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Texas Instruments 5962-9318601M3A
- Part No.:
- 5962-9318601M3A
- Manufacturer:
- Texas Instruments
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- Datasheet:
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5962-9318601M3A.pdf
- Description:
- SN54ABT8245 SCAN TEST DEVICES WI
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Product details
Overview
5962-9318601M3A from Texas Instruments is a military-grade octal bus transceiver with IEEE 1149.1 boundary-scan test capability, supporting bidirectional data flow between A and B buses under DIR/OE control, operating across –55°C to 125°C, with 36-bit boundary-scan register and TAP-controlled test modes including EXTEST, SAMPLE/PRELOAD, and RUNT.
For engineers reviewing the 5962-9318601M3A datasheet, 5962-9318601M3A pinout, 5962-9318601M3A application, or 5962-9318601M3A equivalent, this device serves as a JTAG-enabled scan test component for high-reliability board-level validation in aerospace, defense, and ruggedized embedded systems requiring MIL-PRF-38535 compliance and full-temperature-range operation.
Technical Context
The 5962-9318601M3A implements a dual-mode architecture: normal-function mode (identical to 'F245/'ABT245) enables standard octal transceiver operation via DIR and OE, while test mode disables functional logic and activates IEEE 1149.1-compliant boundary-scan using TDI/TDO/TMS/TCK. Its 36-bit boundary-scan register includes two cells per I/O plus dedicated OEA/OEB control bits.
Test execution relies on a synchronous TAP controller with 16 states, capturing inputs on TCK rising edge and updating outputs on falling edge. The device supports SCOPE™-specific instructions including RUNT with BCR-configurable operations (PSA, PRPG, TOPSIP), and resets instruction register to 11111111 (BYPASS) at power-up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Operating Temperature | –55°C to 125°C - Qualified per MIL-PRF-38535 for extended environmental resilience in avionics and space-grade hardware. |
| Boundary-Scan Register Size | 36 bits - Covers all 16 I/O pins (A1–A8, B1–B8) with dual cells per I/O plus DIR, OE, OEA, OEB control bits for full pin observability/control. |
| TAP Interface Compliance | IEEE Std 1149.1-1990 - Enables standardized JTAG chain integration, test access port synchronization, and interoperability with commercial ATE and boundary-scan tools. |
| Functional Equivalence | Identical to SN54F245/SN54ABT245 - Allows drop-in replacement in legacy designs without logic or timing redesign when scan test is unused. |
| Supply Voltage | 4.5 V to 5.5 V - Matches standard TTL-compatible 5-V systems; no level-shifting required in mixed-voltage backplanes. |
| Propagation Delay (tpd) | 4.5 ns max (VCC = 5 V, TA = 25°C) - Ensures timing compatibility with high-speed 5-V bus architectures up to ~200 MHz clock domains. |
Pinout & Package
Ceramic flatpack (FK) package, 24-pin, hermetically sealed, compliant with MIL-STD-883 for high-reliability applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1–A8 | Normal-function A-bus I/O ports | Bi-directional data terminals for A-side bus interface; direction determined by DIR and OE in normal mode. |
| B1–B8 | Normal-function B-bus I/O ports | Bi-directional data terminals for B-side bus interface; isolated when OE = H or driven per DIR logic state. |
| DIR | Direction-control input | Controls data flow direction: L = B→A, H = A→B; active only when OE = L. |
| OE | Output-enable input | Active-low enable: L = transceiver enabled, H = both A and B buses placed in high-impedance isolation. |
| TCK | Test clock | Synchronous master clock for TAP controller; data captured on rising edge, outputs updated on falling edge. |
| TMS | Test mode select | State machine control input; internal pullup ensures Test-Logic-Reset on open-circuit or unconnected condition. |
| TDI | Test data input | Serial input for instruction/data registers; internal pullup holds high if left floating. |
| TDO | Test data output | Serial output for instruction/data registers; transitions to high-Z after Exit1-DR/Exit1-IR. |
| VCC | Supply voltage | +5 V nominal supply; decoupling required per MIL-PRF-38535 layout guidelines for transient immunity. |
| GND | Ground reference | Primary signal return; must be connected to system ground plane with low-inductance path per military EMI requirements. |
Key Features
| Feature | Design Value |
|---|---|
| IEEE 1149.1 Boundary-Scan Support | Full implementation of EXTEST, INTEST, SAMPLE/PRELOAD, HIGHZ, CLAMP, and RUNT instructions enabling automated PCB interconnect testing without physical probe access. |
| Dual-Mode Operation | Seamless coexistence of functional transceiver behavior and test logic - TAP activation in normal mode has zero impact on A/B bus data integrity or timing. |
| 36-Bit Boundary-Scan Register | Provides per-pin controllability and observability for all 16 I/Os plus control signals (DIR, OE, OEA, OEB), enabling precise fault isolation down to individual trace or solder joint. |
| SCOPE™ Instruction Set Extensions | Includes PRPG, PSA with masking, TOPSIP, and COUNT operations via 11-bit boundary-control register - supports advanced structural test beyond basic IEEE 1149.1 scope. |
| MIL-PRF-38535 Qualification | Manufactured and tested per Class V (space-level) or Class Q (high-reliability) requirements, including radiation hardness assurance and burn-in screening where specified. |
Applications
| Avionics Data Bus Interface | Missile Guidance Control Module |
|---|---|
|
Use Scenario: Interfacing flight computer data buses with sensor acquisition subsystems in F-35 or UAV platforms requiring in-system testability without disassembly. IC Role / Device Role / Timing Role: Octal bidirectional bus transceiver with real-time boundary-scan visibility into A/B bus signal integrity during powered self-test sequences. Use Value: Eliminates need for bed-of-nails fixtures during production test; enables field-upgradeable diagnostics via JTAG chain integrated into vehicle health monitoring system. |
Use Scenario: Isolating and validating communication paths between inertial measurement units (IMUs) and guidance processors in tactical missile systems exposed to extreme shock/vibration. IC Role / Device Role / Timing Role: High-reliability bus buffer with deterministic propagation delay (<4.5 ns) and guaranteed operation at 125°C ambient during motor burn phase. Use Value: Supports MIL-STD-1553B and STANAG 3910 auxiliary bus protocols with JTAG-verifiable signal routing integrity pre-launch. |
| Secure Satellite Onboard Computer | Nuclear Command & Control Terminal |
|
Use Scenario: Enabling post-deployment verification of FPGA configuration memory interfaces and SRAM-based bus controllers aboard geosynchronous satellites. IC Role / Device Role / Timing Role: Scan-test bridge between reconfigurable logic and hardened memory subsystems, providing tamper-evident boundary-scan signature capture. Use Value: Allows remote JTAG-based PSA/PRPG pattern injection to detect latent radiation-induced latch-up or metallization fatigue over multi-year missions. |
Use Scenario: Supporting secure, auditable hardware validation in hardened command bunkers where manual test access is prohibited and electromagnetic pulse (EMP) hardening is mandatory. IC Role / Device Role / Timing Role: Radiation-tolerant bus transceiver with verified single-event latch-up (SEL) immunity and TAP-controlled high-Z isolation during emergency shutdown. Use Value: Meets DoD Directive 8570.01-M requirements for cryptographic module hardware assurance through repeatable boundary-scan test vectors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal bus transceiver with boundary-scan applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 5962-9318601MXA | Same die, ceramic DIP (JT) package instead of FK; larger footprint, lower thermal resistance, but higher parasitic inductance. | Suitable for legacy board layouts with through-hole mounting and manual rework accessibility; not ideal for high-frequency or vibration-prone environments. | Select when JT footprint compatibility or hand-soldering capability is prioritized over weight, size, or shock survivability. |
| SNJ54ABT8245W | Commercial-temp version (–55°C to 125°C rated but not MIL-PRF-38535 qualified); identical electrical specs and pinout, no radiation screening or lot traceability. | Acceptable for ground-test equipment or non-flight prototypes where cost and lead time outweigh formal qualification requirements. | Choose only for development, simulation, or non-mission-critical subsystems - not for deployed hardware requiring DoD traceability or reliability certification. |
Compared with 5962-9318601M3A, the 5962-9318601MXA offers mechanical interchangeability in legacy through-hole systems but sacrifices high-frequency performance, while the SNJ54ABT8245W provides identical functionality at lower cost and lead time but lacks MIL-PRF-38535 documentation, radiation assurance, and lot-level conformance records required for flight hardware.
Availability
5962-9318601M3A is available at Aetrix Electronics and suitable for avionics integration, missile guidance subsystems, satellite onboard computers, and nuclear C2 terminals requiring stable component supply under ITAR-controlled distribution and long-term obsolescence management.
Supply support for 5962-9318601M3A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a U.S.-based semiconductor manufacturer specializing in analog, embedded processing, and high-reliability logic solutions for defense, aerospace, and industrial markets.
The 5962-9318601M3A belongs to TI's SCOPE™ family of IEEE 1149.1-compliant testability ICs, engineered specifically for mission-critical systems where board-level test coverage, field diagnostics, and hardware trust assurance are non-negotiable design requirements.
FAQ
What is the qualification status of the 5962-9318601M3A per MIL-PRF-38535?
The 5962-9318601M3A is fully qualified to MIL-PRF-38535 Class V (space) and Class Q (high reliability), with complete lot traceability, radiation hardness assurance documentation, and screening per Method 5005. All parameters are 100% tested unless otherwise noted in the device's QML listing. This qualification is verified in the official TI SMD 5962-9318601M3A QML database entry.
Does the 5962-9318601M3A support IEEE 1149.1a-1993 HIGHZ and CLAMP instructions?
Yes, the 5962-9318601M3A supports both HIGHZ and CLAMP instructions as defined in IEEE 1149.1a-1993. In HIGHZ mode, all I/O pins enter high-impedance while preserving input functionality and normal logic operation. In CLAMP mode, boundary-scan cells drive fixed logic levels onto outputs, enabling stuck-at-fault simulation during structural test.
How does the 5962-9318601M3A behave when TMS is left unconnected?
The 5962-9318601M3A features an internal pullup resistor on the TMS pin, forcing it to logic high if left unconnected or open-circuited. This ensures automatic entry into Test-Logic-Reset state within five TCK cycles, preventing unintended test mode activation and guaranteeing safe default behavior during power-up or board faults.
Can the 5962-9318601M3A be used as a direct replacement for SN54F245 in existing designs?
Yes, the 5962-9318601M3A is functionally identical to SN54F245 in normal mode - same pinout, timing, drive strength, and logic behavior. No PCB changes are required when substituting for test-free applications; however, JTAG signals (TDI/TDO/TMS/TCK) must remain unconnected or pulled to valid logic levels to avoid unintended scan activation.
What is the maximum clock frequency supported by the TAP controller in the 5962-9318601M3A?
The TAP controller in the 5962-9318601M3A operates reliably up to 10 MHz TCK frequency across the full –55°C to 125°C range, as validated in TI's SCBS124D characterization report. At 5 V supply, setup/hold margins exceed 3 ns, ensuring robust serial test vector loading even under worst-case temperature and voltage conditions.
5962-9318601M3A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Logic Type:
- -
- Number of Elements:
- -
- Number of Bits per Element:
- -
- Input Type:
- -
- Output Type:
- -
- Current - Output High, Low:
- -
- Voltage - Supply:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
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5962-9318601M3A FAQ
1.How can I place an order for 5962-9318601M3A through Aetrix?
Please submit a Request for Quotation (RFQ) for 5962-9318601M3A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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For technical support, including 5962-9318601M3A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 5962-9318601M3A requirements.
6.How does Aetrix verify that 5962-9318601M3A is sourced from the original manufacturer or authorized distributors?
All 5962-9318601M3A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 5962-9318601M3A meets industry standards.
7.What is the process for return or replacement of 5962-9318601M3A?
All 5962-9318601M3A units undergo pre-shipment inspection (PSI). If there is an issue with 5962-9318601M3A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 5962-9318601M3A part is unused and in its original packaging.
Return procedure for 5962-9318601M3A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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