Texas Instruments 66AK2G12ABYA60
- Part No.:
- 66AK2G12ABYA60
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 625-LFBGA, FCBGA
- Datasheet:
-
66AK2G12ABYA60.pdf
- Description:
- GALILEO FLIPCHIP
- Quantity:
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Product details
Overview
66AK2G12ABYA60 from Texas Instruments is a heterogeneous multicore System-on-Chip (SoC) integrating an Arm® Cortex®-A15 microprocessor (up to 1000 MHz), a C66x DSP core (up to 1000 MHz), dual PRU-ICSS subsystems, and hardware accelerators for networking (NAVSS), cryptography (SA/PKA), and audio (ASRC). It features 512KB L2 cache with ECC for Arm A15, 1MB L2 RAM with ECC for DSP, DDR3L EMIF supporting 4GB address space at 1066 MT/s, and industrial temperature range (–40°C to 125°C). It targets real-time industrial communications and high-fidelity audio processing systems.
For engineers reviewing the 66AK2G12ABYA60 datasheet, 66AK2G12ABYA60 pinout, 66AK2G12ABYA60 application, or 66AK2G12ABYA60 equivalent, this SoC delivers deterministic low-latency control via PRU-ICSS, IEEE 1588v2 time synchronization via CPTS, secure boot with OTP key storage, and dual-role USB 2.0 with xHCI support - critical for industrial gateway and professional audio endpoint designs requiring HLOS + real-time coexistence.
Technical Context
The 66AK2G12ABYA60 implements Keystone II architecture with tightly coupled Arm A15 and C66x DSP subsystems sharing access to MSMC-SRAM (1MB with ECC) and DDR EMIF (36-bit, DDR3L). Its dual PRU-ICSS each provide two programmable real-time units with 16KB program/ECC and 8KB data/ECC memory, CRC accelerators, and MII_RT Ethernet modules supporting PROFINET, EtherCAT, and EnDat 2.2.
Network processing leverages NAVSS with integrated PKTDMA and Queue Manager (128 queues, 2048 buffers), while cryptographic acceleration includes AES-128/192/256, SHA2-256, ECDSA, and TRNG. The ASRC supports up to 8 stereo streams with 140 dB SNR and sample rate conversion from 8 kHz to 216 kHz, enabling multi-format audio bridging in broadcast and studio equipment.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-A15 @ 1000 MHz with full Armv7-A ISA, SIMDv2 (Neon), VFPv4, and 32KB L1 I/D + 512KB L2 with ECC |
| DSP Core | C66x VLIW DSP @ 1000 MHz, object-code compatible with C64x+/C67x+, 32KB L1 I/D + 1024KB configurable L2 RAM/cache with ECC |
| Memory Interface | 36-bit DDR3L EMIF supporting 4GB address space at 1066 MT/s with 4-bit ECC on 32-bit bus |
| Industrial Peripherals | 2× PRU-ICSS (each with 2 PRUs, MII_RT, IEP, UART16550 @ 12 Mbps for PROFIBUS), 6× eHRPWM, 2× eCAP, 3× eQEP |
| Security & Crypto | Secure boot, 4KB OTP ROM, SA crypto engine with AES/SHA2/ECDSA/TRNG, PKA for elliptic curve operations |
| Audio & Timing | ASRC with 140 dB SNR, 8 stereo streams, 8–216 kHz sample rates; CPTS with IEEE 1588v2 timestamping; 7× 64-bit timers |
| Package & Temp | FCBGA-625 (21 mm × 21 mm), ABY suffix denotes Industrial Extended grade (–40°C to 125°C junction) |
Pinout & Package
66AK2G12ABYA60 uses a 625-ball FCBGA package (ABY) with 21.0 mm × 21.0 mm body size and 0.8 mm ball pitch. Power domains include DVDD_DDR (1.35 V), DVDD18 (1.8 V), DVDD33 (3.3 V), and multiple analog/PLL supply rails (AVDDA_XXX).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DDR3_CASn / DDR3_RASn / DDR3_WEn | DDR3 Command Control | Active-low command signals for DRAM row/column access and write enable; SSTL_135 I/O standard, 1.35 V domain |
| DDR3_CLKOUT_P0/N0 | DDR3 Clock Output | Differential clock pair driving external DDR3 memory; requires matched trace length and termination |
| DCAN0_TX / DCAN0_RX | CAN Bus Interface | High-speed CAN v2.0B transceiver pins supporting up to 1 Mbps; 3.3 V LVCMOS with internal pull-up/pull-down |
| CPTS_REFCLK_P / CPTS_REFCLK_N | Precision Time Reference | LVDS input pair for IEEE 1588v2 grandmaster clock reference; enables sub-microsecond timestamp accuracy |
| BOOTCOMPLETE | Boot Status Indicator | Open-drain output signaling successful completion of primary boot sequence; pulled up to 3.3 V externally |
Key Features
| Feature | Design Value |
|---|---|
| PRU-ICSS Dual Subsystem | Each provides two independent real-time engines with dedicated 16KB program/ECC and 8KB data/ECC memory, enabling deterministic I/O control without CPU intervention |
| NAVSS Network Acceleration | Integrated packet DMA and queue manager supporting 128 hardware queues and 2048 internal buffers - offloads TCP/IP and industrial protocol stack processing from Arm/DSP |
| ASRC Audio Conversion | Asynchronous sample rate converter with 140 dB SNR, 16–24-bit resolution, and automatic input frequency detection - eliminates clock domain mismatches in multi-source audio systems |
| Secure Boot & Key Storage | Hardware-enforced boot flow with encrypted image validation and 4KB OTP ROM for customer secondary keys - prevents firmware cloning and unauthorized updates |
| Industrial Temperature Range | Rated for –40°C to 125°C junction operation with full functionality, validated for extended power-on-hours (POH) in protection relays and transport control cabinets |
Applications
| Industrial Ethernet Gateway | Professional Audio Mixer |
|---|---|
|
Use Scenario: Real-time protocol translation between PROFINET, EtherCAT, and Modbus TCP in factory automation gateways. IC Role / Device Role / Timing Role: Dual PRU-ICSS handles deterministic MAC-layer processing and IEP-based cycle timing; Arm A15 runs Linux and protocol stacks; CPTS enables IEEE 1588v2 synchronization. Use Value: Eliminates need for external FPGA or ASIC by integrating PRU-based industrial Ethernet PHY offload and time-critical frame scheduling in single chip. |
Use Scenario: Multi-channel digital mixing console supporting simultaneous AES67, Dante, and MADI inputs with sample rate conversion. IC Role / Device Role / Timing Role: ASRC performs asynchronous conversion across 8 stereo streams; McASP interfaces with audio codecs; C66x DSP executes FIR filters and dynamics processing. Use Value: Achieves 140 dB SNR and jitter attenuation across mixed-clock audio sources, enabling broadcast-grade signal integrity without external SRC ICs. |
| Protection Relay Controller | Transportation Onboard Infotainment |
|
Use Scenario: High-reliability circuit breaker monitoring and fault response in railway traction substations. IC Role / Device Role / Timing Role: eQEP measures motor encoder position/speed; eCAP captures precise fault event timestamps; ECC-protected memories ensure SER resilience over 20+ years POH. Use Value: Meets IEC 61850-3 immunity and SIL-2 functional safety requirements via hardware error correction across processor cores, SRAM, and DDR interface. |
Use Scenario: In-vehicle multimedia hub integrating rear-seat video, Bluetooth audio, and vehicle CAN diagnostics. IC Role / Device Role / Timing Role: DSS drives LCD/HDMI displays; dual USB 2.0 DRD ports serve as host for peripherals and device for smartphone mirroring; DCAN interfaces with vehicle network. Use Value: Consolidates display, audio, connectivity, and vehicle bus functions into one SoC - reduces BOM count and inter-board cabling in constrained automotive ECU layouts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar heterogeneous multicore SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TDA2PXABCPZ | Arm Cortex-A15 + C66x DSP, but optimized for vision processing (ISP, GPU, DSS); lacks PRU-ICSS and industrial Ethernet peripherals | Better suited for ADAS camera processing than industrial control; no native support for PROFINET/EtherCAT offload | Select 66AK2G12ABYA60 when deterministic real-time I/O and industrial protocol acceleration are required over vision compute |
| AM5728BABCDA | Dual Arm Cortex-A15 + dual C66x DSP, higher core count but lower max frequency (1500 MHz A15, 750 MHz DSP); no PRU-ICSS; different memory subsystem | Targets high-throughput multimedia and Linux-rich applications; lacks integrated industrial Ethernet timing and capture modules | Choose 66AK2G12ABYA60 for compact industrial edge nodes needing PRU-based real-time control and smaller footprint (625 vs. 760 balls) |
Compared with TDA2PXABCPZ and AM5728BABCDA, the 66AK2G12ABYA60 uniquely combines Arm/DSP heterogeneity with dual PRU-ICSS, CPTS-based IEEE 1588v2, and ECC-hardened memory subsystem - making it the only option among the three qualified for SIL-2 industrial control and sub-microsecond time-critical I/O.
Availability
66AK2G12ABYA60 is available at Aetrix Electronics and suitable for industrial communications gateways, professional audio endpoints, protection relay controllers, and transportation infotainment systems requiring stable component supply across extended temperature and long lifecycle deployments.
Supply support for 66AK2G12ABYA60 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in industrial, automotive, and communications markets.
The 66AK2G1x family was designed specifically for industrial edge applications demanding both high-level OS support and hard real-time determinism - merging Arm application processing, DSP signal handling, and PRU-based I/O control in a single hardened SoC platform.
FAQ
What is the maximum DDR3L speed supported by the 66AK2G12ABYA60?
The 66AK2G12ABYA60 supports DDR3L memory at up to 1066 MT/s using its 36-bit external memory interface. This speed is achievable with proper PCB layout adherence to TI's DDR3L board design guidelines, including controlled impedance routing, fly-by topology, and on-die termination calibration. The interface also supports 4-bit ECC on a 32-bit data bus for enhanced reliability in industrial environments.
Does the 66AK2G12ABYA60 support secure boot, and how is it implemented?
Yes, the 66AK2G12ABYA60 supports hardware-enforced secure boot using a multi-stage process that validates cryptographic signatures of boot images before execution. It leverages 4KB of one-time programmable (OTP) ROM for storing customer-defined secondary keys and integrates AES-256 decryption engines to authenticate encrypted firmware. Secure boot is configurable for GP (General Purpose) or HS (High-Secure) device variants, with tamper-resistant key storage.
How many PRU-ICSS instances does the 66AK2G12ABYA60 include, and what protocols do they support?
The 66AK2G12ABYA60 includes two fully independent Programmable Real-Time Unit and Industrial Communication Subsystems (PRU-ICSS). Each supports MII_RT Ethernet with dual MII ports, industrial protocols including PROFINET RT, EtherCAT slave, EnDat 2.2, and Sigma-Delta demodulation, plus built-in IEP timers and UART16550 running at 12 Mbps for PROFIBUS. Both PRU-ICSS operate concurrently with zero interference to Arm or DSP cores.
What audio interfaces and sample rate capabilities does the 66AK2G12ABYA60 provide?
The 66AK2G12ABYA60 integrates three McASP peripherals (16/10/6 serializers), one McBSP, and an Asynchronous Sample Rate Converter (ASRC) supporting up to 8 stereo streams (16 channels) with 140 dB SNR. The ASRC accepts input sample rates from 8 kHz to 216 kHz and performs ratio-based conversion from 16:1 to 1:16, enabling seamless integration of diverse audio sources like AES67, Dante, and legacy S/PDIF without external SRC components.
Is the 66AK2G12ABYA60 pin-compatible with other devices in the 66AK2G1x family?
No, the 66AK2G12ABYA60 is not pin-compatible with other 66AK2G1x variants such as 66AK2G02 or 66AK2G05. While all share the same ABY FCBGA-625 package outline, signal ball assignments differ significantly across the family due to varying peripheral configurations - for example, PRU-ICSS, McASP serializer count, and DDR interface width are not identical. Board design must be specific to the exact 66AK2G12ABYA60 variant.
66AK2G12ABYA60 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 66AK2G1x KeyStone II Multicore
- Package/Case:
- 625-LFBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- DSP+ARM®
- Interface:
- CAN, DMA, EBI/EMI, Ethernet, I2C, McASP, McBSP, MMC/SD, QSPI, SPI, UART, USB
- Clock Rate:
- 600MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 1MB
- Voltage - I/O:
- 1.8V, 3.3V
- Voltage - Core:
- 0.9V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 625-FCBGA (21x21)
66AK2G12ABYA60 FAQ
1.How can I place an order for 66AK2G12ABYA60 through Aetrix?
Please submit a Request for Quotation (RFQ) for 66AK2G12ABYA60 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 66AK2G12ABYA60 reliable?
The price and inventory of 66AK2G12ABYA60 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 66AK2G12ABYA60 is usually 5 days.
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66AK2G12ABYA60 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 66AK2G12ABYA60 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 66AK2G12ABYA60?
For technical support, including 66AK2G12ABYA60 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 66AK2G12ABYA60 requirements.
6.How does Aetrix verify that 66AK2G12ABYA60 is sourced from the original manufacturer or authorized distributors?
All 66AK2G12ABYA60 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 66AK2G12ABYA60 meets industry standards.
7.What is the process for return or replacement of 66AK2G12ABYA60?
All 66AK2G12ABYA60 units undergo pre-shipment inspection (PSI). If there is an issue with 66AK2G12ABYA60, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 66AK2G12ABYA60 part is unused and in its original packaging.
Return procedure for 66AK2G12ABYA60:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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