Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas 6116SA25TDB

Part No.:
6116SA25TDB
Manufacturer:
Renesas
Category:
Memory
Package:
24-CDIP (0.300", 7.62mm)
Datasheet:
Aetrix6116SA25TDB.pdf
Description:
IC SRAM 16KBIT PARALLEL 24CDIP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,708

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

6116SA25TDB from Renesas Electronics is a 16K-bit (2K × 8) high-speed CMOS static RAM with 25ns maximum access time, TTL-compatible I/O, and military-grade reliability compliant to MIL-STD-883 Class B. It operates across –55°C to +125°C, features automatic standby mode on chip select high, and uses 24-pin ceramic DIP (SD24) packaging for harsh-environment embedded memory applications.

For engineers reviewing the 6116SA25TDB datasheet, 6116SA25TDB pinout, 6116SA25TDB application, or 6116SA25TDB equivalent, this device serves as a drop-in replacement for legacy 2K×8 SRAMs in avionics, defense systems, and industrial controllers where radiation-hardened timing stability and extended temperature operation are critical.

Technical Context

This static RAM employs fully asynchronous, clockless architecture requiring no refresh cycles. Its dual-level standby control supports both TTL-level (ISB = 45mA max) and CMOS-level (ISB1 = 10mA max) chip deselect, enabling system-level power savings during idle periods without external logic.

The device integrates a 128×128 memory array with address decoding, I/O control, and input data circuitry-all fabricated in high-reliability CMOS to suppress alpha-particle soft errors. All 11 address lines (A0–A10), 8 bidirectional data lines (I/O0–I/O7), and three control inputs (CS, WE, OE) are directly TTL-compatible with VIH = 2.2V min and VIL = 0.8V max at VCC = 5.0V ±10%.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization2K × 8-bit (16,384 bits), enabling byte-wide data access without multiplexing
Access Time (tAA)25ns max at VCC = 5.0V ±10%, –55°C to +125°C - guarantees deterministic read latency in real-time systems
Supply Voltage4.5V to 5.5V - compatible with standard 5V TTL logic rails and legacy power domains
Operating Temperature–55°C to +125°C - qualified for airborne, missile, and space-qualified platforms per MIL-STD-883 Class B
Standby Current (ISB)45mA max (TTL-level CS high) - reduces system power during inactive states without auxiliary circuitry
Input/Output CompatibilityTTL-compatible VIH/VIL thresholds - eliminates level-shifting requirements when interfacing with 74LS/ALS logic families
Package24-pin ceramic DIP (SD24, 300-mil width) - provides hermetic sealing and thermal robustness for high-reliability PCBs

Pinout & Package

24-pin ceramic DIP (SD24) package with 300-mil width, hermetically sealed for military environmental resilience.

Pin/TerminalCircuit RoleDesign Meaning
A0–A10Address Inputs11-bit address bus accepting full 2K address space; no address multiplexing required
I/O0–I/O7Bidirectional Data Bus8-bit parallel interface supporting simultaneous read/write operations without external transceivers
CSChip SelectActive-low enable controlling device activation and automatic entry into low-power standby mode
WEWrite EnableActive-low signal initiating write cycle; combined with CS defines write window per JEDEC timing
OEOutput EnableActive-low control for output drivers; allows shared bus operation with tri-state isolation
VCCPower Supply+5V supply pin with 4.5–5.5V operating range; decoupling required per MIL-STD-883 layout guidelines
GNDGround ReferenceSignal and power ground reference; must be connected to low-impedance chassis ground in military designs

Key Features

FeatureDesign Value
Static OperationNo clocks or refresh cycles needed - simplifies timing design and eliminates DRAM controller overhead
Military QualificationMIL-STD-883 Class B compliance ensures tested performance under shock, vibration, and temperature cycling
Low-Power StandbyAutomatic transition to ISB = 45mA max on CS high - enables power gating without firmware intervention
Alpha-Particle ImmunityCMOS process minimizes soft-error rate - critical for mission-critical avionics and guidance systems
TTL CompatibilityDirect interface with legacy 74-series logic - avoids level shifters and reduces BOM count in retrofitted systems

Applications

Avionics Flight Control UnitsTactical Radio Transceivers

Use Scenario: Real-time storage of sensor fusion coefficients and flight envelope limits in fly-by-wire ECUs.

IC Role / Device Role / Timing Role: Non-volatile scratchpad memory holding calibrated lookup tables accessed at ≤25ns latency during servo loop execution.

Use Value: Deterministic 25ns tAA ensures coefficient reads complete within tight 50µs control cycle deadlines without pipeline stalls.

Use Scenario: Buffering encrypted voice packets in handheld military radios operating across desert and arctic environments.

IC Role / Device Role / Timing Role: High-reliability SRAM providing temporary packet staging before RF modulation, surviving –55°C cold soak and +125°C chassis heat.

Use Value: SD24 ceramic DIP package maintains electrical integrity under thermal shock, eliminating solder joint fatigue failures in field-deployed units.

Missile Guidance ProcessorsIndustrial Programmable Logic Controllers

Use Scenario: Storing inertial navigation state vectors and Kalman filter residuals in guided munition seekers.

IC Role / Device Role / Timing Role: Radiation-tolerant memory retaining critical trajectory data during launch acceleration and midcourse maneuvers.

Use Value: CMOS process and MIL-STD-883 qualification suppress alpha-induced bit flips, ensuring navigation integrity during terminal phase.

Use Scenario: Caching ladder logic scan results and I/O image registers in oil-refinery DCS controllers exposed to EMI-rich motor drive zones.

IC Role / Device Role / Timing Role: Electrically noise-immune SRAM interfacing directly with 5V PLC backplane buses without isolation buffers.

Use Value: TTL-compatible VIH/VIL thresholds prevent false triggering from 200mV EMI spikes common near VFDs and contactors.

Equivalent & Alternatives

The following parts are listed as comparable options for similar static RAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
6116LA25TDBLower standby current (ISB1 = 0.9mA vs. 10mA), battery-retention capable (2V VDR), but same 25ns speed and SD24 packagePreferred for battery-backed systems requiring data retention during main power lossSelect 6116LA25TDB only if 2V data retention and sub-1mA standby are mandatory; otherwise 6116SA25TDB offers higher noise margin in noisy power environments
IS61C256AL-25MLI256K-bit (32K×8) density, 25ns speed, SOIC-28 package, commercial/industrial temp only (–40°C to +85°C)Suitable for cost-sensitive industrial upgrades where board space permits SOIC and extended military temp is not requiredChoose IS61C256AL-25MLI only for non-military applications needing higher density; incompatible with MIL-STD-883 qualification and SD24 footprint

Compared with 6116LA25TDB and IS61C256AL-25MLI, the 6116SA25TDB uniquely balances military temperature range, hermetic SD24 packaging, and proven field reliability-making it irreplaceable in safety-critical platforms where qualification traceability and thermal survivability outweigh density or ultra-low-power trade-offs.

Availability

6116SA25TDB is available at Aetrix Electronics and suitable for avionics, defense electronics, and industrial control systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 6116SA25TDB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, infrastructure, and IoT markets.

The 6116SA/LA family was designed specifically for high-reliability embedded memory applications demanding MIL-STD-883 qualification, extended temperature operation, and TTL compatibility in legacy and upgrade programs.

FAQ

What is the maximum operating temperature range for the 6116SA25TDB?

The 6116SA25TDB is rated for –55°C to +125°C operation and is fully qualified to MIL-STD-883 Class B, making it suitable for deployment in jet engine bays, missile canisters, and other extreme thermal environments where commercial or industrial grade SRAMs would fail.

Does the 6116SA25TDB require a refresh circuit or clock signal?

No, the 6116SA25TDB is a fully static RAM and requires no refresh cycles or clock signals. Its asynchronous architecture allows direct connection to microprocessor address/data buses without additional timing logic-reducing design complexity and board area in legacy 8-bit and 16-bit systems.

What package type does the 6116SA25TDB use, and is it lead-free?

The 6116SA25TDB uses a 24-pin ceramic DIP (SD24) package with 300-mil width. Per Renesas' 2020 rebranding and ordering documentation, this part is a green (lead-free) device compliant with RoHS Directive 2011/65/EU, with termination finish specified as matte tin.

Can the 6116SA25TDB be used as a direct replacement for older 6116 variants?

Yes, the 6116SA25TDB maintains pin-to-pin compatibility and identical AC/DC specifications with prior IDT-branded 6116SA25TDB units. Renesas retained all electrical, thermal, and mechanical characteristics during the rebranding, ensuring seamless drop-in replacement in existing military hardware.

What is the standby current consumption of the 6116SA25TDB when CS is high?

When CS is held HIGH, the 6116SA25TDB enters TTL-level standby mode with ISB ≤ 45mA (max) at VCC = 5.5V and TA = +125°C. For ultra-low-power scenarios, CMOS-level standby (ISB1 ≤ 10mA) is achieved when CS > VHC and input voltages are driven beyond valid logic thresholds.

6116SA25TDB Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
24-CDIP (0.300", 7.62mm)
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
16Kbit
Memory Organization:
2K x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
25ns
Access Time:
25 ns
Voltage - Supply:
4.5V ~ 5.5V
Operating Temperature:
-55°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Through Hole
Supplier Device Package:
24-CDIP

6116SA25TDB FAQ

1.How can I place an order for 6116SA25TDB through Aetrix?

Please submit a Request for Quotation (RFQ) for 6116SA25TDB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 6116SA25TDB reliable?

The price and inventory of 6116SA25TDB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 6116SA25TDB is usually 5 days.

3.What payment methods are accepted for 6116SA25TDB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 6116SA25TDB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 6116SA25TDB?

6116SA25TDB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 6116SA25TDB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 6116SA25TDB?

For technical support, including 6116SA25TDB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 6116SA25TDB requirements.

6.How does Aetrix verify that 6116SA25TDB is sourced from the original manufacturer or authorized distributors?

All 6116SA25TDB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 6116SA25TDB meets industry standards.

7.What is the process for return or replacement of 6116SA25TDB?

All 6116SA25TDB units undergo pre-shipment inspection (PSI). If there is an issue with 6116SA25TDB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 6116SA25TDB part is unused and in its original packaging.

Return procedure for 6116SA25TDB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

6116SA25TDB Tags

  • 6116SA25TDB
  • 6116SA25TDB PDF
  • 6116SA25TDB Datasheet
  • 6116SA25TDB Specifications
  • 6116SA25TDB Images
  • Renesas
  • Renesas 6116SA25TDB
  • Buy 6116SA25TDB
  • 6116SA25TDB Price
  • 6116SA25TDB Distributor
  • 6116SA25TDB Supplier
  • 6116SA25TDB Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER