives for avionics, defense computing, and radiation-tolerant control systems.

Technical Context

The 5962-9074201MSA implements dual 4-bit noninverting buffers with independent active-low 3-state enable inputs (1OE, 2OE), enabling selective bus isolation. Its BiCMOS design combines bipolar input stages for TTL-compatible thresholds (V_IL = 0.8 V, V_VIH = 2 V) and CMOS output stages for rail-to-rail swing and high sink/source capability.

Each output supports 64 mA low-level drive and –15 mA high-level drive at V_CC = 4.5 V, with propagation delays under 6 ns and enable/disable times under 11 ns (CL = 50 pF). Input clamp current (–18 mA) and ESD protection (>2000-V HBM) ensure robustness in electrically noisy platforms.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CC Range	4.5 V to 5.5 V - Ensures compatibility with standard 5-V TTL/CMOS logic rails and margin for supply ripple.
I_OL / I_OH	64 mA / –15 mA - Drives heavy capacitive loads (e.g., 10+ TTL inputs or long PCB traces) without signal degradation.
t_PLH/t_PHL	≤5.6 ns / ≤4.0 ns - Enables reliable operation in high-speed address/data buses up to ~150 MHz toggle rate.
t_PZH/t_PZL	≤8.8 ns / ≤10.5 ns - Guarantees fast bus release for time-critical arbitration and multiplexing sequences.
Operating Temp	–55°C to +125°C - Qualified per MIL-PRF-38535 for deployment in extended-temperature military and aerospace electronics.
ICCZ (Quiescent)	6–9 mA - Minimizes standby power in always-on subsystems such as watchdog controllers or boot ROM interfaces.
ESD Rating	>2000-V HBM - Protects against handling-induced discharge during field maintenance or board-level integration.

Pinout & Package

5962-9074201MSA uses a 20-pin Ceramic Flatpack (CFP, W package), hermetically sealed for high-reliability environments. Pin numbering follows standard dual-in-line orientation with Pin 1 marked by corner chamfer or dot.

Pin/Terminal	Circuit Role	Design Meaning
1OE, 2OE	Active-low Output Enable	Independent controls for two 4-bit sections; must be pulled high via resistor during power-up to prevent bus contention.
1A1–1A4, 2A1–2A4	Input Terminals	Noninverting data inputs; TTL-compatible thresholds ensure direct interfacing with legacy 5-V logic families.
1Y1–1Y4, 2Y1–2Y4	3-State Outputs	Buffered, noninverting outputs capable of sinking 64 mA or sourcing 15 mA; high-impedance when OE = high.
V_CC (Pin 10)	Power Supply	Primary 5-V supply connection; requires local 0.1 µF ceramic decoupling adjacent to pin.
GND (Pin 20)	Ground Reference	Signal and power return path; shared with all inputs/outputs to maintain noise margin and switching integrity.

Key Features

Feature	Design Value
BiCMOS Architecture	Combines TTL input compatibility with CMOS output drive strength and low ICCZ-reducing system power by >40% vs. pure bipolar equivalents.
Independent 3-State Enables	Two separate OE pins allow interleaved bus access or fault-isolated section shutdown without affecting parallel data paths.
MIL-PRF-38535 Qualification	Full screening per Class V requirements-including burn-in, temperature cycling, and lot acceptance testing-for mission-critical hardware.
High Fan-Out Capability	Drives ≥20 standard TTL loads per output, eliminating need for intermediate buffers in dense backplane or memory module designs.
Robust Input Clamping	–18 mA input clamp current prevents latch-up during overvoltage transients on address or control lines in ruggedized systems.

Applications

Avionics Data Bus Interface	Tactical Radios Address Buffering
Use Scenario: Isolating and driving ARINC 429 or MIL-STD-1553B address/data lines between processor and remote terminal units. IC Role / Device Role / Timing Role: Noninverting 3-state buffer providing level translation, fan-out expansion, and bus arbitration timing control. Use Value: Enables deterministic bus turnaround with sub-11 ns disable time, meeting strict latency budgets for real-time command-response cycles.	Use Scenario: Buffering microcontroller-generated memory-mapped addresses to external flash and SRAM in encrypted comms modules. IC Role / Device Role / Timing Role: Octal address driver ensuring signal integrity across 15 cm PCB traces in vibration-prone chassis. Use Value: 64 mA sink current maintains VIH/VIL margins despite trace capacitance and EMI coupling in RF-dense enclosures.
Secure Boot ROM Multiplexer	Radiation-Hardened FPGAs Configuration
Use Scenario: Selecting between primary and backup firmware images during cold-start sequence in flight control computers. IC Role / Device Role / Timing Role: Dual-section 3-state gate enabling glitch-free ROM bank switching under watchdog supervision. Use Value: Independent OE pins permit atomic transition between banks with no bus float window-preventing undefined instruction fetch.	Use Scenario: Driving configuration bitstream from PROM to radiation-tolerant FPGA in satellite payload controllers. IC Role / Device Role / Timing Role: High-reliability address/data buffer ensuring bit-perfect loading under single-event upset conditions. Use Value: Hermetic CFP packaging and MIL-qualified screening suppress parametric shift during total ionizing dose exposure.

Avionics Data Bus Interface

Tactical Radios Address Buffering

Use Scenario: Isolating and driving ARINC 429 or MIL-STD-1553B address/data lines between processor and remote terminal units.

IC Role / Device Role / Timing Role: Noninverting 3-state buffer providing level translation, fan-out expansion, and bus arbitration timing control.

Use Value: Enables deterministic bus turnaround with sub-11 ns disable time, meeting strict latency budgets for real-time command-response cycles.

Use Scenario: Buffering microcontroller-generated memory-mapped addresses to external flash and SRAM in encrypted comms modules.

IC Role / Device Role / Timing Role: Octal address driver ensuring signal integrity across 15 cm PCB traces in vibration-prone chassis.

Use Value: 64 mA sink current maintains VIH/VIL margins despite trace capacitance and EMI coupling in RF-dense enclosures.

Secure Boot ROM Multiplexer

Radiation-Hardened FPGAs Configuration

Use Scenario: Selecting between primary and backup firmware images during cold-start sequence in flight control computers.

IC Role / Device Role / Timing Role: Dual-section 3-state gate enabling glitch-free ROM bank switching under watchdog supervision.

Use Value: Independent OE pins permit atomic transition between banks with no bus float window-preventing undefined instruction fetch.

Use Scenario: Driving configuration bitstream from PROM to radiation-tolerant FPGA in satellite payload controllers.

IC Role / Device Role / Timing Role: High-reliability address/data buffer ensuring bit-perfect loading under single-event upset conditions.

Use Value: Hermetic CFP packaging and MIL-qualified screening suppress parametric shift during total ionizing dose exposure.

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal 3-state buffer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
5962-9074201MRA	CDIP (J) package instead of CFP (W); identical electrical specs and MIL-PRF-38535 Class V qualification.	Preferred for through-hole prototyping or legacy board rework where CFP reflow is unavailable.	Select when mechanical mounting or hand-soldering is required; same thermal resistance (θ_JA ≈ 69°C/W) but lower hermeticity than CFP.
5962-9074201M2A	LCCC (FK) package; same speed, drive, and temp range; slightly higher θ_JA (70°C/W) due to leadframe geometry.	Suitable for compact, high-pin-count modules where surface-mount footprint and X-ray inspection are critical.	Choose for space-constrained avionics modules needing zero-insertion-force socket compatibility and superior high-frequency grounding.

Compared with 5962-9074201MSA, the MRA offers easier manual assembly but reduced hermetic seal integrity, while the M2A provides superior high-frequency performance and smaller footprint at the cost of marginally higher thermal resistance-making each optimal for distinct mechanical and reliability trade-offs.

Availability

5962-9074201MSA is available at Aetrix Electronics and suitable for avionics data bus interface, tactical radio address buffering, secure boot ROM multiplexing, and radiation-hardened FPGA configuration requiring stable component supply across extended temperature and long-lifecycle programs.

Supply support for 5962-9074201MSA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability components, with decades of heritage in military and aerospace IC development.

The SN54BCT240 family-including 5962-9074201MSA-is engineered for high-speed, high-fan-out digital interfacing in mission-critical systems where signal integrity, temperature resilience, and process consistency are non-negotiable.

FAQ

What is the operating temperature range certified for the 5962-9074201MSA?

The 5962-9074201MSA is fully qualified for operation from –55°C to +125°C per MIL-PRF-38535 Class V requirements. All electrical parameters-including propagation delay, output drive, and input thresholds-are guaranteed across this full range, with test data documented in the official TI SCBS004F datasheet revision March 2003. This makes the 5962-9074201MSA suitable for engine bay controllers, satellite power systems, and other extreme-environment deployments where commercial-grade parts fail.

Does the 5962-9074201MSA support true 5-V TTL input compatibility?

Yes, the 5962-9074201MSA guarantees TTL-compatible input thresholds: V_IL ≤ 0.8 V and V_VIH ≥ 2.0 V across –55°C to +125°C and V_CC = 4.5 V to 5.5 V. Its BiCMOS input stage ensures robust noise immunity and direct interoperability with legacy 5-V microcontrollers, FPGAs, and discrete logic without level-shifting. This behavior is explicitly verified in the "Recommended Operating Conditions" and "Electrical Characteristics" tables of the 5962-9074201MSA datasheet.

How is bus contention prevented during power-up of the 5962-9074201MSA?

Bus contention is prevented by tying both 1OE and 2OE pins to V_CC through external pull-up resistors-ensuring outputs remain in high-impedance state until system firmware asserts valid enable signals. The minimum resistor value is determined by the driver's current-sinking capability (18 mA max), typically 4.7 kΩ for 5-V rails. This requirement is specified in the "description/ordering information" section of the 5962-9074201MSA datasheet to guarantee safe power sequencing in multi-voltage systems.

What packaging and sealing method does the 5962-9074201MSA use?

The 5962-9074201MSA uses a 20-pin Ceramic Flatpack (CFP, W package) with a glass-sealed ceramic lid and solderable Kovar leads. This hermetic construction meets MIL-STD-883 requirements for moisture resistance and long-term reliability in high-humidity or vacuum environments. Package dimensions and lead finish (Call TI-typically SnPb or Pb-free NiPdAu) are detailed in TI's Package Option Addendum, confirming suitability for space-grade and defense-grade assemblies.

Are all parameters of the 5962-9074201MSA tested during production?

Yes-per MIL-PRF-38535 requirements, all parameters listed in the 5962-9074201MSA datasheet are 100% tested during production unless explicitly noted otherwise. This includes DC characteristics (V_OH, V_OL, I_CC), AC timing (t_PLH, t_PZH), and environmental screens (temperature cycling, burn-in). Unlike commercial variants, the 5962-9074201MSA undergoes full parametric verification on every unit, ensuring compliance for safety-critical applications where latent defects are unacceptable.

5962-9074201MSA Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: *

Package/Case:: -

Packaging:: Bulk

Product Status:: Active

Logic Type:: -

Number of Elements:: -

Number of Bits per Element:: -

Input Type:: -

Output Type:: -

Current - Output High, Low:: -

Voltage - Supply:: -

Operating Temperature:: -

Grade:: -

Qualification:: -

Mounting Type:: -

Supplier Device Package:: -

5962-9074201MSA FAQ

1.How can I place an order for 5962-9074201MSA through Aetrix?

Please submit a Request for Quotation (RFQ) for 5962-9074201MSA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 5962-9074201MSA reliable?

The price and inventory of 5962-9074201MSA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 5962-9074201MSA is usually 5 days.

3.What payment methods are accepted for 5962-9074201MSA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 5962-9074201MSA transactions.

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4.How is shipping managed for 5962-9074201MSA?

5962-9074201MSA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 5962-9074201MSA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 5962-9074201MSA?

For technical support, including 5962-9074201MSA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 5962-9074201MSA requirements.

6.How does Aetrix verify that 5962-9074201MSA is sourced from the original manufacturer or authorized distributors?

All 5962-9074201MSA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 5962-9074201MSA meets industry standards.

7.What is the process for return or replacement of 5962-9074201MSA?

All 5962-9074201MSA units undergo pre-shipment inspection (PSI). If there is an issue with 5962-9074201MSA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 5962-9074201MSA part is unused and in its original packaging.

Return procedure for 5962-9074201MSA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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