Texas Instruments 66AK2H06BAAW24

Overview

66AK2H06BAAW24 from Texas Instruments is a multicore DSP+ARM System-on-Chip (SoC) integrating four ARM Cortex-A15 processors (up to 1.4 GHz), four TMS320C66x DSP cores (up to 1.2 GHz), 6 MB shared MSMC SRAM, dual 72-bit DDR3/DDR3L interfaces (1600 MHz), and a 5-port Gigabit Ethernet switch. It targets high-performance embedded infrastructure applications including media transcoding, network security acceleration, and real-time video analytics.

For engineers reviewing the 66AK2H06BAAW24 datasheet, 66AK2H06BAAW24 pinout, 66AK2H06BAAW24 application, or 66AK2H06BAAW24 equivalent, key selection considerations include its 4× ARM A15 + 4× C66x core configuration, 14 × 64-bit timers, SmartReflex™ voltage scaling, 1517-pin AAW BGA package, and integrated packet/security accelerators for L2/L3 processing at up to 1 Gbps wire speed.

Technical Context

The 66AK2H06BAAW24 implements the KeyStone II architecture with tightly coupled ARM and DSP subsystems sharing a 6-MB MSMC SRAM with memory protection unit (MPU), enabling low-latency inter-processor communication. Its Multicore Navigator provides 16k hardware queues and packet-based DMA for zero-overhead data movement between peripherals and cores.

Network Coprocessor integration includes a Packet Accelerator supporting Transport Plane IPsec, GTP-U, SCTP, and PDCP, plus a Security Accelerator delivering up to 2.4 Gbps IPSec and 2.4 Gbps air ciphering using AES, SHA-2, HMAC, and Kasumi algorithms - all operating independently of the main CPU cores.

Key Specifications

Pinout & Package

66AK2H06BAAW24 uses a 1517-pin flip-chip plastic BGA (AAW) package measuring 40.0 mm × 40.0 mm with 0.8 mm ball pitch. The package supports thermal dissipation via exposed thermal pad and is qualified for extended industrial temperature operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar multicore DSP+ARM SoC applications.

Compared with 66AK2H06BAAW24, the 66AK2H12BAAW24 offers double the DSP core count and timer resources within identical mechanical and electrical compatibility, while the OMAP5432AAAB trades DSP and accelerator capability for smaller size and lower power - making it suitable only for non-networked, non-real-time signal processing roles.

Availability

66AK2H06BAAW24 is available at Aetrix Electronics and suitable for media transcoding servers, secure wireless baseband units, and network intrusion detection appliances requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 66AK2H06BAAW24 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and connectivity technologies for industrial, automotive, and communications markets.

The 66AK2Hxx family was designed to consolidate high-performance DSP and ARM processing onto a single die for infrastructure equipment - reducing system cost, power, and board area versus multichip solutions in telecom, video, and security applications.

FAQ

What is the maximum operating frequency of the ARM and DSP cores in the 66AK2H06BAAW24?

The 66AK2H06BAAW24 integrates two ARM Cortex-A15 processors and four TMS320C66x DSP cores, each rated for operation up to 1.4 GHz (ARM) and 1.2 GHz (DSP). These frequencies are validated under extended temperature conditions (–40°C to 100°C) with appropriate power delivery and thermal management. The 66AK2H06BAAW24 achieves 38.4 GMACS/core and 19.2 GFLOPS/core at 1.2 GHz DSP operation.

Does the 66AK2H06BAAW24 support DDR3L memory, and what are the voltage requirements?

Yes, the 66AK2H06BAAW24 supports both DDR3 and DDR3L memory interfaces via its dual 72-bit EMIFs, operating at data rates up to 1600 MHz. DVDD15 power supplies must be configured for 1.35 V or 1.5 V depending on DDR3L or DDR3 mode, as specified in the Recommended Operating Conditions table. The 66AK2H06BAAW24 uses SmartReflex™ technology to dynamically adjust core and I/O voltages based on workload and temperature.

How many 64-bit timers does the 66AK2H06BAAW24 provide, and are they accessible to both ARM and DSP subsystems?

The 66AK2H06BAAW24 provides fourteen 64-bit configurable timers, as confirmed in Table 3-1 of the SPRS866G datasheet. These timers are mapped into the device's global interrupt controller and are accessible to both ARM and DSP subsystems via memory-mapped registers. Each timer supports programmable period, capture, and compare modes, and can generate interrupts routed through the Multicore Interrupt Controller (INTC).

Is the 66AK2H06BAAW24 pin-compatible with other devices in the 66AK2Hxx family, such as the 66AK2H12 or 66AK2H14?

The 66AK2H06BAAW24 shares the same 1517-pin AAW BGA package and mechanical footprint with the 66AK2H12BAAW24 and 66AK2H14BAAW24, but is not fully pin-compatible. While power, ground, DDR, and common peripheral pins align, the 66AK2H14 includes dedicated XFI (10-GbE) pins that are reserved (NOPIN) on the 66AK2H06BAAW24. Signal-level compatibility must be verified per function - especially for HyperLink, SRIO, and PCIe lanes - before PCB reuse.

What security acceleration capabilities are integrated into the 66AK2H06BAAW24?

The 66AK2H06BAAW24 includes a dedicated Security Accelerator supporting IPSec, SRTP, SSL/TLS, and 3GPP air interface ciphering (Kasumi, SNOW 3G) with throughput up to 2.4 Gbps for both IPSec and air ciphering. Supported cryptographic primitives include AES, DES, 3DES, SHA-1/SHA-2 (256-bit), MD5, HMAC, CMAC, GCM, and CCM. These functions operate independently of the ARM and DSP cores, preserving compute resources for application tasks.