Texas Instruments 66AK2H06DAAWA2

Overview

66AK2H06DAAWA2 from Texas Instruments is a multicore DSP+ARM System-on-Chip (SoC) integrating two ARM Cortex-A15 processors at up to 1.4 GHz and four TMS320C66x DSP cores at up to 1.2 GHz, with 6 MB shared MSMC SRAM, dual 72-bit DDR3/DDR3L interfaces (up to 1600 MHz), and a 5-port Gigabit Ethernet switch - designed for media processing, analytics, and embedded infrastructure applications.

For engineers reviewing the 66AK2H06DAAWA2 datasheet, 66AK2H06DAAWA2 pinout, 66AK2H06DAAWA2 application, or 66AK2H06DAAWA2 equivalent, this page delivers verified core count, clock frequencies, memory subsystem architecture, Ethernet capabilities, and thermal specifications directly tied to the AAW package variant.

Technical Context

The 66AK2H06DAAWA2 implements KeyStone II architecture with dedicated ARM CorePac (2× Cortex-A15 @ 1.4 GHz, 4 MB shared L2 cache) and DSP CorePac (4× C66x @ 1.2 GHz, 1024 KB local L2 per core), coordinated via Multicore Navigator with 16k hardware queues and packet-based DMA. Its MSMC provides coherent low-latency access to 6 MB SRAM shared across all cores.

It integrates a Network Coprocessor with Packet Accelerator (supporting IPsec, GTP-U, SCTP, PDCP) and Security Accelerator (AES, SHA-2, HMAC, Kasumi, SNOW 3G), plus five 64-bit timers, PCIe Gen2 (2 lanes), SRIO 2.1 (4 lanes), HyperLink (2 lanes), USB 3.0, and SGMII-based 5-port Ethernet switching - all operating within commercial temperature range (0°C to 85°C).

Key Specifications

Pinout & Package

66AK2H06DAAWA2 is housed in a 1517-ball flip-chip plastic BGA (AAW) package, 40.0 mm × 40.0 mm, with 1.0 mm ball pitch. Pin functions are defined across four quadrants (A–D); key signal groups include DDR3 address/data/control (DDR3ADxx, DDR3ACBxx, DDR3ADQSx), SGMII transceivers (SGMIIxRXP/N, SGMIIxTXP/N), PCIe lanes (PCIERXN/TXN), SRIO (RIORXP/N, RIOTXP/N), HyperLink (HYPxRXP/N, HYPxTXP/N), and power domains (CVDD, DVDD15, DVDD18, VDDAHV, VDDALV).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous multicore SoC applications.

Compared with 66AK2H12DAAWA2, the 66AK2H06DAAWA2 reduces DSP count and timer count for lower power and cost in mid-tier media/analytics systems; versus OMAP5432AAAB, it delivers dedicated signal processing horsepower and integrated networking acceleration unattainable with general-purpose ARM+M4 architectures.

Availability

66AK2H06DAAWA2 is available at Aetrix Electronics and suitable for media transcoding, network analytics, industrial vision, and secure wireless baseband applications requiring stable component supply, long-term industrial lifecycle support, and traceable sourcing.

Supply support for 66AK2H06DAAWA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and digital signal processing technologies, with leadership in high-performance SoCs for communications and industrial markets.

The 66AK2Hxx product line was engineered for embedded infrastructure applications demanding tightly coupled ARM+DSP compute, hardware-accelerated networking, and deterministic real-time processing - targeting cloud media gateways, telecom edge nodes, and intelligent video analytics platforms.

FAQ

What is the maximum operating frequency of the ARM and DSP cores in the 66AK2H06DAAWA2?

The 66AK2H06DAAWA2 features two ARM Cortex-A15 processors operating at up to 1.4 GHz and four TMS320C66x DSP cores operating at up to 1.2 GHz. These frequencies are specified under recommended operating conditions with proper thermal management and power supply regulation. The 66AK2H06DAAWA2 achieves 38.4 GMACS/core and 19.2 GFLOPS/core on the C66x DSPs at 1.2 GHz, and full ARMv7-A instruction set compliance on the Cortex-A15 cluster.

Does the 66AK2H06DAAWA2 support DDR3L memory, and what are the voltage requirements?

Yes, the 66AK2H06DAAWA2 supports both DDR3 and DDR3L memory through its dual 72-bit DDR3/DDR3L interfaces, rated for speeds up to 1600 MHz. The DDR3 interface operates at 1.5 V nominal, while DDR3L uses 1.35 V - both supported simultaneously via DVDD15 power domain configured for 1.35/1.5 V operation. This dual-voltage capability enables backward compatibility and energy savings in thermally constrained designs.

How many Ethernet ports does the 66AK2H06DAAWA2 integrate, and what standards do they support?

The 66AK2H06DAAWA2 integrates a 5-port Gigabit Ethernet switch subsystem with four SGMII interfaces (ports 0–3) and one internal management port. It supports IEEE 802.3, 802.1Q VLAN tagging, and IEEE 1588-2008 Annex D/E time synchronization. Unlike the 66AK2H14, it does not include XFI-based 10-GbE ports - making it optimized for cost-effective 1 Gbps edge routing and media aggregation rather than core switching.

What security acceleration capabilities are implemented in the 66AK2H06DAAWA2?

The 66AK2H06DAAWA2 includes a dedicated Security Accelerator supporting AES (ECB/CBC/CTR/GCM), DES/3DES, SHA-1/SHA-2 (256-bit), MD5, HMAC, CMAC, GMAC, Kasumi, and SNOW 3G algorithms, delivering up to 2.4 Gbps IPSec throughput and 2.4 Gbps air interface ciphering. These functions are hardware-accelerated and offloaded from CPU cores, enabling real-time encrypted data paths in telecom and defense applications without performance penalty.

Is the 66AK2H06DAAWA2 pin-compatible with other members of the 66AK2Hxx family, such as the 66AK2H12 or 66AK2H14?

Yes, the 66AK2H06DAAWA2 shares the identical 1517-pin AAW BGA package, mechanical footprint, and pinout with the 66AK2H12DAAWA2 and 66AK2H14DAAWA2. All three devices use the same ball map and power/ground assignments; however, certain pins (e.g., XFI lanes on the 66AK2H14) are reserved/no-connect on the 66AK2H06DAAWA2. This enables board-level scalability - users can design once and upgrade core count via firmware and thermal redesign.