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Texas Instruments 66AK2H06DAAW24

Part No.:
66AK2H06DAAW24
Manufacturer:
Texas Instruments
Category:
DSP (Digital Signal Processors)
Package:
1517-BBGA, FCBGA
Datasheet:
Aetrix66AK2H06DAAW24.pdf
Description:
66AK2H06DAAW24
Quantity:
Payment:
Payment
Shipping:
Shipping

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Product details

Overview

66AK2H06DAAW24 from Texas Instruments is a KeyStone II–based multicore SoC integrating two ARM Cortex-A15 processors (up to 1.4 GHz) and four TMS320C66x DSP cores (up to 1.2 GHz), 6 MB MSMC SRAM, dual 72-bit DDR3/DDR3L interfaces (1600 MHz), and a 5-port Gigabit Ethernet switch. It delivers 2.8 GHz aggregate ARM + 4.8 GHz aggregate DSP performance for media processing, analytics, and embedded infrastructure.

For engineers reviewing the 66AK2H06DAAW24 datasheet, 66AK2H06DAAW24 pinout, 66AK2H06DAAW24 application, or 66AK2H06DAAW24 equivalent, key selection factors include its 14 × 64-bit timers, SmartReflex™ core voltage scaling, PCIe Gen2 x2 support, HyperLink scalability, and 1517-pin AAW BGA package with 40 mm × 40 mm footprint.

Technical Context

The 66AK2H06DAAW24 implements a heterogeneous multicore architecture where ARM Cortex-A15 cores handle high-level OS tasks and control plane functions, while C66x DSP cores execute real-time signal, video, and packet processing. Its Multicore Navigator provides 16k hardware queues and zero-overhead packet-based DMA, tightly coupled with the Network Coprocessor's Packet Accelerator (supporting GTP-U, SCTP, PDCP) and Security Accelerator (AES, SHA-2, IPSec up to 2.4 Gbps).

Memory coherency is maintained via AMBA 4.0 ACE master ports linking ARM L2 cache (4 MB shared) and C66x L2 caches (1024 KB per core) to the 6 MB MSMC SRAM. The device uses five on-chip PLLs for independent clock domain management across ARM, DSP, DDR3, PCIe, and peripheral subsystems - critical for deterministic latency in telecom and media infrastructure applications.

Key Specifications

ParameterValue and Actual Design Meaning
Core Configuration2× ARM Cortex-A15 @ up to 1.4 GHz + 4× C66x DSP @ up to 1.2 GHz - enables concurrent control-plane and data-plane processing without external co-processors.
Memory Subsystem6 MB MSMC SRAM + dual 72-bit DDR3/DDR3L @ 1600 MHz - provides low-latency shared memory and high-bandwidth external storage for real-time streaming workloads.
Network CoprocessorPacket Accelerator + Security Accelerator - offloads transport-layer IPsec/GTP-U and crypto operations (AES, SHA-2, HMAC) from CPU cores at up to 2.4 Gbps throughput.
Connectivity5-port Gigabit Ethernet switch (SGMII), PCIe Gen2 x2, 4-lane SRIO 2.1, 2× HyperLink, USB 3.0 - supports scalable backplane interconnect and multi-protocol I/O in dense infrastructure systems.
Timers & Peripherals14 × 64-bit configurable timers, 32 GPIO, 3× I²C, 3× SPI, 2× UART, EMIF16 - enables precise timing control, board-level monitoring, and legacy interface bridging.
Package & Thermal1517-pin flip-chip BGA (AAW), 40 mm × 40 mm, 0°C to 85°C commercial temp range - compatible with standard high-density PCB assembly and thermal management for fanless embedded systems.

Pinout & Package

The 66AK2H06DAAW24 is housed in a 1517-ball flip-chip plastic BGA (package code AAW) with 40 mm × 40 mm body size and 0.8 mm ball pitch. Ball map follows TI's standardized AAW layout; XFI pins reserved (not functional in 66AK2H06).

Pin/TerminalCircuit RoleDesign Meaning
HYP0RXP0 / HYP0RXN0HyperLink Lane 0 Differential ReceiveEnables chip-to-chip coherent interconnect at up to 50 GBaud; used for resource scaling with other KeyStone II devices.
DDR3AD00–DDR3AD31DDR3 Address/Data Bus (72-bit)Two independent 72-bit DDR3/DDR3L interfaces supporting 1600 MHz operation; each includes DQS strobes and ODT control.
SGMII0RXP / SGMII0RXNGigabit Ethernet Port 0 Differential ReceiveOne of four SGMII ports in the integrated 5-port switch; supports IEEE 802.3ab with auto-negotiation and IEEE 1588 timestamping.
PCIETXN0 / PCIETXP0PCIe Gen2 Differential TransmitFirst lane of PCIe Gen2 x2 endpoint interface; supports root complex or endpoint mode with full configuration space access.
CVDDCore Logic Supply (1.0 V nominal)SmartReflex™-regulated supply for ARM/DSP logic; dynamically adjusted based on workload and temperature to optimize power efficiency.

Key Features

FeatureDesign Value
ARM + DSP Heterogeneous Compute2× Cortex-A15 + 4× C66x cores enable simultaneous Linux OS execution and real-time DSP algorithm acceleration without software abstraction overhead.
MSMC Memory Protection Unit (MPU)Hardware-enforced access control for 6 MB MSMC SRAM and DDR3_EMIF - ensures secure partitioning between ARM, DSP, and accelerator domains.
Multicore Navigator Queue Manager16,384 hardware queues with descriptor-based packet DMA - eliminates software scheduling bottlenecks in high-throughput packet forwarding paths.
Security Accelerator EngineHardware-accelerated AES-GCM, SHA-256, HMAC-SHA1, and 3GPP air ciphering (Kasumi/SNOW 3G) - meets LTE/EPC security requirements at line rate.
IEEE 1588 Precision Time ProtocolHardware timestamping engine integrated into Ethernet MACs - enables sub-microsecond time synchronization for TSN and fronthaul applications.

Applications

Media Transcoding ServerSecure Wireless Baseband Unit

Use Scenario: Real-time 4K video transcoding in cloud-edge media servers using VP9/AV1 codecs.

IC Role / Device Role / Timing Role: 66AK2H06DAAW24 acts as the primary compute engine, with ARM cores managing container orchestration and C66x cores executing parallelized motion estimation and transform kernels.

Use Value: 4.8 GHz DSP compute + 6 MB on-die MSMC reduces external memory bandwidth pressure by >60% versus discrete ARM+DSP solutions, lowering system power and latency.

Use Scenario: LTE-Advanced small cell baseband processing with encrypted user-plane traffic.

IC Role / Device Role / Timing Role: 66AK2H06DAAW24 serves as the Layer 1/Layer 2 baseband processor, running PHY layer algorithms on C66x cores and RRC/PDCP stack on ARM cores.

Use Value: Integrated Packet Accelerator and Security Accelerator offload GTP-U tunneling and air-interface encryption (AES-CTR, SNOW 3G) at 2.4 Gbps, freeing CPU cycles for higher-layer protocol processing.

Industrial Analytics GatewayMulti-Protocol Network Appliance

Use Scenario: Edge AI inference and sensor fusion in factory automation gateways aggregating Modbus, CAN, and EtherCAT data.

IC Role / Device Role / Timing Role: ARM cores run real-time Linux with PREEMPT_RT patch; C66x cores perform FFT-based vibration analysis and anomaly detection on streaming sensor data.

Use Value: 14 × 64-bit timers and 32 GPIO enable precise hardware-triggered sampling and deterministic response to fieldbus interrupts (<1 µs jitter).

Use Scenario: Unified threat management (UTM) appliance performing deep packet inspection, firewalling, and SSL/TLS decryption.

IC Role / Device Role / Timing Role: 66AK2H06DAAW24 functions as the traffic steering and crypto engine, directing packets via Multicore Navigator queues and accelerating TLS 1.2 handshake with RSA-2048 and AES-GCM.

Use Value: Dual DDR3 interfaces sustain 12.8 GB/s memory bandwidth required for concurrent 100+ concurrent SSL sessions at wire speed.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multicore DSP+ARM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
66AK2H12DAAW24Same AAW package; adds 2 more C66x DSP cores (8 total) and retains 4 ARM A15 cores - increases DSP compute by 100% but raises power and thermal envelope.Targeted at higher-throughput media encoding and full-stack 5G NR baseband where additional DSP resources justify cost and cooling overhead.Select when >4.8 GHz DSP compute is required and thermal design supports ~5 W higher TDP.
OMAP5432AAABDual-core ARM Cortex-A15 + dual-core PowerVR SGX544 GPU; no C66x DSP, no Packet/Security Accelerators, no MSMC - lacks real-time signal processing and network offload capability.Suitable for GUI-rich industrial HMIs or Android-based edge devices requiring graphics, not packet or DSP acceleration.Choose only if application relies solely on general-purpose CPU/GPU compute without deterministic DSP or networking acceleration.

Compared with 66AK2H12DAAW24 and OMAP5432AAAB, the 66AK2H06DAAW24 uniquely balances ARM control-plane capability, C66x real-time signal processing, and hardware-accelerated networking - making it optimal for cost-sensitive, thermally constrained infrastructure nodes requiring verified DSP+ARM integration.

Availability

66AK2H06DAAW24 is available at Aetrix Electronics and suitable for media transcoding servers, secure wireless baseband units, industrial analytics gateways, and multi-protocol network appliances requiring stable component supply across extended product lifecycles.

Supply support for 66AK2H06DAAW24 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and digital signal processing technologies, with leadership in high-performance computing and communications ICs.

The 66AK2Hxx family was designed specifically for embedded infrastructure applications including cloud computing, media processing, transcoding, security, and virtual desktop - emphasizing heterogeneous compute, hardware acceleration, and scalable interconnect.

FAQ

What is the maximum operating frequency of the ARM and DSP cores in the 66AK2H06DAAW24?

The 66AK2H06DAAW24 features two ARM Cortex-A15 processors operating up to 1.4 GHz and four TMS320C66x DSP cores operating up to 1.2 GHz. These frequencies are guaranteed under recommended operating conditions (0°C to 85°C case temperature) with proper power delivery and thermal management. The 66AK2H06DAAW24 does not support higher-frequency variants like the 66AK2H14's 1.6 GHz DSP option.

Does the 66AK2H06DAAW24 support DDR3L memory, and what are the voltage requirements?

Yes, the 66AK2H06DAAW24 supports both DDR3 and DDR3L memory interfaces via its dual 72-bit EMIFs, operating at speeds up to 1600 MHz. DDR3L compatibility requires DVDD15 supply set to 1.35 V (±3%), while standard DDR3 uses 1.5 V (±3%). Both modes are supported simultaneously across the two interfaces, enabling mixed-memory configurations in the same system.

How many Ethernet ports does the 66AK2H06DAAW24 integrate, and what standards do they support?

The 66AK2H06DAAW24 integrates a five-port Gigabit Ethernet switch subsystem with four SGMII ports supporting IEEE 802.3ab (1000BASE-T) and IEEE 1588-2008 Annex D/E for precision time synchronization. It does not include XFI or 10-GbE ports - those are exclusive to the 66AK2H14 variant. All ports support full-duplex operation, jumbo frames, and hardware timestamping.

What debug and emulation interfaces are available on the 66AK2H06DAAW24?

The 66AK2H06DAAW24 provides IEEE 1149.1 JTAG (TCK/TMS/TDI/TDO/TRST) for boundary-scan and core debugging, plus 24 dedicated emulator pins (EMU00–EMU18) supporting real-time trace, instruction-level stepping, and memory access via TI's Code Composer Studio. It also includes SWD-compatible signals for ARM core debugging and dedicated trace ports for C66x core visibility.

Is the 66AK2H06DAAW24 pin-compatible with other members of the 66AK2Hxx family, such as the 66AK2H12 or 66AK2H14?

Yes, the 66AK2H06DAAW24 shares identical pinout, package (AAW), and ball assignment with the 66AK2H12DAAW24 and 66AK2H14DAAW24. However, certain pins - notably the 14 XFI lanes used for 10-GbE in the 66AK2H14 - are reserved (no connect) in the 66AK2H06DAAW24. This allows direct PCB reuse across the family, though firmware and power delivery must be adapted to each variant's core count and feature set.

66AK2H06DAAW24 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
66AK2Hx KeyStone Multicore
Package/Case:
1517-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Type:
DSP+ARM®
Interface:
EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
Clock Rate:
1.2GHz DSP, 1.4GHz ARM®
Non-Volatile Memory:
ROM (384kB)
On-Chip RAM:
8.375MB
Voltage - I/O:
0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
Voltage - Core:
Variable
Operating Temperature:
0°C ~ 85°C (TC)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
1517-FCBGA (40x40)

66AK2H06DAAW24 FAQ

1.How can I place an order for 66AK2H06DAAW24 through Aetrix?

Please submit a Request for Quotation (RFQ) for 66AK2H06DAAW24 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 66AK2H06DAAW24 reliable?

The price and inventory of 66AK2H06DAAW24 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 66AK2H06DAAW24 is usually 5 days.

3.What payment methods are accepted for 66AK2H06DAAW24?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 66AK2H06DAAW24 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 66AK2H06DAAW24?

66AK2H06DAAW24 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 66AK2H06DAAW24 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 66AK2H06DAAW24?

For technical support, including 66AK2H06DAAW24 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 66AK2H06DAAW24 requirements.

6.How does Aetrix verify that 66AK2H06DAAW24 is sourced from the original manufacturer or authorized distributors?

All 66AK2H06DAAW24 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 66AK2H06DAAW24 meets industry standards.

7.What is the process for return or replacement of 66AK2H06DAAW24?

All 66AK2H06DAAW24 units undergo pre-shipment inspection (PSI). If there is an issue with 66AK2H06DAAW24, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 66AK2H06DAAW24 part is unused and in its original packaging.

Return procedure for 66AK2H06DAAW24:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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