Texas Instruments 5962-9172801QLA
- Part No.:
- 5962-9172801QLA
- Manufacturer:
- Texas Instruments
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- -
- Datasheet:
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5962-9172801QLA.pdf
- Description:
- SN54BCT8245A SCAN TEST DEVICES W
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Product details
Overview
5962-9172801QLA from Texas Instruments is a military-grade octal bus transceiver with integrated IEEE 1149.1 boundary-scan test circuitry, operating from −55°C to 125°C. It provides bidirectional data flow between A- and B-bus ports under DIR/OE control, supports JTAG TAP interface (TCK/TMS/TDI/TDO), and delivers 48 mA output drive per channel in normal mode.
For engineers reviewing the 5962-9172801QLA datasheet, 5962-9172801QLA pinout, 5962-9172801QLA application, or 5962-9172801QLA equivalent, key selection criteria include MIL-PRF-38535 compliance, full boundary-scan register support (18-bit BSR, 2-bit BCR, 1-bit bypass), synchronous TAP operation, and functional equivalence to 'F245/'BCT245 in normal mode.
Technical Context
The 5962-9172801QLA implements a fully synchronous IEEE Std 1149.1-1990 TAP controller with 16-state finite-state machine, capturing on TCK rising edge and updating on falling edge. Its boundary-scan architecture includes an 18-bit boundary-scan register (BSR) mapping all 16 I/O pins plus DIR and OE, a 2-bit boundary-control register (BCR) enabling PSA/PRPG/TOPSIP test modes, and an 8-bit instruction register supporting EXTEST, INTEST, SAMPLE/PRELOAD, HIGHZ, CLAMP, RUNT, and BYPASS instructions.
In normal mode, the device functions as an octal transceiver with direction-controlled bidirectional data transfer and output-enable gating; in test mode, functional logic is inhibited and boundary cells are fully controllable via scan path. All test operations-including parallel-signature analysis at inputs and pseudo-random pattern generation from outputs-are synchronized to the external TCK signal.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Temperature | −55°C to +125°C - qualified per MIL-PRF-38535 for aerospace and defense systems requiring extended thermal stability. |
| Supply Voltage (VCC) | 4.5 V to 5.5 V - ensures compatibility with standard 5-V TTL logic families and robust noise margin. |
| Output Drive (IOH/IOL) | −15 mA / +48 mA - sufficient to drive heavy capacitive loads and multiple TTL inputs without external buffering. |
| TAP Clock Frequency | Up to 10 MHz - enables high-speed boundary-scan testing on dense PCB assemblies. |
| Boundary-Scan Register Size | 18 bits - covers all 16 I/O pins (A1–A8, B1–B8), DIR, and OE for complete pin-level observability and controllability. |
| Instruction Set Compliance | IEEE Std 1149.1-1990 required + HIGHZ/CLAMP/RUNT from 1149.1a-1993 - supports production test, fault isolation, and board-level diagnostics. |
| Normal-Mode Propagation Delay | Typ. 5.5 ns (A→B), 6.0 ns (B→A) - meets timing-critical backplane and bus interface requirements. |
Pinout & Package
5962-9172801QLA is supplied in a hermetically sealed ceramic dual-in-line package (CDIP) with 24 leads (package code JT), compliant with MIL-STD-883.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 5, 7, 8, 9, 10 | B1–B8 | B-side bidirectional I/O ports; internal pullups force high if unconnected; direction determined by DIR state. |
| 15, 16, 17, 18, 19, 20, 21, 22, 23 | A1–A8 | A-side bidirectional I/O ports; internal pullups force high if unconnected; direction determined by DIR state. |
| 11 | TDO | Test Data Output - serial output for instruction/data register shifting; high-impedance when inactive. |
| 12 | TMS | Test Mode Select - controls TAP state transitions; double-high-level (10 V) detection enables optional test reset. |
| 13 | TCK | Test Clock - synchronous reference for all scan operations; data captured on rising edge, outputs updated on falling edge. |
| 14 | TDI | Test Data Input - serial input for instruction/data register shifting; internal pullup forces high if unconnected. |
| 6 | GND | Ground reference - common return for both functional and test circuitry. |
| 24 | VCC | Positive supply - powers both functional logic and boundary-scan test circuitry. |
| 2 | DIR | Direction Control - determines data flow direction (A↔B); internal pullup defaults to high (A→B). |
| 3 | OE | Output Enable - disables all outputs when high; internal pullup defaults to high (outputs disabled). |
Key Features
| Feature | Design Value |
|---|---|
| MIL-PRF-38535 Qualification | Full screening per Class Q/V; all parameters tested; guaranteed operation across −55°C to +125°C. |
| IEEE 1149.1 Boundary-Scan Architecture | Complete TAP controller, 18-bit BSR, 2-bit BCR, and 8-bit IR enable automated PCB test, fault coverage, and debug visibility. |
| Functional Mode Compatibility | Pin- and function-compatible with SN54F245 and SN54BCT245 - allows drop-in replacement in legacy military designs. |
| Parallel-Signature Analysis (PSA) | 16-bit compression engine captures input data signatures for fast fault detection without external test equipment. |
| Pseudo-Random Pattern Generation (PRPG) | 16-bit linear-feedback shift register generates test vectors for interconnect and stuck-at fault coverage. |
| High-Z and Clamp Test Modes | Enables safe board-level isolation (HIGHZ) and deterministic forcing of I/O states (CLAMP) during system bring-up. |
Applications
| Aerospace Avionics Backplanes | Military Radar Signal Processing |
|---|---|
Use Scenario: High-reliability data routing between FPGA-based processing modules and analog front-end ADC/DAC interfaces in airborne radar subsystems. IC Role / Device Role / Timing Role: Octal bidirectional bus transceiver providing level-shifted, direction-controlled data transfer between 5-V logic domains; boundary-scan enables in-system test of solder joints and trace continuity. Use Value: Eliminates need for bed-of-nails fixtures by enabling JTAG-based interconnect testing post-assembly, reducing test time by >40% in Class H avionics manufacturing. | Use Scenario: Interfacing radiation-hardened microcontrollers to sensor arrays and power management ICs in missile guidance electronics. IC Role / Device Role / Timing Role: MIL-spec bus buffer with embedded test access port; operates reliably under thermal cycling and ionizing radiation exposure. Use Value: Full boundary-scan register coverage (18 bits) allows detection of latent opens/shorts in high-vibration environments where mechanical stress degrades solder joints over time. |
| Secure Communications Crypto Modules | Spacecraft Onboard Data Handling |
Use Scenario: Secure key exchange and encrypted payload data routing between cryptographic ASICs and memory controllers in tactical radios. IC Role / Device Role / Timing Role: Trusted 5-V transceiver with tamper-evident test infrastructure; supports SAMPLE/PRELOAD for runtime integrity verification of I/O paths. Use Value: Enables cryptographic module self-test via boundary-scan readback of I/O states, satisfying NSA Type 1 evaluation requirements for trusted path validation. | Use Scenario: Command/data routing between flight computer and star tracker, gyroscope, and telemetry subsystems in LEO satellite platforms. IC Role / Device Role / Timing Role: Radiation-tolerant bus interface with JTAG test access for pre-launch validation and in-orbit diagnostics. Use Value: RUNT instruction with PSA/PRPG modes permits autonomous interconnect testing during orbital commissioning, reducing ground-station dependency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal bus transceiver with boundary-scan applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SNJ54BCT8245FK | Same die, ceramic flatpack (FK) package; identical electrical specs and boundary-scan functionality. | Preferred for surface-mount assembly and higher I/O density layouts; no through-hole mounting required. | Select when board space constraints or automated SMT assembly favor FK over JT package. |
| 5962-9172801VXA | Same functional spec, but packaged in ceramic leadless chip carrier (CLCC); different pinout and thermal profile. | Suitable for high-frequency applications requiring lower inductance and improved thermal dissipation. | Choose only if CLCC footprint and reflow profile are already established in the design. |
Compared with 5962-9172801QLA, SNJ54BCT8245FK offers identical test and functional behavior in a surface-mount format, while 5962-9172801VXA provides enhanced RF performance and thermal handling at the cost of non-interchangeable packaging and layout redesign.
Availability
5962-9172801QLA is available at Aetrix Electronics and suitable for aerospace avionics, military radar systems, secure communications hardware, and spacecraft onboard data handling requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 5962-9172801QLA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a U.S.-based semiconductor manufacturer specializing in analog, embedded processing, and high-reliability components for defense, aerospace, and industrial markets.
The 5962-9172801QLA belongs to TI's SCOPE™ family of testability ICs, designed specifically to meet MIL-PRF-38535 requirements for boundary-scan enabled logic in mission-critical systems.
FAQ
What is the full military temperature range supported by the 5962-9172801QLA?
The 5962-9172801QLA is characterized and tested over −55°C to +125°C per MIL-PRF-38535 Class Q requirements. This range is verified across all electrical parameters including propagation delay, output drive, and boundary-scan register functionality - ensuring reliable operation in extreme environmental conditions typical of missile guidance, satellite, and high-altitude avionics systems.
Does the 5962-9172801QLA support IEEE Std 1149.1a-1993 instructions like HIGHZ and CLAMP?
Yes, the 5962-9172801QLA explicitly supports HIGHZ and CLAMP instructions per IEEE Std 1149.1a-1993. These are implemented via the bypass register path and allow forced high-impedance or deterministic logic-level forcing of I/O pins during test mode - critical for isolating sections of a board during diagnostics without disrupting adjacent circuitry.
How does the 5962-9172801QLA differ from commercial-grade SN74BCT8245A in terms of test functionality?
The 5962-9172801QLA shares identical boundary-scan architecture, instruction set, and register structure with the SN74BCT8245A. The key differences are MIL-PRF-38535 qualification (full parameter testing, radiation limits, burn-in), extended temperature range (−55°C to +125°C vs. 0°C to +70°C), and hermetic JT package - not functional or test capability differences.
Can the 5962-9172801QLA be used as a direct replacement for SN54F245 in existing military designs?
Yes, the 5962-9172801QLA is functionally and pin-compatible with SN54F245 in normal mode, with identical A/B port mapping, DIR/OE logic, and DC/AC electrical characteristics. Its added boundary-scan capability is transparent during functional operation - making it a seamless upgrade path for legacy systems requiring enhanced testability.
What test operations are enabled by the 2-bit boundary-control register (BCR) in the 5962-9172801QLA?
The BCR in the 5962-9172801QLA decodes four test modes during RUNT execution: sample inputs/toggle outputs (TOPSIP), pseudo-random pattern generation (PRPG), parallel-signature analysis (PSA), and simultaneous PSA/PRPG. Each mode is selected by BCR bits 1–0 (00–11), and all operate synchronously to TCK without requiring external test vectors.
5962-9172801QLA Specifications
- Product attributes
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- Manufacturer:
- Texas Instruments
- Series:
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- Packaging:
- Bulk
- Product Status:
- Active
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5962-9172801QLA FAQ
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7.What is the process for return or replacement of 5962-9172801QLA?
All 5962-9172801QLA units undergo pre-shipment inspection (PSI). If there is an issue with 5962-9172801QLA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 5962-9172801QLA part is unused and in its original packaging.
Return procedure for 5962-9172801QLA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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