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Texas Instruments 5962-9172801Q3A
- Part No.:
- 5962-9172801Q3A
- Manufacturer:
- Texas Instruments
- Package:
- -
- Datasheet:
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5962-9172801Q3A.pdf
- Description:
- SN54BCT8245A SCAN TEST DEVICES W
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Product details
Overview
5962-9172801Q3A from Texas Instruments is a military-grade octal bus transceiver with integrated IEEE 1149.1 boundary-scan test circuitry, supporting JTAG-compliant board-level diagnostics. It operates over −55°C to 125°C, features dual 8-bit bidirectional A/B buses, and provides TAP-controlled test modes including EXTEST, INTEST, SAMPLE/PRELOAD, and RUNT with PSA/PRPG. It serves in high-reliability avionics and defense system interconnects.
For engineers reviewing the 5962-9172801Q3A datasheet, 5962-9172801Q3A pinout, 5962-9172801Q3A application, or 5962-9172801Q3A equivalent, key selection criteria include MIL-PRF-38535 qualification, full boundary-scan register (18-bit BSR), TMS-based double-high-level reset, DIR/OE-controlled bus direction and enable, and compatibility with 'F245/'BCT245 functional behavior in normal mode.
Technical Context
The 5962-9172801Q3A implements a synchronous TAP controller fully compliant with IEEE Std 1149.1-1990, with capture/shift/update timing aligned to rising/falling edges of TCK. Its test architecture includes an 8-bit instruction register (IR), 18-bit boundary-scan register (BSR), 2-bit boundary-control register (BCR), and 1-bit bypass register - all accessible via TDI/TDO serial scan path.
In normal mode, it functions as a TTL-compatible octal transceiver with internal pullups on DIR, OE, TMS, TDI, and TCK; in test mode, it supports parallel-signature analysis (PSA) and pseudo-random pattern generation (PRPG) under RUNT instruction, with BCR bits 1–0 selecting among TOPSIP, PRPG, PSA, or PSA/PRPG operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Temperature Range | −55°C to +125°C - qualified per MIL-PRF-38535 for extended environmental operation in aerospace and defense platforms. |
| Boundary-Scan Register | 18-bit - covers all 16 I/O pins (A1–A8, B1–B8), DIR, and OE for full pin-level observability and controllability. |
| TAP Clock (TCK) | Synchronous edge-triggered - data captured on rising edge, outputs updated on falling edge; enables deterministic scan timing. |
| Functional Equivalence | Matches 'F245 and 'BCT245 - allows drop-in replacement in legacy bus interface designs without logic redesign. |
| Test Reset Mechanism | Double-high-level (10 V) on TMS - provides hardware-initiated test reset independent of TCK sequence, enhancing debug reliability. |
| Supply Voltage | 5 V ±5% - compatible with standard TTL logic families and legacy military power rails. |
| Package Type | Ceramic DIP (JT) - hermetically sealed, MIL-STD-883 qualified, suitable for high-reliability PCB assembly. |
Pinout & Package
Ceramic Dual-In-Line Package (JT), 24-pin, 0.600-inch wide, with center index notch. Pin 1 located at top-left corner when viewed from top with notch up.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DIR | Direction control input | Determines data flow direction: low = B→A, high = A→B; internal pullup ensures defined state if unconnected. |
| OE | Output enable input | Low enables transceiver output drivers; high places A/B ports in high-impedance isolation state. |
| A1–A8 | A-bus I/O terminals | Bidirectional TTL-compatible ports; internal pullups hold high if floating - reduces need for external biasing. |
| B1–B8 | B-bus I/O terminals | Matched electrical characteristics to A-bus; supports symmetric bus interfacing between two subsystems. |
| TCK | Test clock input | Master clock for all boundary-scan operations; rising edge captures data, falling edge updates outputs. |
| TDI | Test data input | Serial input for instruction and data register loading; internal pullup prevents undefined logic level. |
| TDO | Test data output | Serial output for scan-out; high-impedance when inactive, driven only during Shift-IR/Shift-DR states. |
| TMS | Test mode select | Controls TAP state machine progression; double-high (10 V) triggers hardware reset - critical for field debug. |
| VCC, GND | Power supply terminals | Single 5 V supply with dedicated ground; decoupling required per MIL-STD-883 for noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| IEEE 1149.1 Compliance | Fully implements mandatory TAP signals (TCK/TMS/TDI/TDO), instruction set (EXTEST/INTEST/BYPASS/SAMPLE), and boundary-scan architecture for standardized board test. |
| 18-Bit Boundary-Scan Register | Covers all functional I/O plus DIR/OE - enables pin-level fault detection (stuck-at, bridging, open) without physical probe access. |
| Run-Time Test (RUNT) Support | Executes PSA or PRPG during Run-Test/Idle using BCR configuration - accelerates production test coverage without host intervention. |
| MIL-PRF-38535 Qualification | Includes screening, burn-in, and 100% parametric testing per Level S requirements - guarantees performance in mission-critical systems. |
| Functional Mode Compatibility | Pin- and logic-compatible with 'F245/'BCT245 - allows seamless integration into existing bus interface designs while adding testability. |
Applications
| Avionics Data Bus Interface | Defense System Backplane Interconnect |
|---|---|
Use Scenario: Bidirectional data routing between flight computer and sensor modules across a ruggedized backplane with limited physical test access. IC Role / Device Role / Timing Role: Octal bus transceiver enabling controlled A↔B data transfer; DIR/OE manage direction and isolation; TAP provides post-deployment diagnostic capability. Use Value: Eliminates need for bed-of-nails fixtures by enabling boundary-scan verification of solder joints and trace integrity after system integration. | Use Scenario: High-reliability communication between radar processor and display unit in airborne early warning platform operating under extreme thermal cycling. IC Role / Device Role / Timing Role: MIL-spec bus buffer with embedded test logic; operates across −55°C to +125°C; TMS double-high reset enables in-field recovery from test lockup. Use Value: Reduces field return rate by enabling automated PSA-based signature validation of interconnect health during maintenance cycles. |
| Secure Military Communication Node | Spacecraft Onboard Data Handling |
Use Scenario: Secure data exchange between crypto module and radio transceiver in tactical SATCOM terminal subject to EMI and radiation exposure. IC Role / Device Role / Timing Role: Isolation-capable transceiver with high-impedance disable (OE); boundary-scan registers verify signal integrity pre-launch and during orbit checkout. Use Value: Supports DO-254 compliance through traceable, repeatable structural test vectors generated from BSR definition. | Use Scenario: Command/data routing between star tracker and main processor in LEO satellite where repair is impossible and failure tolerance is zero. IC Role / Device Role / Timing Role: Radiation-tolerant (per MIL-PRF-38535) bus interface with built-in self-test via CELLTST and TOPSIP instructions. Use Value: Enables autonomous health monitoring via periodic RUNT+PSA execution - detects latent interconnect degradation before functional failure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal bus transceiver with boundary-scan applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SNJ54BCT8245FK | Same JT package, identical pinout and boundary-scan architecture; differs only in screening level (Class B vs QML-Q). | Qualified to MIL-STD-883 Class B rather than QML-Q; lacks full radiation hardness assurance and extended lot traceability. | Select when cost sensitivity outweighs requirement for QML-Q certification in non-flight hardware. |
| 5962-9172801QRA | Same die, identical functionality; differs only in temperature screening (−55°C to +125°C vs −55°C to +105°C) and test documentation format. | Rated for lower max operating temperature; used in subsystems with less severe thermal environments (e.g., ground support equipment). | Select when full 125°C operation is not required - offers same reliability at reduced test overhead. |
Compared with 5962-9172801Q3A, SNJ54BCT8245FK omits QML-Q process controls and radiation assurance, while 5962-9172801QRA relaxes thermal qualification - both retain identical boundary-scan capability and functional behavior but serve distinct assurance tiers within the same military ecosystem.
Availability
5962-9172801Q3A is available at Aetrix Electronics and suitable for avionics data bus interfaces, defense system backplane interconnects, and secure military communication nodes requiring stable component supply under ITAR-controlled logistics.
Supply support for 5962-9172801Q3A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a U.S.-based semiconductor company specializing in analog, embedded processing, and high-reliability military ICs with over 50 years of aerospace and defense heritage.
The SCOPE™ family - including 5962-9172801Q3A - was designed specifically to embed IEEE 1149.1 testability into military-grade logic devices without compromising speed, drive strength, or environmental robustness.
FAQ
What is the qualification standard for 5962-9172801Q3A?
The 5962-9172801Q3A is fully qualified to MIL-PRF-38535 QML-Q requirements, including screening, burn-in, and 100% parametric testing per Level S. It meets MIL-STD-883 test methods for vibration, shock, thermal cycling, and hermeticity - making it suitable for flight-critical avionics and defense applications where failure is not an option. This qualification is documented in the device's QML listing and certificate of conformance.
Does 5962-9172801Q3A support the full IEEE 1149.1 instruction set?
Yes, 5962-9172801Q3A supports all mandatory IEEE 1149.1-1990 instructions (EXTEST, INTEST, SAMPLE/PRELOAD, BYPASS, HIGHZ, CLAMP) plus optional RUNT, READBN, CELLTST, and TOPHIP. The instruction register is 8-bit with bit 7 as don't-care; unsupported SCOPE™ instructions default to BYPASS. Full opcode mapping is provided in the SCBS043E datasheet Table 2.
How does the double-high-level reset on TMS work in 5962-9172801Q3A?
The 5962-9172801Q3A implements IEEE 1149.1-1990 optional test reset by detecting a VIHH (10 V) voltage level on the TMS pin - independent of TCK timing. When sensed, it forces the TAP controller directly into Test-Logic-Reset state within one cycle, bypassing state-machine sequencing. This feature enables reliable recovery from test hangs in deployed systems without requiring power cycle or host intervention.
Can 5962-9172801Q3A be used as a direct replacement for SN74BCT8245A in commercial designs?
No - while 5962-9172801Q3A is functionally identical to SN74BCT8245A in normal mode and shares the same pinout, it is a QML-Q qualified military part with different screening, packaging (JT ceramic vs DW/NT plastic), temperature range (−55°C to +125°C), and ITAR-controlled distribution. It is not intended for commercial use and requires export authorization. For commercial applications, SN74BCT8245A remains the appropriate choice.
What is the purpose of the boundary-control register (BCR) in 5962-9172801Q3A?
The 2-bit boundary-control register (BCR) in 5962-9172801Q3A configures advanced test operations executed under the RUNT instruction during Run-Test/Idle state. BCR bits 1–0 select among four modes: sample inputs/toggle outputs (00), PRPG (01), PSA (10), or simultaneous PSA/PRPG (11). This enables automated structural testing without host software overhead - critical for high-volume manufacturing and field diagnostics.
5962-9172801Q3A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Logic Type:
- -
- Number of Elements:
- -
- Number of Bits per Element:
- -
- Input Type:
- -
- Output Type:
- -
- Current - Output High, Low:
- -
- Voltage - Supply:
- -
- Operating Temperature:
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- Grade:
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- Qualification:
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5962-9172801Q3A FAQ
1.How can I place an order for 5962-9172801Q3A through Aetrix?
Please submit a Request for Quotation (RFQ) for 5962-9172801Q3A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
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6.How does Aetrix verify that 5962-9172801Q3A is sourced from the original manufacturer or authorized distributors?
All 5962-9172801Q3A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 5962-9172801Q3A meets industry standards.
7.What is the process for return or replacement of 5962-9172801Q3A?
All 5962-9172801Q3A units undergo pre-shipment inspection (PSI). If there is an issue with 5962-9172801Q3A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 5962-9172801Q3A part is unused and in its original packaging.
Return procedure for 5962-9172801Q3A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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