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Home > Products > Integrated Circuits (ICs) > Logic > Buffers, Drivers, Receivers, Transceivers

Texas Instruments 5962-9450901XA

Name: 5962-9450901XA
Brand: Texas Instruments
SKU: 5962-9450901XA
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 5962-9450901XA

Manufacturer:: Texas Instruments

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: -

Datasheet:: 5962-9450901XA.pdf

Description:: BUS DRIVER, ABT SERIES

Quantity:: RFQ Add To RFQ list

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Product details

Overview

5962-9450901XA from Texas Instruments is a military-grade 10-bit noninverting 3-state bus buffer with dual active-low output-enable inputs (OE1, OE2), EPIC-II^B BiCMOS process, 5-V supply operation, and flow-through pinout optimized for wide-data-path PCB layout in high-reliability systems.

For engineers reviewing the 5962-9450901XA datasheet, 5962-9450901XA pinout, 5962-9450901XA application, or 5962-9450901XA equivalent, key selection criteria include its −55°C to 125°C operating range, 64-mA low-level output drive, latch-up immunity >500 mA per JESD-17, high-impedance state during power-up/down, and compatibility with TTL-level control signals.

Technical Context

This device implements a dual-gated 2-input AND logic function for output enable: both OE1 and OE2 must be low to assert outputs; either high forces all ten Y outputs into high-impedance. Its BiCMOS architecture delivers rail-to-rail switching with low ground bounce (VOLP < 1 V) and fast propagation delays (tPLH/tPHL ≤ 4.9 ns at 5 V).

The flow-through pinout-inputs on one side (A1–A10), outputs on the opposite (Y1–Y10), and enables centrally located-minimizes trace crossovers and signal skew in parallel bus routing. It supports hot-insertion via power-up/power-down high-Z behavior when VCC is below 2.1 V, and requires external pullup on OE for guaranteed high-Z above that threshold.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply Voltage	4.5 V to 5.5 V - ensures compatibility with standard 5-V TTL/CMOS logic rails and stable operation across military voltage tolerances.
Operating Temperature	−55°C to 125°C - qualified per MIL-PRF-38535 for use in avionics, defense electronics, and space-qualified subsystems.
Output Drive	−32 mA IOH / +64 mA IOL - drives heavy capacitive loads (e.g., backplane stubs or multiple TTL inputs) without signal degradation.
Propagation Delay	tPLH/tPHL ≤ 4.9 ns (max) at CL = 50 pF - enables reliable timing in 100+ MHz data bus applications with tight setup/hold margins.
Power-Up Behavior	High-impedance state when VCC ∈ [0, 2.1 V] - prevents bus contention during system power sequencing and cold-start conditions.
Latch-Up Immunity	>500 mA per JESD-17 - meets stringent military robustness requirements for transient fault tolerance in harsh EMI environments.

Pinout & Package

Ceramic Dual-In-Line Package (CDIP), JT outline, 24-pin, hermetically sealed, 0.600-inch wide body, compliant with MIL-STD-1835 GDIP3-T24 and JEDEC MO-058 AA.

Pin/Terminal	Circuit Role	Design Meaning
1, 2, 3, 4, 5, 6, 7, 8, 9, 10	A1–A10 Inputs	True logic inputs accepting TTL-compatible voltage levels; drive internal buffer stages directly.
11, 12	GND, VCC	Ground and 5-V supply pins - decoupling capacitor placement adjacent to these pins is critical for noise suppression and VOLP control.
13, 24	OE1, OE2	Active-low output-enable controls - both must be low for output assertion; OR logic behavior simplifies enable tree design.
14–23	Y1–Y10 Outputs	3-state noninverting buffered outputs - high-Z when either OE is high; capable of sinking 64 mA or sourcing 32 mA.
15, 16, 17, 18, 19, 20, 21, 22	No Internal Connection (NC)	Unbonded die pads - must remain unconnected on PCB; no routing or thermal relief required.

Key Features

Feature	Design Value
EPIC-II^B BiCMOS Process	Reduces static power by >50% vs. equivalent bipolar TTL while retaining speed and drive strength - extends system-level power budget in thermally constrained modules.
Flow-Through Pinout	Enables straight-line PCB trace routing from A-bus to Y-bus with zero layer changes - cuts parasitic inductance and improves signal integrity in 10-bit parallel paths.
Power-Up/Down High-Z	Guarantees bus isolation during power ramping - eliminates need for external bus-hold or series resistors in multi-voltage domain systems.
Low Ground Bounce (VOLP)	VOLP < 1 V at VCC = 5 V - maintains logic margin under simultaneous switching output (SSO) conditions common in wide-bus applications.
JEDEC JESD-17 Latch-Up Immunity	Exceeds 500 mA - ensures survivability against EOS events in field-deployed military platforms without external protection circuitry.

Applications

Avionics Data Bus Interface	Military Radar Signal Processing Backplane
Use Scenario: Interfacing ADC/DAC modules to a centralized DSP processor across a 10-bit parallel LVDS-to-CMOS translation layer in airborne radar front-end assemblies. IC Role / Device Role / Timing Role: Bidirectional bus buffer isolating sensitive analog signal chain components from digital switching noise while maintaining sub-5-ns timing alignment. Use Value: Flow-through pinout minimizes inter-layer vias; high drive strength sustains signal integrity over 15-cm backplane traces; −55°C to 125°C rating matches aircraft environmental envelope.	Use Scenario: Level-shifting and bus driving between radiation-hardened FPGAs and legacy TTL-based memory controllers in missile guidance subsystems. IC Role / Device Role / Timing Role: Unidirectional data path conditioner providing 64-mA sink capability to meet TTL fanout requirements while rejecting ground bounce-induced metastability. Use Value: Latch-up immunity >500 mA prevents single-event latch-up failure in high-radiation zones; power-up high-Z avoids initialization glitches during cold-boot sequences.
Tactical Radio Baseband Subsystem	Secure Satellite Communication Terminal
Use Scenario: Buffering parallel I/O between a cryptographic ASIC and a high-speed SRAM array in man-portable HF/VHF radios subjected to shock/vibe and wide ambient temperature swings. IC Role / Device Role / Timing Role: 3-state bus driver enabling time-multiplexed access to shared memory resources without bus contention across multiple security domains. Use Value: Dual OE inputs allow independent enable control from separate security state machines; ceramic DIP package ensures mechanical reliability under MIL-STD-810G vibration profiles.	Use Scenario: Isolating telemetry data lanes between radiation-tolerant microcontrollers and RF modulator ICs in LEO satellite command & data handling units. IC Role / Device Role / Timing Role: High-reliability interface buffer ensuring deterministic bus release during safe-mode transitions and power cycling events. Use Value: Guaranteed high-Z below 2.1 V eliminates risk of bus shorting during solar-array undervoltage events; hermetic CDIP packaging prevents moisture ingress in vacuum-operational environments.

Avionics Data Bus Interface

Military Radar Signal Processing Backplane

Use Scenario: Interfacing ADC/DAC modules to a centralized DSP processor across a 10-bit parallel LVDS-to-CMOS translation layer in airborne radar front-end assemblies.

IC Role / Device Role / Timing Role: Bidirectional bus buffer isolating sensitive analog signal chain components from digital switching noise while maintaining sub-5-ns timing alignment.

Use Value: Flow-through pinout minimizes inter-layer vias; high drive strength sustains signal integrity over 15-cm backplane traces; −55°C to 125°C rating matches aircraft environmental envelope.

Use Scenario: Level-shifting and bus driving between radiation-hardened FPGAs and legacy TTL-based memory controllers in missile guidance subsystems.

IC Role / Device Role / Timing Role: Unidirectional data path conditioner providing 64-mA sink capability to meet TTL fanout requirements while rejecting ground bounce-induced metastability.

Use Value: Latch-up immunity >500 mA prevents single-event latch-up failure in high-radiation zones; power-up high-Z avoids initialization glitches during cold-boot sequences.

Tactical Radio Baseband Subsystem

Secure Satellite Communication Terminal

Use Scenario: Buffering parallel I/O between a cryptographic ASIC and a high-speed SRAM array in man-portable HF/VHF radios subjected to shock/vibe and wide ambient temperature swings.

IC Role / Device Role / Timing Role: 3-state bus driver enabling time-multiplexed access to shared memory resources without bus contention across multiple security domains.

Use Value: Dual OE inputs allow independent enable control from separate security state machines; ceramic DIP package ensures mechanical reliability under MIL-STD-810G vibration profiles.

Use Scenario: Isolating telemetry data lanes between radiation-tolerant microcontrollers and RF modulator ICs in LEO satellite command & data handling units.

IC Role / Device Role / Timing Role: High-reliability interface buffer ensuring deterministic bus release during safe-mode transitions and power cycling events.

Use Value: Guaranteed high-Z below 2.1 V eliminates risk of bus shorting during solar-array undervoltage events; hermetic CDIP packaging prevents moisture ingress in vacuum-operational environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 10-bit bus buffer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SNJ54ABT827JT	Identical electrical specs, same JT package, identical military qualification level - direct form-fit-function replacement.	No functional difference; used interchangeably in DoD BOMs where part marking or lot trace requirements differ.	Select SNJ54ABT827JT if procurement documentation mandates "SNJ" prefix for QML-38535 Class V compliance verification.
5962-9450901QLA	Same die, identical performance, same temperature range, but packaged in CDIP with alternate marking (5962-9450901QL A vs. 5962-9450901XA); RoHS status differs per lot.	Functionally identical; selected when legacy board designs specify QLA suffix or require specific DSCC drawing revision alignment.	Choose 5962-9450901QLA only when matching existing hardware documentation or DSCC source control drawings requiring QLA designation.

Compared with 5962-9450901XA, SNJ54ABT827JT offers identical functionality and qualification, while 5962-9450901QLA provides the same silicon in an equivalently rated package with minor marking and sourcing distinctions - neither requires PCB redesign, but selection depends on contractual traceability and DSCC documentation requirements.

Availability

5962-9450901XA is available at Aetrix Electronics and suitable for avionics data bus interface, military radar signal processing backplane, and tactical radio baseband subsystems requiring stable component supply across extended temperature and long-lifecycle programs.

Supply support for 5962-9450901XA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a U.S.-based semiconductor company founded in 1930, specializing in analog, embedded processing, and high-reliability logic solutions for aerospace, defense, and industrial markets.

The ABT logic family-including 5962-9450901XA-is designed specifically for high-speed, high-drive, radiation-tolerant bus interfacing in mission-critical military and space applications where latch-up immunity and wide-temperature operation are mandatory.

FAQ

What is the operating temperature range of the 5962-9450901XA?

The 5962-9450901XA is characterized for operation from −55°C to 125°C, meeting full military temperature specifications per MIL-PRF-38535. This range is validated across all electrical parameters including propagation delay, output drive, and high-impedance leakage, making it suitable for deployment in extreme-environment platforms such as jet engine control units and satellite payload electronics.

Does the 5962-9450901XA require external pull-up resistors on its OE pins?

Yes - to guarantee high-impedance state when VCC exceeds 2.1 V, OE1 and OE2 must be pulled up to VCC via external resistors. The minimum resistor value depends on the current-sinking capability of the driving source; TI recommends verifying pull-up strength against the 10-µA IOZH/IOZL leakage spec to ensure reliable disable behavior across temperature and voltage corners.

Is the 5962-9450901XA pin-compatible with commercial-grade SN74ABT827 variants?

No - the 5962-9450901XA uses a 24-pin ceramic DIP (JT) package, whereas commercial SN74ABT827 variants are offered in plastic SOIC (DW), SSOP (DB), and TSSOP (PW) packages with different pinouts and thermal characteristics. Electrical functionality is identical, but mechanical fit and PCB footprint are not interchangeable.

What is the maximum capacitive load the 5962-9450901XA can drive while maintaining specified timing?

The 5962-9450901XA's switching characteristics are specified at CL = 50 pF. While it can physically drive higher capacitance, propagation delays increase linearly beyond this point - for example, tPLH rises from 4.9 ns (max) at 50 pF to ~7.2 ns at 100 pF. System-level timing analysis must account for this derating when interfacing with long traces or multiple fanout loads.

How does the 5962-9450901XA handle simultaneous switching output (SSO) noise?

The 5962-9450901XA features low output ground bounce (VOLP < 1 V at VCC = 5 V, TA = 25°C), achieved through EPIC-II^B BiCMOS output stage optimization and internal ground pin segmentation. This specification is measured under worst-case SSO conditions and ensures sufficient noise margin for reliable operation in dense backplane environments where multiple buffers switch synchronously.

5962-9450901XA Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: *

Package/Case:: -

Packaging:: Bulk

Product Status:: Active

Logic Type:: -

Number of Elements:: -

Number of Bits per Element:: -

Input Type:: -

Output Type:: -

Current - Output High, Low:: -

Voltage - Supply:: -

Operating Temperature:: -

Grade:: -

Qualification:: -

Mounting Type:: -

Supplier Device Package:: -

5962-9450901XA FAQ

1.How can I place an order for 5962-9450901XA through Aetrix?

Please submit a Request for Quotation (RFQ) for 5962-9450901XA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 5962-9450901XA reliable?

The price and inventory of 5962-9450901XA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 5962-9450901XA is usually 5 days.

3.What payment methods are accepted for 5962-9450901XA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 5962-9450901XA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 5962-9450901XA?

5962-9450901XA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 5962-9450901XA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 5962-9450901XA?

For technical support, including 5962-9450901XA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 5962-9450901XA requirements.

6.How does Aetrix verify that 5962-9450901XA is sourced from the original manufacturer or authorized distributors?

All 5962-9450901XA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 5962-9450901XA meets industry standards.

7.What is the process for return or replacement of 5962-9450901XA?

All 5962-9450901XA units undergo pre-shipment inspection (PSI). If there is an issue with 5962-9450901XA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 5962-9450901XA part is unused and in its original packaging.

Return procedure for 5962-9450901XA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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