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Renesas 6116SA20TDB
- Part No.:
- 6116SA20TDB
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 24-CDIP (0.300", 7.62mm)
- Datasheet:
-
6116SA20TDB.pdf
- Description:
- IC SRAM 16KBIT PARALLEL 24CDIP
- Quantity:
- Payment:
- Shipping:
Inventory:2,369
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Product details
Overview
The 6116SA20TDB from Renesas Electronics is a 16K-bit (2K × 8) high-speed CMOS static RAM with 20ns maximum access time, TTL-compatible I/O, and military-grade reliability compliant to MIL-STD-883 Class B. It operates across –55°C to +125°C, consumes ≤40mA active current (ICC1), supports standby power mode via chip select, and is housed in a 24-pin ceramic DIP (SD24) package. It serves as nonvolatile data buffer in avionics control units requiring deterministic timing and radiation-tolerant memory.
For engineers reviewing the 6116SA20TDB datasheet, 6116SA20TDB pinout, 6116SA20TDB application, or 6116SA20TDB equivalent, key selection criteria include guaranteed 20ns read cycle time under military temperature extremes, CS-controlled standby current of 40mA (TTL level), full static operation without refresh, 5V ±10% supply compatibility, and ceramic DIP packaging for thermal and mechanical robustness in harsh environments.
Technical Context
This device implements fully static asynchronous architecture-no clocks, no refresh cycles-enabling deterministic timing in real-time embedded systems. Its dual-mode standby (TTL-level ISB = 40mA; CMOS-level ISB1 = 2mA) allows flexible power management based on control signal logic thresholds.
The memory array uses advanced CMOS process with alpha-particle soft-error mitigation, and all inputs/outputs meet TTL voltage thresholds (VIH ≥ 2.2V, VIL ≤ 0.8V) while operating at 5V ±10%. Functional truth table defines four operational modes: Standby (CS HIGH), Read (CS & OE LOW, WE HIGH), Write (CS & WE LOW), and High-Z output control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 16,384 bits (2K × 8 organization) - supports byte-wide data bus interfacing without external demultiplexing. |
| Access Time (tAA) | 20 ns max (military grade, –55°C to +125°C) - ensures predictable latency in hard real-time avionics timing budgets. |
| Supply Voltage | 5.0 V ±10% - compatible with legacy 5V TTL/CMOS system rails without level-shifting circuitry. |
| Operating Current (ICC1) | 130 mA max (military grade) - defines worst-case power draw during continuous read/write activity. |
| Standby Current (ISB) | 50 mA max (TTL-level CS HIGH, military grade) - enables low-power sleep state when deselected by system controller. |
| Input/Output Compatibility | TTL-compatible (VIH ≥ 2.2 V, VIL ≤ 0.8 V) - ensures direct interface with 74LS/ALS logic families without buffers. |
| Package | 24-pin ceramic DIP (SD24, 300 mil) - provides hermetic sealing, thermal stability, and MIL-STD-883 Class B qualification. |
Pinout & Package
Package: 24-pin ceramic dual in-line package (CDIP), SD24 code, 300 mil body width, through-hole mounting.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A10 | Address Inputs | 11-bit address bus accepting 0–2047 row/column decode for 2K-word access; latched on CS transition. |
| I/O0–I/O7 | Bi-directional Data Bus | 8-bit parallel data path; tri-stated during Standby and Write cycles per OE/WE control logic. |
| CS | Chip Select | Active-low enable; drives device into standby (ISB) when HIGH, enabling system-level power gating. |
| WE | Write Enable | Active-low write strobe; initiates write cycle only when CS is also LOW (overlap condition). |
| OE | Output Enable | Active-low control for output drivers; disables I/O drivers to prevent bus contention during reads. |
| VCC | Power Supply | +5V ±10% main supply; powers core logic and I/O buffers; decoupling required per MIL-STD-883 layout rules. |
| GND | Ground Reference | Signal and power return; requires low-inductance connection to minimize noise coupling in mixed-signal boards. |
Key Features
| Feature | Design Value |
|---|---|
| Static Operation | No clock or refresh required - eliminates timing-critical refresh overhead in safety-critical firmware. |
| MIL-STD-883 Class B Compliance | Qualified for military temperature range (–55°C to +125°C) and screening - meets DO-254/ED-80 requirements for airborne hardware. |
| Battery Backup Support (LA variant only) | Not applicable to 6116SA20TDB - SA version lacks 2V data retention; LA variants support µW-level retention but this part is SA. |
| Alpha-Particle Soft-Error Mitigation | CMOS process reduces single-event upsets - critical for high-altitude or space-adjacent applications where cosmic radiation is present. |
| Multiple Package Options | SD24 ceramic DIP selected here - offers superior thermal conductivity and hermeticity vs. plastic DIP or SOIC for mission-critical use. |
Applications
| Avionics Flight Control Unit | Secure Military Radio Baseband Processor |
|---|---|
|
Use Scenario: Real-time storage of sensor fusion coefficients and flight envelope limits in fly-by-wire ECUs. IC Role / Device Role / Timing Role: Primary working memory for deterministic interrupt service routines with sub-25ns latency tolerance. Use Value: 20ns tAA and MIL-STD-883 qualification ensure timing compliance under extreme thermal cycling and vibration. |
Use Scenario: Buffering encrypted voice packet headers and cryptographic key segments in Type 1 COMSEC radios. IC Role / Device Role / Timing Role: Secure SRAM holding sensitive intermediate values during AES-256 execution cycles. Use Value: Ceramic DIP package and alpha-hardened CMOS reduce susceptibility to fault injection attacks and SEU-induced corruption. |
| Tactical Vehicle Engine Management System | Undersea Sonar Signal Preprocessor |
|
Use Scenario: Storing calibrated fuel injection maps and knock sensor thresholds in armored vehicle ECUs. IC Role / Device Role / Timing Role: Nonvolatile shadow RAM updated during maintenance windows; accessed at boot for engine startup sequence. Use Value: Full -55°C to +125°C operation prevents cold-start failures in arctic deployments and thermal runaway in desert conditions. |
Use Scenario: Temporary storage of digitized hydrophone samples prior to FFT processing in towed array sonar systems. IC Role / Device Role / Timing Role: Low-jitter, deterministic-access buffer synchronizing ADC output with DSP pipeline clock domains. Use Value: TTL-compatible I/O and 5V supply simplify integration with legacy analog front-end ASICs and discrete op-amp stages. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 6116SA20DB | Same speed (20ns), same military temp grade, but 600-mil ceramic DIP (CD24) package - larger footprint, higher thermal mass. | Preferred where board-level shock resistance and thermal inertia outweigh PCB area constraints. | Select 6116SA20DB if mechanical ruggedness and thermal stability under rapid ambient shifts are prioritized over compact layout. |
| 6116SA25TDB | Slower 25ns access time, otherwise identical military-grade SD24 ceramic DIP package and electrical specs. | Suitable for cost-sensitive or lower-bandwidth subsystems where 5ns latency margin is acceptable. | Choose 6116SA25TDB when system timing budget permits relaxed access time and procurement cost is a primary factor. |
Compared with 6116SA20DB, the 6116SA20TDB saves board space with its 300-mil SD24 package while maintaining identical speed and military qualification; versus 6116SA25TDB, it delivers 5ns tighter timing headroom essential for high-throughput control loops.
Availability
6116SA20TDB is available at Aetrix Electronics and suitable for avionics flight control, secure military radio, tactical vehicle ECU, and undersea sonar applications requiring stable component supply across extended product lifecycles and extreme environmental conditions.
Supply support for 6116SA20TDB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The IDT6116SA/LA family-now rebranded under Renesas-was designed specifically for high-reliability, static-memory applications in military, aerospace, and industrial control systems demanding zero-refresh operation and extended temperature resilience.
FAQ
What is the maximum operating temperature range for the 6116SA20TDB?
The 6116SA20TDB is rated for operation from –55°C to +125°C, meeting MIL-STD-883 Class B environmental screening requirements. This full military temperature range is confirmed in the Absolute Maximum Ratings table and supported by DC/AC characterization across the entire span. The SD24 ceramic DIP package contributes to thermal stability under sustained high-temperature bias conditions.
Does the 6116SA20TDB support battery backup data retention?
No, the 6116SA20TDB does not support battery backup data retention. That capability is exclusive to the LA variant (e.g., 6116LA20TDB), which specifies 2V data retention voltage and µW-level retention current. The "SA" suffix denotes Standard Power, and the datasheet explicitly states battery backup is "LA version only." Using 6116SA20TDB in retention-critical designs requires external backup circuitry.
What is the pin-compatible replacement for 6116SA20TDB in the same SD24 package?
Within the same SD24 24-pin ceramic DIP footprint, the 6116SA25TDB is pin-compatible with the 6116SA20TDB. Both share identical pinout, voltage levels, timing control logic, and mechanical dimensions. The sole functional difference is the guaranteed maximum access time: 25ns vs. 20ns. No PCB changes are required for substitution where timing margins allow.
What are the DC supply current specifications for 6116SA20TDB under military conditions?
Per the datasheet's Table 8, for 6116SA20TDB (military grade), ICC1 (operating current, CS < VIL) is 130 mA max at VCC = 5.5 V and f = 0; ISB (TTL-level standby current, CS > VIH) is 50 mA max under the same conditions. These values are measured across –55°C to +125°C and define worst-case power delivery requirements for system design.
Is the 6116SA20TDB RoHS-compliant and lead-free?
Yes, the 6116SA20TDB is a "Green" part per Renesas' ordering information (Document Revision Jul.17.20), indicating compliance with RoHS Directive 2011/65/EU and absence of lead, mercury, cadmium, hexavalent chromium, PBB, and PBDE. The SD24 ceramic DIP package uses lead-free terminations and halogen-free molding compounds, verified in Renesas' material declarations.
6116SA20TDB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 24-CDIP (0.300", 7.62mm)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 16Kbit
- Memory Organization:
- 2K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 20ns
- Access Time:
- 20 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- 24-CDIP
6116SA20TDB FAQ
1.How can I place an order for 6116SA20TDB through Aetrix?
Please submit a Request for Quotation (RFQ) for 6116SA20TDB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 6116SA20TDB reliable?
The price and inventory of 6116SA20TDB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 6116SA20TDB is usually 5 days.
3.What payment methods are accepted for 6116SA20TDB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 6116SA20TDB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 6116SA20TDB?
6116SA20TDB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 6116SA20TDB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 6116SA20TDB?
For technical support, including 6116SA20TDB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 6116SA20TDB requirements.
6.How does Aetrix verify that 6116SA20TDB is sourced from the original manufacturer or authorized distributors?
All 6116SA20TDB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 6116SA20TDB meets industry standards.
7.What is the process for return or replacement of 6116SA20TDB?
All 6116SA20TDB units undergo pre-shipment inspection (PSI). If there is an issue with 6116SA20TDB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 6116SA20TDB part is unused and in its original packaging.
Return procedure for 6116SA20TDB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
6116SA20TDB Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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