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Texas Instruments 5962-9461601QXA

Name: 5962-9461601QXA
Brand: Texas Instruments
SKU: 5962-9461601QXA
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 5962-9461601QXA

Manufacturer:: Texas Instruments

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: -

Datasheet:: 5962-9461601QXA.pdf

Description:: SN54ABT8652 SCAN TEST DEVICES WI

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Product details

Overview

5962-9461601QXA from Texas Instruments is a military-grade scan-test octal bus transceiver with integrated IEEE 1149.1 boundary-scan architecture, dual-directional registered/transparency data flow control (A↔B), and EPIC-II^B BiCMOS process. It operates from –55°C to 125°C, supports JTAG TAP interface (TCK/TMS/TDI/TDO), and delivers 8-bit bidirectional data transfer with clocked register storage and output-enable control. Used in high-reliability avionics and defense system board-level test infrastructure.

For engineers reviewing the 5962-9461601QXA datasheet, 5962-9461601QXA pinout, 5962-9461601QXA application, or 5962-9461601QXA equivalent, this page provides verified functional identity, military temperature validation, IEEE 1149.1 compliance details, boundary-scan register mapping (38-bit BSR), and direct comparison against SN74ABT8652 and SNJ54ABT8652 for legacy design continuity and supply chain migration.

Technical Context

The 5962-9461601QXA implements a dual-mode architecture: normal-function mode replicates 'F652/'ABT652 octal transceiver behavior with CLKAB/CLKBA, SAB/SBA, and OEAB/OEBA controls; test mode disables functional logic and activates IEEE 1149.1 boundary-scan via dedicated TAP controller driving three test registers - 38-bit boundary-scan register (BSR), 11-bit boundary-control register (BCR), and 1-bit bypass register.

Its TAP controller fully complies with IEEE Std 1149.1-1990 state transitions (Test-Logic-Reset → Run-Test/Idle → Shift-DR/IR), captures data on TCK rising edge and updates outputs on falling edge, and supports SCOPE™ instructions including EXTEST, INTEST, SAMPLE/PRELOAD, HIGHZ, CLAMP, RUNT, and BCR-scanning - all validated for MIL-PRF-38535 Class Q/V screening.

Key Specifications

Parameter	Value and Actual Design Meaning
Temperature Range	–55°C to +125°C - Fully characterized and tested per MIL-PRF-38535 for space and defense applications.
Boundary-Scan Register	38-bit BSR - Contains two cells per I/O (input + output) for A1–A8 and B1–B8, plus control pins (OEAB, OEBA, CLKAB, CLKBA, SAB, SBA).
TAP Interface	IEEE 1149.1-1990 compliant - Dedicated TCK, TMS, TDI, TDO pins with internal pullups on TMS/TDI; synchronous capture on TCK↑, update on TCK↓.
Data Path Control	Dual independent clocking - CLKAB/SAB/OEAB govern A→B flow; CLKBA/SBA/OEBA govern B→A flow, supporting transparent or registered transfer per direction.
Process Technology	EPIC-II^B BiCMOS - Delivers TTL-compatible drive strength with reduced power vs. pure bipolar, enabling high-speed (t_pd ≤ 5.5 ns typical) operation at military temp extremes.
Supply Voltage	V_CC = 4.5 V to 5.5 V - Validated across full military range; no derating required at temperature extremes.
Package	Ceramic DIP (JT) - Hermetically sealed 28-pin dual in-line package meeting MIL-STD-883 requirements for moisture resistance and thermal cycling.

Pinout & Package

Ceramic Dual In-Line Package (JT), 28-pin, hermetic, lead finish SnPb per MIL-STD-1835. Pin 1 index corner marked; pin 14 = GND, pin 28 = V_CC.

Pin/Terminal	Circuit Role	Design Meaning
A1–A8	Normal-function A-bus I/O	Octal bidirectional data terminals for A-side bus; each has separate input and output boundary-scan cells in BSR.
B1–B8	Normal-function B-bus I/O	Octal bidirectional data terminals for B-side bus; each mapped to two BSR bits (input + output) for full observability/control.
CLKAB	A→B clock input	Low-to-high transition clocks A-bus data into A-register; enables real-time or stored A→B transfer depending on SAB state.
CLKBA	B→A clock input	Low-to-high transition clocks B-bus data into B-register; enables real-time or stored B→A transfer depending on SBA state.
SAB	A→B select input	Low = transparent A→B path; High = registered A→B path using stored A-data; controls functional mode, not scan.
SBA	B→A select input	Low = transparent B→A path; High = registered B→A path using stored B-data; independent of SAB timing.
OEAB	A→B output enable	Active-high; enables B-output drivers when High; places B1–B8 in high-Z when Low - mapped to BSR bit 37.
OEBA	B→A output enable	Active-low; enables A-output drivers when Low; places A1–A8 in high-Z when High - mapped to BSR bit 36.
TCK	Test clock	System clock for all boundary-scan operations; data captured on rising edge, outputs updated on falling edge.
TMS	Test mode select	Directs TAP controller state transitions; internal pullup ensures Test-Logic-Reset on open/unconnected condition.
TDI	Test data input	Serial input for instruction/data register loading; internal pullup holds high if unconnected.
TDO	Test data output	Serial output for instruction/data register readback; tri-stated during Shift-DR/Shift-IR until first TCK↓.
GND	Ground reference	Pin 14 - primary signal and power return; required for stable boundary-scan cell operation and noise immunity.
V_CC	Power supply	Pin 28 - 4.5 V to 5.5 V supply; powers both functional logic and boundary-scan circuitry; decoupling mandatory.

Key Features

Feature	Design Value
IEEE 1149.1 Boundary-Scan Compliance	Fully implemented TAP controller, 38-bit BSR, 11-bit BCR, and BYPASS register - enables automated PCB interconnect test without physical probe access.
Dual-Mode Operation	Functional mode operates identically to 'F652/'ABT652; test mode disables functional logic without affecting system timing - zero impact on host design during scan activation.
Parallel-Signature Analysis (PSA)	Configurable 16-bit PSA with input masking (BCR bits 10–3) - compresses bus-wide response data into compact signature for fault detection in production test.
Pseudo-Random Pattern Generation (PRPG)	On-chip 16-bit PRPG engine driven by BCR - generates stimulus patterns for structural testing of attached logic without external pattern memory.
MIL-PRF-38535 Qualification	Class Q or V screening performed - includes burn-in, temperature cycling, hermeticity, and parametric testing across full –55°C to +125°C range.
Two BSCs Per I/O	Independent input and output boundary-scan cells for all 16 data lines - enables full visibility of both signal launch and capture points for traceable fault isolation.

Applications

Avionics Backplane Diagnostics	Missile Guidance System Test
Use Scenario: Real-time boundary-scan testing of ARINC 429 or MIL-STD-1553 bus interfaces during flight-line maintenance. IC Role / Device Role / Timing Role: Acts as IEEE 1149.1-compliant scan node on critical data buses; provides deterministic TCK-synchronized sampling of A/B bus states during powered self-test. Use Value: Eliminates need for intrusive bed-of-nails fixtures; enables in-system verification of solder joints, connector mating, and routing integrity under operational voltage/temperature.	Use Scenario: Automated test of guidance computer backplane interconnects during final assembly and depot-level repair. IC Role / Device Role / Timing Role: Functions as boundary-scan controller for multi-board assemblies; executes EXTEST and RUNT (PSA/PRPG) sequences via JTAG daisy-chain. Use Value: Reduces test cycle time by >65% vs. flying-probe methods; detects opens/shorts on high-density 0.100" pitch connectors inaccessible to visual inspection.
Secure Communication Module Validation	Nuclear Command & Control Interface
Use Scenario: Production test of encrypted data link modules where tamper-evident packaging prohibits post-solder probing. IC Role / Device Role / Timing Role: Provides non-invasive observability of bidirectional crypto processor ↔ FPGA data paths using SAMPLE/PRELOAD and INTEST instructions. Use Value: Confirms correct signal routing and timing margin without violating TEMPEST shielding; validates integrity of masked PSA signatures against golden reference.	Use Scenario: Lifecycle reliability monitoring of hardened C2 systems deployed in electromagnetic pulse (EMP)-hardened shelters. IC Role / Device Role / Timing Role: Serves as radiation-tolerant scan hub; performs periodic CLAMP and HIGHZ tests to verify I/O driver health after environmental stress exposure. Use Value: Detects latent degradation in output buffers before functional failure; supports predictive maintenance via trend analysis of BSR capture consistency.

Avionics Backplane Diagnostics

Missile Guidance System Test

Use Scenario: Real-time boundary-scan testing of ARINC 429 or MIL-STD-1553 bus interfaces during flight-line maintenance.

IC Role / Device Role / Timing Role: Acts as IEEE 1149.1-compliant scan node on critical data buses; provides deterministic TCK-synchronized sampling of A/B bus states during powered self-test.

Use Value: Eliminates need for intrusive bed-of-nails fixtures; enables in-system verification of solder joints, connector mating, and routing integrity under operational voltage/temperature.

Use Scenario: Automated test of guidance computer backplane interconnects during final assembly and depot-level repair.

IC Role / Device Role / Timing Role: Functions as boundary-scan controller for multi-board assemblies; executes EXTEST and RUNT (PSA/PRPG) sequences via JTAG daisy-chain.

Use Value: Reduces test cycle time by >65% vs. flying-probe methods; detects opens/shorts on high-density 0.100" pitch connectors inaccessible to visual inspection.

Secure Communication Module Validation

Nuclear Command & Control Interface

Use Scenario: Production test of encrypted data link modules where tamper-evident packaging prohibits post-solder probing.

IC Role / Device Role / Timing Role: Provides non-invasive observability of bidirectional crypto processor ↔ FPGA data paths using SAMPLE/PRELOAD and INTEST instructions.

Use Value: Confirms correct signal routing and timing margin without violating TEMPEST shielding; validates integrity of masked PSA signatures against golden reference.

Use Scenario: Lifecycle reliability monitoring of hardened C2 systems deployed in electromagnetic pulse (EMP)-hardened shelters.

IC Role / Device Role / Timing Role: Serves as radiation-tolerant scan hub; performs periodic CLAMP and HIGHZ tests to verify I/O driver health after environmental stress exposure.

Use Value: Detects latent degradation in output buffers before functional failure; supports predictive maintenance via trend analysis of BSR capture consistency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal bus transceiver with boundary-scan applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74ABT8652	Commercial temperature range (–40°C to +85°C); plastic SOIC (DW/DL) or ceramic DIP (JT); no MIL-PRF-38535 screening.	Valid for industrial or commercial avionics subsystems where extended temperature or radiation tolerance is not required.	Select SN74ABT8652 only for cost-sensitive, non-military platforms with relaxed environmental specs and no long-term obsolescence constraints.
SNJ54ABT8652	Same military temperature range (–55°C to +125°C) and JT package; qualified to MIL-STD-883 but lacks full MIL-PRF-38535 Class Q/V documentation traceability.	Acceptable for legacy defense programs grandfathered under MIL-STD-883, but not for new DoD designs requiring Class Q/V conformance.	Prefer 5962-9461601QXA over SNJ54ABT8652 when full MIL-PRF-38535 certification, lot traceability, and extended life-cycle support are contractually mandated.

Compared with SN74ABT8652 and SNJ54ABT8652, the 5962-9461601QXA uniquely delivers documented MIL-PRF-38535 Class Q/V qualification, guaranteed long-term availability through DSAS, and full traceability to raw material lots - essential for mission-critical systems requiring zero-risk component pedigree and audit-ready compliance records.

Availability

5962-9461601QXA is available at Aetrix Electronics and suitable for avionics backplane diagnostics, missile guidance system test, secure communication module validation, and nuclear command & control interface applications requiring stable component supply across extended product lifecycles.

Supply support for 5962-9461601QXA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a U.S.-based semiconductor leader specializing in analog, embedded processing, and high-reliability military/aerospace ICs with over 50 years of defense supply chain experience.

The 5962-9461601QXA belongs to TI's SCOPE™ family of IEEE 1149.1 boundary-scan testability devices, designed specifically to reduce test development cost and improve fault coverage in complex, high-density military PCB assemblies.

FAQ

What is the operating temperature range certified for 5962-9461601QXA?

The 5962-9461601QXA is fully characterized and tested over –55°C to +125°C per MIL-PRF-38535 requirements. All electrical parameters - including t_pd, I_OH/I_OL, and boundary-scan timing - are guaranteed across this range with no derating. This distinguishes it from commercial variants like SN74ABT8652, which only operate from –40°C to +85°C.

Does 5962-9461601QXA support the full IEEE 1149.1-1990 instruction set?

Yes, the 5962-9461601QXA implements all mandatory IEEE 1149.1-1990 instructions (EXTEST, INTEST, SAMPLE/PRELOAD, BYPASS, HIGHZ, CLAMP) plus optional SCOPE™ extensions including RUNT, READBN, CELLTST, and SCANCN. Its 38-bit BSR, 11-bit BCR, and TAP controller state machine are fully compliant and validated per TI SCBS122F datasheet revision December 1996.

How does the dual-clock architecture of 5962-9461601QXA differ from standard octal transceivers?

Unlike basic transceivers, the 5962-9461601QXA provides independent clock inputs CLKAB and CLKBA, allowing asynchronous A→B and B→A data transfers. Each direction supports both transparent (real-time) and registered (clocked store-and-forward) modes controlled by SAB/SBA and OEAB/OEBA - enabling flexible bus arbitration and glitch-free handshaking in full-duplex systems.

Is 5962-9461601QXA pin-compatible with SN74ABT8652?

Yes, the 5962-9461601QXA uses the same JT (ceramic DIP) package footprint and identical pinout as SN74ABT8652 in JT configuration. Signal mapping - including A1–A8, B1–B8, CLKAB, CLKBA, OEAB, OEBA, TCK, TMS, TDI, TDO, GND, and V_CC - matches exactly. However, SN74ABT8652 in DW/DL packages has different mechanical dimensions and thermal characteristics.

What boundary-scan test functions are enabled by the 11-bit boundary-control register (BCR) in 5962-9461601QXA?

The BCR in 5962-9461601QXA enables five advanced test operations under the RUNT instruction: sample inputs/toggle outputs (TOPSIP), 16-bit pseudo-random pattern generation (PRPG), 16-bit parallel-signature analysis (PSA), simultaneous PSA+PRPG (8-bit mode), and simultaneous PSA+binary count (8-bit mode). Input masking (BCR bits 10–3) allows selective exclusion of specific pins from PSA, improving fault resolution accuracy.

5962-9461601QXA Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: *

Package/Case:: -

Packaging:: Bulk

Product Status:: Active

Logic Type:: -

Number of Elements:: -

Number of Bits per Element:: -

Input Type:: -

Output Type:: -

Current - Output High, Low:: -

Voltage - Supply:: -

Operating Temperature:: -

Grade:: -

Qualification:: -

Mounting Type:: -

Supplier Device Package:: -

5962-9461601QXA FAQ

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The price and inventory of 5962-9461601QXA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 5962-9461601QXA is usually 5 days.

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For technical support, including 5962-9461601QXA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 5962-9461601QXA requirements.

6.How does Aetrix verify that 5962-9461601QXA is sourced from the original manufacturer or authorized distributors?

All 5962-9461601QXA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 5962-9461601QXA meets industry standards.

7.What is the process for return or replacement of 5962-9461601QXA?

All 5962-9461601QXA units undergo pre-shipment inspection (PSI). If there is an issue with 5962-9461601QXA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 5962-9461601QXA part is unused and in its original packaging.

Return procedure for 5962-9461601QXA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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