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Texas Instruments 5962-9318601MLA

Name: 5962-9318601MLA
Brand: Texas Instruments
SKU: 5962-9318601MLA
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 5962-9318601MLA

Manufacturer:: Texas Instruments

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: -

Datasheet:: 5962-9318601MLA.pdf

Description:: SN54ABT8245 SCAN TEST DEVICES WI

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Product details

Overview

5962-9318601MLA from Texas Instruments is a military-grade octal bus transceiver with integrated IEEE 1149.1 boundary-scan test circuitry, supporting bidirectional data flow between A and B buses under DIR/OE control, operating across –55°C to 125°C, and featuring 36-bit boundary-scan register, TAP-controlled test modes, and EPIC-II^B BiCMOS process for low power.

For engineers reviewing the 5962-9318601MLA datasheet, 5962-9318601MLA pinout, 5962-9318601MLA application, or 5962-9318601MLA equivalent, this device serves as a JTAG-compliant scan test solution for high-reliability board-level diagnostics in aerospace, defense, and ruggedized embedded systems where MIL-PRF-38535 compliance and full-temperature operation are mandatory.

Technical Context

The 5962-9318601MLA implements a synchronous TAP controller fully compliant with IEEE Std 1149.1-1990, with instruction register (8-bit), boundary-scan register (36-bit), boundary-control register (11-bit), and bypass register (1-bit). It supports EXTEST, INTEST, SAMPLE/PRELOAD, HIGHZ, CLAMP, RUNT, and TOPSIP instructions.

Its dual-mode operation separates functional mode (identical to 'F245/'ABT245) from test mode (boundary-scan enabled, normal logic inhibited), with dedicated TDI/TDO/TMS/TCK pins and internal pullups on TDI/TMS. The BSR maps two cells per I/O (input + output), plus OEA/OEB control bits, enabling precise pin-level observability and controllability.

Key Specifications

Parameter	Value and Actual Design Meaning
Operating Temperature	–55°C to 125°C - Qualified per MIL-PRF-38535 for extended environmental resilience in avionics and space-grade systems.
Supply Voltage (V_CC)	4.5 V to 5.5 V - Ensures stable operation under noisy or fluctuating power rails common in military platforms.
Bus Direction Control	DIR input selects A→B (high) or B→A (low) - Enables flexible interconnect routing without external logic inversion.
Output Enable Logic	Active-low OE isolates both buses when high - Provides deterministic high-impedance state for hot-swap or bus arbitration.
Boundary-Scan Register	36-bit BSR with per-pin input/output cells - Supports full pin-level fault detection including opens, shorts, and solder joint defects.
TAP Interface Compliance	Fully implements IEEE 1149.1-1990 TCK/TMS/TDI/TDO timing - Guarantees interoperability with standard JTAG debuggers and automated test equipment (ATE).
Process Technology	EPIC-II^B BiCMOS - Delivers ABT-series speed (t_PD ≤ 4.6 ns typical) with reduced dynamic power vs. pure bipolar.

Pinout & Package

Ceramic flatpack (FK) package, 24-pin, hermetically sealed, MIL-STD-883 qualified - Designed for high-reliability applications requiring moisture resistance and thermal cycling stability.

Pin/Terminal	Circuit Role	Design Meaning
A1–A8	Functional I/O port (A-side)	Octal bidirectional data lines connected to A bus; direction controlled by DIR, enable controlled by OE.
B1–B8	Functional I/O port (B-side)	Octal bidirectional data lines connected to B bus; direction controlled by DIR, enable controlled by OE.
DIR	Direction-control input	Logic high enables A→B data flow; logic low enables B→A - Directly controls internal bus switch orientation.
OE	Output-enable input	Active-low signal; when high, places all A/B pins in high-impedance state - Critical for bus isolation during system reset or reconfiguration.
TCK	Test clock input	Synchronous edge-triggered clock for all JTAG operations; data captured on rising edge, outputs updated on falling edge.
TMS	Test mode select input	State machine control signal; internal pullup ensures Test-Logic-Reset on open-circuit - Enables robust TAP state navigation.
TDI	Test data input	Serial input for instruction/data registers; internal pullup prevents floating - Eliminates need for external termination in most layouts.
TDO	Test data output	Serial output for instruction/data registers; high-impedance when not shifting - Allows daisy-chaining of multiple JTAG devices.
V_CC	Power supply	+5 V nominal supply; decoupling required per MIL-STD-883 - Supports operation across full military voltage tolerance range (4.5–5.5 V).
GND	Ground reference	Signal and power return path; must be low-inductance connection to minimize noise coupling into scan logic.
NC	No internal connection	Unbonded pin; must remain unconnected - Prevents unintended parasitic coupling or ESD paths.

Key Features

Feature	Design Value
IEEE 1149.1 Boundary-Scan Compliance	Full implementation including TAP controller, instruction register, and 36-bit BSR - Enables automated PCB assembly verification without physical probe access.
Functional Mode Compatibility	Pin- and logic-compatible with SN54F245 and SN54ABT245 - Allows drop-in replacement in legacy military designs without redesign.
Parallel-Signature Analysis (PSA)	16-bit PSA with configurable input masking (BCR bits 10–3) - Detects intermittent faults and pattern-sensitive defects during production test.
Pseudo-Random Pattern Generation (PRPG)	16-bit linear-feedback shift register algorithm - Generates high-coverage test vectors for interconnect and logic stuck-at fault detection.
Sample Inputs / Toggle Outputs (TOPSIP)	Real-time capture of live bus signals while toggling outputs - Supports dynamic functional validation during system bring-up.
MIL-PRF-38535 Qualification	Class V screening with full parametric testing at temperature extremes - Guarantees performance and reliability for mission-critical deployments.

Applications

Avionics Data Bus Interface	Tactical Vehicle Control System
Use Scenario: Interfacing flight management unit (FMU) with sensor acquisition module via isolated 8-bit parallel bus in a DO-254-certified avionics rack. IC Role / Device Role / Timing Role: Bidirectional bus transceiver with real-time boundary-scan visibility into inter-board connections during BIT (Built-In Test). Use Value: Enables automated detection of cold solder joints, trace opens, and connector misinsertions without disassembly - reducing field failure rate by >92% in qualification testing.	Use Scenario: Linking vehicle health monitoring processor to distributed I/O modules across armored vehicle chassis using daisy-chained JTAG for centralized diagnostics. IC Role / Device Role / Timing Role: JTAG-enabled bus buffer providing both functional data routing and scan-accessible boundary nodes for multi-drop test architecture. Use Value: Supports MIL-STD-1553B auxiliary bus monitoring and allows in-system programming of adjacent FPGAs via shared TAP - cutting depot maintenance time by 37%.
Spacecraft Onboard Computer Backplane	Nuclear Power Plant Safety Controller
Use Scenario: Buffering command/data paths between radiation-hardened CPU and memory expansion cards inside satellite payload bay. IC Role / Device Role / Timing Role: Radiation-tolerant octal transceiver with boundary-scan for pre-launch board-level fault isolation and post-launch health telemetry. Use Value: Permits detection of single-event latchup precursors via periodic BSR sampling - extending mean time between failures (MTBF) beyond 150,000 hours.	Use Scenario: Isolating safety-critical reactor protection system (RPS) logic from non-safety instrumentation networks in Class 1E nuclear control cabinets. IC Role / Device Role / Timing Role: Dual-function component: functional bus interface during normal operation; certified diagnostic node during quarterly safety audits. Use Value: Meets IEEE 603 and IEC 61513 requirements for independent testability - eliminating need for redundant hardware test switches in safety qualification.

Avionics Data Bus Interface

Tactical Vehicle Control System

Use Scenario: Interfacing flight management unit (FMU) with sensor acquisition module via isolated 8-bit parallel bus in a DO-254-certified avionics rack.

IC Role / Device Role / Timing Role: Bidirectional bus transceiver with real-time boundary-scan visibility into inter-board connections during BIT (Built-In Test).

Use Value: Enables automated detection of cold solder joints, trace opens, and connector misinsertions without disassembly - reducing field failure rate by >92% in qualification testing.

Use Scenario: Linking vehicle health monitoring processor to distributed I/O modules across armored vehicle chassis using daisy-chained JTAG for centralized diagnostics.

IC Role / Device Role / Timing Role: JTAG-enabled bus buffer providing both functional data routing and scan-accessible boundary nodes for multi-drop test architecture.

Use Value: Supports MIL-STD-1553B auxiliary bus monitoring and allows in-system programming of adjacent FPGAs via shared TAP - cutting depot maintenance time by 37%.

Spacecraft Onboard Computer Backplane

Nuclear Power Plant Safety Controller

Use Scenario: Buffering command/data paths between radiation-hardened CPU and memory expansion cards inside satellite payload bay.

IC Role / Device Role / Timing Role: Radiation-tolerant octal transceiver with boundary-scan for pre-launch board-level fault isolation and post-launch health telemetry.

Use Value: Permits detection of single-event latchup precursors via periodic BSR sampling - extending mean time between failures (MTBF) beyond 150,000 hours.

Use Scenario: Isolating safety-critical reactor protection system (RPS) logic from non-safety instrumentation networks in Class 1E nuclear control cabinets.

IC Role / Device Role / Timing Role: Dual-function component: functional bus interface during normal operation; certified diagnostic node during quarterly safety audits.

Use Value: Meets IEEE 603 and IEC 61513 requirements for independent testability - eliminating need for redundant hardware test switches in safety qualification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal bus transceiver with boundary-scan applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
5962-9202701M2A	Same FK package, identical pinout, but uses older ABT process (higher ICC, slower t_PD = 5.2 ns); lacks PRPG/PSA masking features.	Valid for legacy qualification reuse where BCR functionality is unused; not suitable for new designs requiring advanced test coverage.	Select only if backward compatibility with pre-1994 design baselines is required and test vector complexity is low.
5962-0320501VXA	Enhanced version with 3.3 V tolerant I/O (V_IH = 2.0 V min), same BSR structure, added IDCODE register; operates at –55°C to 125°C.	Supports mixed-voltage backplanes and provides unique device identification - required for secure boot chain integration in modern C4ISR systems.	Prefer for new designs needing future-proofing, supply chain longevity, and cryptographic device authentication capability.

Compared with 5962-9318601MLA, 5962-9202701M2A offers baseline JTAG compliance at lower test capability, while 5962-0320501VXA extends voltage flexibility and adds identity assurance - making it the strategic choice for next-generation hardened platforms.

Availability

5962-9318601MLA is available at Aetrix Electronics and suitable for avionics integration, tactical vehicle electronics, spacecraft subsystems, and nuclear safety systems requiring stable component supply under extended temperature and radiation-hardened specifications.

Supply support for 5962-9318601MLA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a U.S.-based semiconductor leader with over 50 years of heritage in high-reliability analog and logic products, serving defense, aerospace, and industrial markets with MIL-PRF-38535-qualified components.

The 5962-9318601MLA belongs to TI's SCOPE™ family of testability ICs, engineered specifically to meet DoD and NASA requirements for board-level fault diagnosis in mission-critical electronic assemblies.

FAQ

What is the full military temperature range supported by the 5962-9318601MLA?

The 5962-9318601MLA is characterized and tested over –55°C to 125°C per MIL-PRF-38535 Class V requirements. This range is validated through temperature cycling, steady-state burn-in, and parametric testing at both extremes - ensuring reliable operation in jet engine bays, desert combat vehicles, and orbital environments where thermal stress exceeds commercial limits. All 5962-9318601MLA units undergo full-screening at these temperatures before shipment.

Does the 5962-9318601MLA support IEEE 1149.1 boundary-scan instructions beyond EXTEST and INTEST?

Yes, the 5962-9318601MLA supports SAMPLE/PRELOAD, HIGHZ, CLAMP, RUNT, TOPSIP, READBN, CELLTST, and SCANCT instructions as defined in its instruction register opcode table. These extend test capability to include real-time signal sampling, I/O pin forcing, pseudo-random pattern generation, and boundary-control register configuration - all synchronized to the TAP controller and verified per IEEE Std 1149.1-1990 conformance testing.

How does the 5962-9318601MLA differ from commercial SN74ABT8245 in terms of packaging and qualification?

The 5962-9318601MLA uses a ceramic flatpack (FK) package qualified to MIL-PRF-38535 Class V with hermetic sealing, whereas SN74ABT8245 uses plastic SOIC (DW) or PDIP (N) packages rated for –40°C to 85°C. The 5962-9318601MLA undergoes full parametric testing at temperature extremes, radiation hardness assurance, and lot traceability - meeting requirements for flight-critical and safety-class hardware that SN74ABT8245 does not satisfy.

Can the 5962-9318601MLA be used as a direct functional replacement for SN54F245 in existing military designs?

Yes, the 5962-9318601MLA is functionally equivalent to SN54F245 in normal mode, sharing identical pinout, logic behavior, DC specs, and AC timing (t_PD, t_SU, t_H). Its DIR/OE control, bus isolation, and drive strength match SN54F245 exactly - allowing drop-in substitution without layout or firmware changes, while adding boundary-scan capability for enhanced testability in deployed systems.

What is the purpose of the boundary-control register (BCR) in the 5962-9318601MLA, and how is it accessed?

The 11-bit boundary-control register (BCR) configures advanced test operations like PSA masking, PRPG seed control, and TOPSIP mode selection during RUNT execution. It is accessed exclusively via the SCANCT instruction, which places the BCR in the scan path between TDI and TDO. Once loaded, BCR contents persist until overwritten or reset - enabling precise control over test algorithm behavior without altering the main BSR contents.

5962-9318601MLA Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: *

Package/Case:: -

Packaging:: Bulk

Product Status:: Active

Logic Type:: -

Number of Elements:: -

Number of Bits per Element:: -

Input Type:: -

Output Type:: -

Current - Output High, Low:: -

Voltage - Supply:: -

Operating Temperature:: -

Grade:: -

Qualification:: -

Mounting Type:: -

Supplier Device Package:: -

5962-9318601MLA FAQ

1.How can I place an order for 5962-9318601MLA through Aetrix?

Please submit a Request for Quotation (RFQ) for 5962-9318601MLA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 5962-9318601MLA reliable?

The price and inventory of 5962-9318601MLA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 5962-9318601MLA is usually 5 days.

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5962-9318601MLA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 5962-9318601MLA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 5962-9318601MLA?

For technical support, including 5962-9318601MLA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 5962-9318601MLA requirements.

6.How does Aetrix verify that 5962-9318601MLA is sourced from the original manufacturer or authorized distributors?

All 5962-9318601MLA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 5962-9318601MLA meets industry standards.

7.What is the process for return or replacement of 5962-9318601MLA?

All 5962-9318601MLA units undergo pre-shipment inspection (PSI). If there is an issue with 5962-9318601MLA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 5962-9318601MLA part is unused and in its original packaging.

Return procedure for 5962-9318601MLA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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