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Texas Instruments 66AK2G12ABYA60ES
- Part No.:
- 66AK2G12ABYA60ES
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 625-LFBGA, FCBGA
- Datasheet:
-
66AK2G12ABYA60ES.pdf
- Description:
- PROTOTYPE
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
66AK2G12ABYA60ES from Texas Instruments is a heterogeneous multicore System-on-Chip (SoC) integrating an Arm® Cortex®-A15 microprocessor (up to 1000 MHz), a C66x DSP core (up to 1000 MHz), dual PRU-ICSS subsystems, DDR3L interface (1066 MT/s), and hardware-accelerated crypto (AES/SHA/ECDSA). It delivers deterministic real-time control and high-throughput signal processing for industrial Ethernet gateways and audio infrastructure.
For engineers reviewing the 66AK2G12ABYA60ES datasheet, 66AK2G12ABYA60ES pinout, 66AK2G12ABYA60ES application, or 66AK2G12ABYA60ES equivalent, this SoC supports IEEE 1588v2 timestamping, eAVB, dual CAN 2.0B, PCIe 2.0 Gen2 RC/EP, and ASRC with 140 dB SNR - critical for time-sensitive networking and professional audio systems requiring synchronized multi-core execution.
Technical Context
The 66AK2G12ABYA60ES implements Keystone II architecture with full cache coherency between Arm A15 and C66x DSP via MSMC-SRAM (1 MB ECC-protected), enabling shared memory programming models. Its dual PRU-ICSS subsystems each provide two programmable real-time units with dedicated 16 KB program + 8 KB data RAM (ECC), CRC accelerators, and MII_RT/Ethernet PHY support for protocol offload.
Network processing is accelerated by NAVSS with PKTDMA and Queue Manager (128 queues, 2048 buffers), while security is enforced through SA crypto engine (AES-128/192/256, SHA2-256, PKA with ECDSA/ECDH) and secure boot using 4 KB OTP ROM - all operating within –40°C to 125°C industrial extended temperature range.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-A15 @ up to 1000 MHz with NEON/VFPv4, 32KB L1 I/D cache, 512KB L2 cache (ECC) |
| DSP Core | C66x VLIW DSP @ up to 1000 MHz, 32KB L1 I/D RAM, 1024KB configurable L2 (ECC) |
| Memory Interface | 36-bit DDR3L EMIF supporting 4 GB address space at 1066 MT/s with 4-bit ECC |
| Industrial Peripherals | 2× PRU-ICSS (each with 2 PRUs, MII_RT, IEP, UART16550 @ 12 Mbps for PROFIBUS) |
| Networking | Gigabit EMAC (RGMII/MII/RMII), eAVB, IEEE 1588v2 CPTS, NAVSS with 128 queues & 2048 buffers |
| Crypto Acceleration | SA engine with AES-128/192/256, SHA2-256, ECDSA/ECDH, TRNG, and 4 KB OTP for secure boot keys |
| Audio Processing | ASRC with 140 dB SNR, 8 stereo streams (16 channels), sample rates 8–216 kHz, linear-phase FIR filtering |
Pinout & Package
66AK2G12ABYA60ES is housed in a 21.0 mm × 21.0 mm FCBGA-625 (ABY) package with 1.0 mm ball pitch, designed for industrial thermal and mechanical reliability. Ball mapping follows TI's ABY pinout specification with dedicated power domains (DVDD_DDR @ 1.35 V, DVDD18 @ 1.8 V, DVDD33 @ 3.3 V) and SSTL-135 I/O for DDR3L interface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DDR3_CASn / DDR3_RASn / DDR3_WEn | DDR3 Command Signals | Active-low control lines for row/column address strobe and write enable; require matched trace lengths and termination per JEDEC DDR3L spec |
| DDR3_CLKOUT_P0/N0 | DDR3 Clock Output | Differential clock pair driving external DDR3L SDRAM; must be routed as controlled-impedance LVDS pair (100 Ω diff) |
| DCAN0_TX / DCAN0_RX | CAN Bus Interface | High-speed CAN 2.0B transceiver pins supporting up to 1 Mbps; require external 120 Ω termination and common-mode choke |
| USB0_DP / USB0_DM | USB 2.0 High-Speed Differential Pair | Integrated PHY differential signals for USB DRD operation; require 90 Ω ±10% differential impedance and <5 ps skew |
| PCIe_REFCLK_P/N | PCIe 2.0 Reference Clock | 100 MHz differential reference clock input for PCIe controller; must meet jitter <1.5 ps RMS and use AC coupling |
Key Features
| Feature | Design Value |
|---|---|
| Arm + DSP Heterogeneous Coherence | MSMC enables cache-coherent shared L2 SRAM (1 MB ECC) accessible by both A15 and C66x - eliminates software-managed cache invalidation overhead |
| PRU-ICSS Real-Time Offload | Each PRU-ICSS provides dual PRUs with 16 KB ECC program RAM, CRC32/16 accelerator, and MII_RT for deterministic industrial protocol stack execution |
| IEEE 1588v2 Time Stamping | CPTS module delivers hardware timestamping on all EMAC frames with sub-100 ns resolution - essential for PTP grandmaster/slave synchronization |
| Secure Boot Enforcement | OTP-based key storage and hardware-authenticated boot flow prevent unauthorized firmware loading - meets IEC 62443-3-3 SL2 requirements |
| ASRC Audio Precision | Asynchronous sample rate converter supports 16–24 bit, 8–216 kHz streams with 140 dB SNR and linear-phase FIR - enables multi-domain audio routing without jitter accumulation |
Applications
| Industrial Ethernet Gateway | Professional Audio Mixer |
|---|---|
|
Use Scenario: Protocol translation between PROFINET, EtherCAT, and Modbus TCP in factory automation edge nodes. IC Role / Device Role / Timing Role: Dual PRU-ICSS handles real-time Ethernet MAC layer processing while Arm A15 runs Linux-based application layer and web HMI. Use Value: Hardware-accelerated IEP and CPTS enable sub-microsecond cycle timing accuracy and IEEE 1588v2 synchronization across multiple fieldbus domains. |
Use Scenario: Multi-channel digital mixing console with low-latency effects processing and Dante/AES67 streaming. IC Role / Device Role / Timing Role: C66x DSP performs real-time FIR/IIR filtering and dynamics processing; ASRC aligns asynchronous audio sources (e.g., mic preamps, network streams). Use Value: 140 dB SNR ASRC and 8 stereo stream capability eliminate sample-rate conversion artifacts in high-fidelity broadcast-grade audio paths. |
| Protection Relay Controller | Transportation Onboard Infotainment |
|
Use Scenario: Substation protection relay requiring fault detection, waveform capture, and GOOSE messaging over IEC 61850. IC Role / Device Role / Timing Role: Arm A15 executes IEC 61850 stack and HMI; C66x DSP computes symmetrical components and harmonic analysis on sampled current/voltage waveforms. Use Value: ECC-protected L1/L2 memories and DDR interface ensure data integrity during electromagnetic interference events per IEC 61000-4-4/6. |
Use Scenario: Rail or bus infotainment system with video playback, passenger Wi-Fi, and CAN-based vehicle diagnostics. IC Role / Device Role / Timing Role: DSS drives LCD display; dual CAN interfaces monitor vehicle bus; USB/PCIe connect to Wi-Fi/BT modules. Use Value: –40°C to 125°C extended temperature rating and ECC across all on-chip memories guarantee reliability in uncontrolled vehicle cabin environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar heterogeneous multicore SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 66AK2G02ABYA60ES | Single C66x DSP core (vs. dual in 66AK2G12); 512KB L2 DSP RAM (vs. 1MB); no PRU-ICSS | Lacks industrial protocol offload capability; insufficient for dual-protocol gateways or real-time motion control | Select when cost-sensitive designs require only basic DSP acceleration without deterministic real-time peripherals |
| AM5728BCBD4 | Arm Cortex-A15 + C66x DSP, but no PRU-ICSS; uses different memory map and lacks ASRC/IEP/CPTS hardware blocks | Requires software-based industrial protocol stacks; no hardware IEEE 1588v2 timestamping or ASRC precision | Choose for Linux-centric HMI or vision applications where PRU offload and audio precision are not required |
Compared with 66AK2G12ABYA60ES, the 66AK2G02ABYA60ES reduces DSP compute and removes PRU-ICSS for lower cost, while the AM5728BCBD4 offers similar CPU/DSP cores but lacks integrated industrial timing, audio, and protocol acceleration - making 66AK2G12ABYA60ES uniquely suited for time-critical industrial and pro-audio SoC designs.
Availability
66AK2G12ABYA60ES is available at Aetrix Electronics and suitable for industrial Ethernet gateways, professional audio mixers, protection relays, transportation infotainment systems, and real-time control applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for 66AK2G12ABYA60ES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company focused on analog and embedded processing technologies, serving industrial, automotive, and communications markets with high-reliability silicon and comprehensive development ecosystems.
The 66AK2G12ABYA60ES belongs to TI's Keystone II multicore SoC product line, engineered specifically for applications demanding tightly coupled Arm + DSP execution, hardware-accelerated industrial networking, and deterministic real-time control in harsh environments.
FAQ
What is the maximum DDR3L speed supported by the 66AK2G12ABYA60ES?
The 66AK2G12ABYA60ES supports DDR3L operation at up to 1066 MT/s across its 36-bit external memory interface. This enables sustained bandwidth of approximately 4.2 GB/s with 4-bit ECC enabled, meeting requirements for high-throughput data movement between Arm A15, C66x DSP, and PRU-ICSS subsystems. The interface complies with JEDEC DDR3L standards and requires proper termination and layout per TI's SPRSP07F datasheet Section 7.1.
Does the 66AK2G12ABYA60ES include hardware support for IEEE 1588v2 Precision Time Protocol?
Yes, the 66AK2G12ABYA60ES integrates a dedicated CPTS (Common Platform Time Sync) module that provides hardware timestamping for IEEE 1588v2 Annex D/E/F compliant PTP operations. It supports frame-level ingress/egress timestamping on all EMAC ports with sub-100 ns resolution, enabling precise grandmaster and slave clock synchronization in industrial Ethernet applications - a capability confirmed in Section 1.1 and Figure 1-1 of the SPRSP07F datasheet.
How many PRU-ICSS subsystems does the 66AK2G12ABYA60ES contain, and what do they support?
The 66AK2G12ABYA60ES contains two fully independent Programmable Real-Time Unit and Industrial Communication Subsystems (PRU-ICSS). Each supports two PRUs with 16 KB ECC program RAM, 8 KB ECC data RAM, CRC32/16 accelerators, 20 enhanced GPIOs, SCU for Sigma-Delta demodulation, and an MII_RT Ethernet module with dual MII ports - enabling concurrent implementation of protocols like EtherCAT, PROFINET IRT, and POWERLINK without CPU intervention.
What audio capabilities does the 66AK2G12ABYA60ES provide beyond standard McASP interfaces?
Beyond three McASP peripherals, the 66AK2G12ABYA60ES includes a dedicated Asynchronous Sample Rate Converter (ASRC) supporting up to 8 stereo streams (16 channels), 140 dB SNR, sample rates from 8 kHz to 216 kHz, and linear-phase FIR filtering. This hardware block enables jitter-free resampling between asynchronous audio domains - a feature absent in most SoCs and critical for professional audio mixing and broadcast infrastructure using the 66AK2G12ABYA60ES.
Is secure boot implemented in hardware on the 66AK2G12ABYA60ES, and how is it configured?
Yes, secure boot is implemented in hardware on the 66AK2G12ABYA60ES using a 4 KB One-Time Programmable (OTP) ROM for storing customer secondary keys and boot configuration fuses. The boot ROM enforces cryptographic verification of signed bootloader images before execution, supporting anti-cloning and firmware update protection. Configuration is performed during manufacturing via TI's production programming tools, as detailed in Section 1.3 and the Secure Boot User's Guide (SPRUIV7).
66AK2G12ABYA60ES Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 66AK2G1x KeyStone II Multicore
- Package/Case:
- 625-LFBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- DSP+ARM®
- Interface:
- CAN, DMA, EBI/EMI, Ethernet, I2C, McASP, McBSP, MMC/SD, QSPI, SPI, UART, USB
- Clock Rate:
- 600MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 1MB
- Voltage - I/O:
- 1.8V, 3.3V
- Voltage - Core:
- 0.9V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 625-FCBGA (21x21)
66AK2G12ABYA60ES FAQ
1.How can I place an order for 66AK2G12ABYA60ES through Aetrix?
Please submit a Request for Quotation (RFQ) for 66AK2G12ABYA60ES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 66AK2G12ABYA60ES reliable?
The price and inventory of 66AK2G12ABYA60ES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 66AK2G12ABYA60ES is usually 5 days.
3.What payment methods are accepted for 66AK2G12ABYA60ES?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 66AK2G12ABYA60ES transactions.
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4.How is shipping managed for 66AK2G12ABYA60ES?
66AK2G12ABYA60ES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 66AK2G12ABYA60ES order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 66AK2G12ABYA60ES?
For technical support, including 66AK2G12ABYA60ES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 66AK2G12ABYA60ES requirements.
6.How does Aetrix verify that 66AK2G12ABYA60ES is sourced from the original manufacturer or authorized distributors?
All 66AK2G12ABYA60ES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 66AK2G12ABYA60ES meets industry standards.
7.What is the process for return or replacement of 66AK2G12ABYA60ES?
All 66AK2G12ABYA60ES units undergo pre-shipment inspection (PSI). If there is an issue with 66AK2G12ABYA60ES, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 66AK2G12ABYA60ES part is unused and in its original packaging.
Return procedure for 66AK2G12ABYA60ES:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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