Infineon Technologies 5962F1120202QXA
- Part No.:
- 5962F1120202QXA
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 165-BFCPGA
- Datasheet:
-
5962F1120202QXA.pdf
- Description:
- IC SRAM 72MBIT PARALLEL 165CCGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,667
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Product details
Overview
5962F1120202QXA from Cypress Semiconductor is a radiation-hardened 72-Mbit QDR® II+ SRAM with RadStop™ technology, configured as 4 M × 18, operating at 250 MHz with DDR interfaces on independent read/write ports, 1.8 V core supply, and qualified for space-grade applications requiring latch-up immunity ≥120 MeV·cm²/mg at 125 °C.
For engineers reviewing the 5962F1120202QXA datasheet, 5962F1120202QXA pinout, 5962F1120202QXA application, or 5962F1120202QXA equivalent, this device serves high-reliability embedded memory needs in satellite command/data handling, radar signal processing, and onboard avionics where total ionizing dose tolerance (300 krad) and neutron fluence survivability (2.0 × 10¹⁴ n/cm²) are mission-critical.
Technical Context
The 5962F1120202QXA implements a synchronous pipelined QDR II+ architecture with fully independent read and write ports sharing a multiplexed address bus, enabling concurrent transactions without bus turnaround. It uses rising edges of dual K/K clocks for DDR data transfer at 500 MHz effective rate and integrates a delay-locked loop (DLL) to achieve 2-cycle read latency.
RadStop™ technology enables radiation hardening via proprietary process and layout techniques, delivering verified SEL immunity, low soft error rate (≤1 × 10⁻¹⁰ upsets/bit-day with SECDED), and operation across –55 °C to +125 °C under MIL-PRF-38535 Class Q screening.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 72 Mbit (4 M × 18 organization) |
| Max Clock Frequency | 250 MHz - supports 500 MHz DDR data rate on both ports |
| Total Ionizing Dose | 300 krad(Si) - qualified for long-duration space missions |
| Latch-up Immunity | ≥120 MeV·cm²/mg at 125 °C - meets MIL-STD-883 TM1019.8 |
| Core Supply Voltage | 1.8 V ± 0.1 V - enables low-power, high-speed operation with tight regulation |
| I/O Supply Voltage | VDDQ = 1.4 V to VDD - supports HSTL-compatible signaling with variable drive strength |
| Neutron Fluence | 2.0 × 10¹⁴ n/cm² - validated survivability in high-altitude nuclear environments |
Pinout & Package
5962F1120202QXA is housed in a 165-ball Ceramic Column Grid Array (CCGA) package measuring 21 × 25 × 2.83 mm, qualified per MIL-PRF-38535 Class Q with hermetic sealing and full radiation screening.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D[17:0] | Synchronous write data input | 18-bit parallel data sampled on rising edge of K clock; supports byte-selectable writes via BWS0/BWS1 |
| Q[17:0] | Synchronous read data output | 18-bit parallel data driven on rising edges of K/K; tristated automatically when RPS is deasserted |
| RPS / WPS | Read/Write port select | Active-low synchronous controls enabling independent port activation for concurrent access |
| K / K | Dual input clocks | Identical differential clocks used for all timing; only rising edges control register sampling |
| CQ / CQ | Echo clocks | Output-synchronized copies of K/K aiding high-speed data capture in FPGA/ASIC receivers |
| QVLD | Valid data indicator | Asserted one cycle before first valid Q[17:0] word, enabling precise data strobing in receiver logic |
| DOFF | Dynamic output offset control | Enables calibration of output driver impedance matching to trace characteristics |
Key Features
| Feature | Design Value |
|---|---|
| Four-word burst architecture | Reduces address bus toggling frequency by 4× versus single-word access, lowering EMI and routing complexity |
| Separate read/write data paths | Eliminates bus turnaround delays, enabling true concurrent R/W operations without arbitration overhead |
| Integrated DLL | Ensures sub-cycle alignment between echo clocks (CQ/CQ) and data outputs, simplifying PCB layout and timing closure |
| JTAG 1149.1 test access port | Enables boundary scan testing, in-system programming verification, and post-deployment diagnostics |
| RadStop™ hardened design | Delivers production-qualified radiation performance without external shielding or derating penalties |
Applications
| Onboard Satellite Data Handling | Phased Array Radar Signal Buffering |
|---|---|
|
Use Scenario: Real-time buffering of telemetry packets and command execution queues in LEO satellite payloads. IC Role / Device Role / Timing Role: High-bandwidth, radiation-tolerant memory buffer interfacing directly with flight computer FPGA via HSTL I/O. Use Value: Concurrent read/write capability sustains >1 Gbps sustained throughput while meeting 300 krad TID and SEL immunity requirements. |
Use Scenario: Storing intermediate FFT and beamforming coefficients in active electronically scanned array (AESA) radar transceivers. IC Role / Device Role / Timing Role: Low-latency, deterministic-access SRAM providing synchronized data staging between ADC/DAC and DSP cores. Use Value: 2-cycle read latency and echo clocks enable precise timing alignment critical for phase-coherent signal processing. |
| Avionics Flight Control Memory | Nuclear Monitoring Instrumentation |
|
Use Scenario: Storing real-time sensor fusion results and actuator command histories in triple-modular-redundant (TMR) flight control units. IC Role / Device Role / Timing Role: Radiation-hardened working memory supporting lockstep processor pairs with SECDED ECC co-processing. Use Value: Verified ≤1 × 10⁻¹⁰ upsets/bit-day soft error rate ensures integrity over 15-year service life without periodic scrubbing. |
Use Scenario: Capturing and buffering pulse-height spectra from neutron/gamma detectors in reactor containment zones. IC Role / Device Role / Timing Role: High-fluence survivable memory capturing transient events at microsecond resolution during neutron bursts. Use Value: 2.0 × 10¹⁴ n/cm² neutron fluence rating allows uninterrupted operation in high-radiation monitoring environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar radiation-hardened QDR SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CYRS1543AV18 | Commercial-grade version; identical electrical specs but unqualified to MIL-PRF-38535 Class Q or radiation limits | Lacks radiation screening, TID validation, and SEL immunity certification - suitable only for ground-test or non-flight prototypes | Select only for lab validation prior to flight hardware integration; not acceptable for flight units |
| IS61WV102418BLL-10TLI | Non-radiation-hardened 18-Mbit QDR-II SRAM; 10 ns access, no RadStop, no neutron/TID qualification | Cannot operate in space or nuclear environments; lacks echo clocks, DLL, and JTAG support | Use only in benign terrestrial systems where radiation effects are irrelevant and cost is primary constraint |
Compared with CYRS1543AV18 and IS61WV102418BLL-10TLI, 5962F1120202QXA uniquely delivers flight-certified radiation hardness, concurrent R/W bandwidth, and system-level timing aids (CQ, QVLD, DLL) required for safety-critical aerospace deployments.
Availability
5962F1120202QXA is available at Aetrix Electronics and suitable for satellite payload development, phased-array radar subsystems, avionics flight control units, and nuclear instrumentation requiring stable component supply with full traceability and extended lifecycle support.
Supply support for 5962F1120202QXA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-reliability memory, PSoC, and programmable solutions for aerospace, industrial, and automotive markets.
This device belongs to Cypress's RadHard QDR II+ SRAM product line, engineered specifically for mission-critical spaceborne and defense electronics where radiation tolerance, deterministic timing, and long-term reliability supersede cost or power efficiency.
FAQ
What is the maximum operating temperature range for 5962F1120202QXA?
The 5962F1120202QXA is screened and qualified for operation from –55 °C to +125 °C per MIL-PRF-38535 Class Q requirements. Electrical parameters are guaranteed across this full range, including AC timing, DC leakage, and radiation performance metrics such as latch-up immunity and soft error rate.
Does 5962F1120202QXA require external termination resistors?
No. The device integrates programmable on-die termination (ODT) controlled via ZQ pin and internal calibration circuitry. When ZQ is pulled high, dynamic impedance tuning aligns output drivers to 50 Ω (±10%) for HSTL-18 signaling, eliminating need for discrete termination networks.
How is the four-word burst sequence aligned to the clock?
Each read or write transaction initiates a fixed four-word burst starting at the addressed location. Words are output/input on successive rising edges of K/K, with the first word aligned to the same edge that latched the address - ensuring deterministic, zero-jitter burst timing essential for coherent signal processing.
Can 5962F1120202QXA be used without enabling the DLL?
Yes, but with timing penalty: DLL disable increases read latency from 2 cycles to 3 cycles and removes echo clock alignment accuracy. For systems requiring strict setup/hold margins at 250 MHz, DLL must be enabled; its use is mandatory for flight-critical timing compliance per the device's qualification test plan.
5962F1120202QXA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 165-BFCPGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, QDR II+
- Memory Size:
- 72Mbit
- Memory Organization:
- 2M x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 250 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 1.9V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- 165-CCGA (21x25)
5962F1120202QXA FAQ
1.How can I place an order for 5962F1120202QXA through Aetrix?
Please submit a Request for Quotation (RFQ) for 5962F1120202QXA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 5962F1120202QXA reliable?
The price and inventory of 5962F1120202QXA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 5962F1120202QXA is usually 5 days.
3.What payment methods are accepted for 5962F1120202QXA?
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4.How is shipping managed for 5962F1120202QXA?
5962F1120202QXA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 5962F1120202QXA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 5962F1120202QXA?
For technical support, including 5962F1120202QXA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 5962F1120202QXA requirements.
6.How does Aetrix verify that 5962F1120202QXA is sourced from the original manufacturer or authorized distributors?
All 5962F1120202QXA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 5962F1120202QXA meets industry standards.
7.What is the process for return or replacement of 5962F1120202QXA?
All 5962F1120202QXA units undergo pre-shipment inspection (PSI). If there is an issue with 5962F1120202QXA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 5962F1120202QXA part is unused and in its original packaging.
Return procedure for 5962F1120202QXA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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