My Inquiry
My Account
Renesas 6116LA25SOGI
- Part No.:
- 6116LA25SOGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 24-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
6116LA25SOGI.pdf
- Description:
- IC SRAM 16KBIT PARALLEL 24SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,369
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
The 6116LA25SOGI from Renesas Electronics is a 16K-bit (2K × 8) low-power CMOS static RAM with 25ns access time, industrial temperature range (–40°C to +85°C), TTL-compatible I/O, and 2V data retention capability. It operates at 5.0V ±10%, consumes ≤85mA active current and only 0.1µA in full standby mode, and is used in battery-backed memory subsystems for embedded controllers and instrumentation.
For engineers reviewing the 6116LA25SOGI datasheet, 6116LA25SOGI pinout, 6116LA25SOGI application, or 6116LA25SOGI equivalent, key selection criteria include industrial-grade reliability, ultra-low standby power for extended battery life, guaranteed 25ns read cycle timing, and SOIC-24 gull-wing packaging compatible with automated PCB assembly.
Technical Context
This device implements a fully static asynchronous architecture-no clocks or refresh cycles required-using high-reliability CMOS technology that eliminates alpha-particle soft errors. Its control logic supports three distinct operational modes: active read/write (CS = L), high-impedance standby (CS = H, TTL-level), and ultra-low-power data retention (CS = H, CMOS-level with VCC ≥ 2.0V).
Timing behavior is defined by overlapping control signals: read cycles require CS and OE low with WE high; write cycles require CS and WE both low. All address (A0–A10) and data (I/O0–I/O7) lines are bidirectional and directly TTL-compatible, enabling seamless integration with legacy microprocessor buses without level-shifting.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 2K × 8-bit (16,384 bits), byte-wide parallel interface |
| Access Time (tAA) | 25ns max - guarantees deterministic read latency for real-time control loops |
| Supply Voltage | 5.0V ±10% - compatible with standard 5V logic rails and industrial power supplies |
| Operating Temperature | –40°C to +85°C - qualified for industrial environments including factory automation and outdoor telemetry |
| Standby Current (ISB1) | 0.1µA max at VCC = 5.5V - enables multi-year battery backup using coin cells |
| Data Retention Voltage | 2.0V min - maintains stored data during brownout or main power loss |
| Package | 24-pin SOIC (PSG24), gull-wing, 300-mil width - RoHS-compliant surface-mount footprint |
Pinout & Package
6116LA25SOGI is housed in a 24-pin Small Outline Integrated Circuit (SOIC) package with gull-wing leads (package code PSG24), 300-mil body width, and JEDEC MS-012AC compliant dimensions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A10 | Address Inputs | 11-bit address bus selecting one of 2048 memory locations |
| I/O0–I/O7 | Bidirectional Data Bus | 8-bit parallel data path for read/write operations; high-impedance when disabled |
| CS | Chip Select | Active-low enable; drives device into ultra-low-power ISB1 mode when high |
| OE | Output Enable | Active-low control for output drivers; allows multiplexed bus sharing |
| WE | Write Enable | Active-low signal qualifying write cycles; latches data on falling edge |
| VCC | Power Supply | +5V supply pin; decoupling capacitor required per datasheet layout guidelines |
| GND | Ground Reference | Signal and power ground return; must be low-inductance connection |
Key Features
| Feature | Design Value |
|---|---|
| Static Operation | No clock or refresh circuitry needed - simplifies system design and eliminates dynamic power overhead |
| Battery Backup Retention | Operates down to 2.0V with ≤0.9µA ISB1 - enables years-long data hold on CR2032 or similar cells |
| TTL Compatibility | VIH = 2.2V min, VIL = 0.8V max - interoperable with 74LS, 74HC, and microcontroller GPIO without buffers |
| Military/Industrial Qualification | MIL-STD-883 Class B compliance and –40°C to +85°C operation - validated for harsh environments |
| Soft-Error Immunity | CMOS process eliminates alpha-particle-induced bit flips - critical for unattended systems |
Applications
| Industrial PLC Data Logging | Medical Device Parameter Storage |
|---|---|
Use Scenario: Storing calibration coefficients and runtime event logs in programmable logic controllers deployed in factory settings with wide ambient temperature swings. IC Role / Device Role / Timing Role: Nonvolatile scratchpad memory holding volatile configuration data between power cycles; accessed asynchronously by ARM Cortex-M4 host. Use Value: 25ns tAA ensures log writes complete within tight scan-cycle deadlines; 0.1µA ISB1 extends backup battery life beyond 10 years. | Use Scenario: Retaining patient-specific therapy parameters and fault history in portable infusion pumps requiring FDA-cleared long-term data integrity. IC Role / Device Role / Timing Role: Battery-backed SRAM serving as secure, fast-access parameter store; isolated from main power rail via diode-OR circuit. Use Value: Guaranteed 2.0V data retention voltage prevents corruption during AC power dropouts; industrial temp rating validates operation inside sealed enclosures. |
| Avionics Sensor Buffering | Test Equipment Configuration Memory |
Use Scenario: Temporarily caching high-speed ADC samples from inertial measurement units (IMUs) before DMA transfer to flash in airborne navigation systems. IC Role / Device Role / Timing Role: Low-latency, low-power buffer memory interfaced directly to FPGA fabric; CS toggled per burst acquisition window. Use Value: 25ns access time matches 40MHz sampling rate requirements; SOIC-24 package supports reflow-soldered high-reliability assemblies. | Use Scenario: Holding instrument-specific calibration tables and user-defined test sequences in benchtop oscilloscopes and signal generators. IC Role / Device Role / Timing Role: Static RAM mapped into microcontroller's external memory space; accessed during boot and setup routines. Use Value: TTL compatibility eliminates level translators; industrial temperature range ensures stable operation during extended burn-in tests at elevated ambient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS6C1008-25ZIN | 25ns access, 2K × 8, 5V, industrial temp, SOIC-28 - larger package, higher ICC1 (120mA vs. 85mA) | Requires PCB pad redesign; suited for designs needing marginally lower tOHZ (3ns vs. 5ns) | Select if board layout accommodates SOIC-28 and higher active current is acceptable |
| IS61LV256AL-25KLI | 25ns access, 32K × 8, 3.3V core, industrial temp, SOIC-28 - different voltage domain and density | Needs level translation for 5V systems; offers double memory capacity but incompatible VCC | Choose only when upgrading to 3.3V architecture and requiring >16K-bit capacity |
Compared with AS6C1008-25ZIN and IS61LV256AL-25KLI, the 6116LA25SOGI delivers optimal balance of ultra-low standby power (0.1µA), strict 5V TTL compatibility, and compact SOIC-24 footprint-making it the preferred choice for space-constrained, battery-sensitive industrial designs where voltage and package compatibility are non-negotiable.
Availability
6116LA25SOGI is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and avionics subsystems requiring stable component supply, long-lifecycle support, and guaranteed industrial temperature performance.
Supply support for 6116LA25SOGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.
The 6116LA25SOGI belongs to Renesas' legacy CMOS SRAM product line, engineered specifically for high-reliability, low-power, battery-backed memory applications in industrial and aerospace systems where data integrity and long-term availability are critical.
FAQ
What is the maximum operating temperature range for the 6116LA25SOGI?
The 6116LA25SOGI is rated for industrial temperature operation from –40°C to +85°C. This specification is guaranteed across all electrical parameters in the datasheet, including access time, standby current, and data retention voltage. The device meets MIL-STD-883 Class B screening for enhanced reliability under thermal stress, making it suitable for deployment in factory floors, outdoor monitoring equipment, and enclosed industrial enclosures without forced cooling.
Does the 6116LA25SOGI require external refresh circuitry?
No, the 6116LA25SOGI is a fully static RAM and requires no external refresh circuitry or clocks. Its CMOS latch-based memory cells retain data indefinitely as long as power is applied and CS remains low during active use. When CS is high, the device enters standby or data retention mode automatically-eliminating timing-critical refresh management and reducing system-level complexity and power consumption.
What is the minimum supply voltage required to retain data in the 6116LA25SOGI?
The 6116LA25SOGI guarantees data retention down to 2.0V (VDR = 2.0V min), as specified in the Data Retention Characteristics table. At this voltage, typical ICCDR is 0.5µA for commercial grade and 1.5µA for industrial grade. This enables reliable operation from primary lithium or coin-cell batteries during main power failure, with retention time limited only by battery self-discharge-not by the IC's internal leakage.
Is the 6116LA25SOGI pin-compatible with other 6116-series variants?
Yes, the 6116LA25SOGI shares identical pinout and functional behavior with all 6116SA/LA family members in the same SOIC-24 (PSG24) package, including 6116SA25SOGI and 6116LA20SOGI. Address, data, and control signals map identically; only timing parameters (tAA, tWC) and power characteristics (ICC1, ISB1) differ per speed/power grade. No PCB changes are required when substituting within the same package variant.
What package type does the 6116LA25SOGI use, and is it RoHS-compliant?
The 6116LA25SOGI uses a 24-pin Small Outline Integrated Circuit (SOIC) package with gull-wing leads (JEDEC MS-012AC), 300-mil body width, and package code PSG24. Per Renesas' 2011 rebranding update and ordering information, this part is designated "Green", confirming full compliance with RoHS Directive 2011/65/EU and absence of lead, mercury, cadmium, hexavalent chromium, PBB, and PBDE.
6116LA25SOGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 24-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Kbit
- Memory Organization:
- 2K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 25ns
- Access Time:
- 25 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-SOIC
6116LA25SOGI FAQ
1.How can I place an order for 6116LA25SOGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 6116LA25SOGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 6116LA25SOGI reliable?
The price and inventory of 6116LA25SOGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 6116LA25SOGI is usually 5 days.
3.What payment methods are accepted for 6116LA25SOGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 6116LA25SOGI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 6116LA25SOGI?
6116LA25SOGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 6116LA25SOGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 6116LA25SOGI?
For technical support, including 6116LA25SOGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 6116LA25SOGI requirements.
6.How does Aetrix verify that 6116LA25SOGI is sourced from the original manufacturer or authorized distributors?
All 6116LA25SOGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 6116LA25SOGI meets industry standards.
7.What is the process for return or replacement of 6116LA25SOGI?
All 6116LA25SOGI units undergo pre-shipment inspection (PSI). If there is an issue with 6116LA25SOGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 6116LA25SOGI part is unused and in its original packaging.
Return procedure for 6116LA25SOGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
6116LA25SOGI Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
