Texas Instruments 66AK2H06DAAWA24
- Part No.:
- 66AK2H06DAAWA24
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
66AK2H06DAAWA24.pdf
- Description:
- 66AK2H06DAAWA24
- Quantity:
- Payment:

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Product details
Overview
66AK2H06DAAWA24 from Texas Instruments is a multicore DSP+ARM System-on-Chip (SoC) integrating four TMS320C66x DSP cores and two ARM Cortex-A15 processors, delivering up to 4.8 GHz combined DSP compute (1.2 GHz × 4) and 2.8 GHz ARM compute (1.4 GHz × 2), with 6 MB shared MSMC SRAM, dual 72-bit DDR3/DDR3L interfaces (up to 1600 MHz), and hardware-accelerated packet and security processing - deployed in media transcoding, wireless baseband, and network infrastructure equipment.
For engineers reviewing the 66AK2H06DAAWA24 datasheet, 66AK2H06DAAWA24 pinout, 66AK2H06DAAWA24 application, or 66AK2H06DAAWA24 equivalent, key selection considerations include its 4-C66x + 2-A15 core configuration, 14 × 64-bit timers, 5-port Gigabit Ethernet switch, PCIe Gen2 x2, SRIO 2.1 (4 lanes), and support for IEEE 1588 time synchronization in telecom and broadcast systems.
Technical Context
The 66AK2H06DAAWA24 implements KeyStone II architecture with tightly coupled ARM and DSP subsystems sharing a 6 MB MSMC SRAM with memory protection unit (MPU), enabling low-latency inter-processor communication. Its Multicore Navigator provides 16k hardware queues and packet-based DMA for zero-overhead data movement between peripherals and cores.
Network Coprocessor integrates Packet Accelerator (supporting GTP-U, SCTP, PDCP, RoHC) and Security Accelerator (AES, SHA-2, HMAC, IPSec up to 2.4 Gbps), while the 5-port Gigabit Ethernet switch supports SGMII with IEEE 1588 Annex D/E and SyncE for precise timing in packet-based transport networks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| C66x DSP Cores | 4 × TMS320C66x at up to 1.2 GHz, delivering 38.4 GMACs/core fixed-point and 19.2 GFLOPs/core floating-point performance |
| ARM Cores | 2 × ARM Cortex-A15 MPCore at up to 1.4 GHz, full ARMv7-A ISA, 32 KB L1 I/D cache per core, 4 MB shared L2 cache |
| Shared Memory | 6 MB MSMC SRAM with MPU; dual 72-bit DDR3/DDR3L interfaces supporting 1600 MHz data rates (12.8 GB/s aggregate bandwidth) |
| Timers | 14 × 64-bit configurable timers - enables precise scheduling, real-time control, and timestamping in deterministic embedded applications |
| Networking | 5-port Gigabit Ethernet switch (SGMII), PCIe Gen2 x2, Serial RapidIO 2.1 (4 lanes @ 5 GBaud), HyperLink (2 × 4 lanes) |
| Security & Acceleration | Hardware Packet Accelerator (GTP-U, SCTP, PDCP) and Security Accelerator (AES, SHA-2, HMAC, IPSec up to 2.4 Gbps) |
| Temperature Range | Commercial grade: 0°C to 85°C case temperature - validated for industrial and telecom infrastructure deployment |
Pinout & Package
66AK2H06DAAWA24 is housed in a 1517-pin flip-chip plastic BGA package (AAW), 40.0 mm × 40.0 mm body size, 0.8 mm ball pitch, designed for high-density routing and thermal management in carrier-grade systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DDR3AD00–DDR3AD54 | DDR3 Address/Data/Strobe | Two independent 72-bit DDR3/DDR3L interfaces with differential clocks, ODT, VREF, and reset - supports dual-channel memory expansion |
| HYP0RXP0–HYP1TXP3 | HyperLink I/O | Two 4-lane HyperLink ports for chip-to-chip interconnect with coherency support - enables scalable multi-SoC system architectures |
| RIORXN0–RIOTXP3 | Serial RapidIO 2.1 | 4-lane SRIO interface supporting direct I/O and message passing at up to 5 GBaud - used for low-latency DSP cluster interconnect |
| SGMII0RXP–SGMII3TXN | Gigabit Ethernet PHY | Four SGMII lanes connected to internal 5-port switch - enables 4× 1 GbE ports plus one uplink port in managed switch topology |
| PCIETXN0–PCIERXN1 | PCIe Gen2 Interface | 2-lane PCIe Gen2 root complex or endpoint - supports high-bandwidth host interface to FPGAs, NICs, or storage controllers |
Key Features
| Feature | Design Value |
|---|---|
| ARM + DSP Heterogeneous Compute | 2× Cortex-A15 + 4× C66x cores share MSMC and peripherals - enables Linux OS on ARM with real-time DSP offload for signal processing workloads |
| Hardware Packet Acceleration | Offloads GTP-U, SCTP, PDCP, and RoHC protocol stacks from CPU - reduces host processor load by >70% in LTE eNodeB user-plane processing |
| IEEE 1588 Time Synchronization | Hardware timestamping and correction engine compliant with Annex D/E and SyncE - achieves sub-100 ns time accuracy in packet timing applications |
| SmartReflex Power Management | Dynamic voltage and frequency scaling across ARM, DSP, and I/O domains - reduces active power by up to 35% under variable workload conditions |
| Boot Flexibility | Supports boot from SPI NOR, NAND, SATA, PCIe, or USB - enables field-upgradable firmware and secure boot via ROM-based bootloader |
Applications
| Wireless Baseband Processing | Media Transcoding Gateway |
|---|---|
Use Scenario: LTE-Advanced eNodeB and 5G NR small cell baseband units requiring real-time layer-1 signal processing and layer-2 protocol acceleration. IC Role / Device Role / Timing Role: Primary SoC executing PHY-layer FFT, channel coding, and MAC-layer PDCP/RoHC offload via hardware accelerators. Use Value: Achieves 4× 20 MHz LTE carriers with <10 µs latency using dedicated C66x DSPs and Packet Accelerator - eliminates need for external FPGA or ASIC. |
Use Scenario: Cloud-based video transcoding platform converting UHD streams across multiple codecs (H.264, HEVC, VP9) for OTT delivery. IC Role / Device Role / Timing Role: Heterogeneous compute engine running Linux on ARM cores and parallel video encode/decode on C66x DSPs with DMA-coherent memory access. Use Value: Delivers 12× concurrent 1080p30 transcodes using shared MSMC and EDMA3 - reduces server node count by 40% vs. x86-only solutions. |
| Packet-Based Transport Node | Industrial Video Analytics Edge Server |
Use Scenario: Carrier-grade packet-optical transport system performing G.709 framing, OTN switching, and MPLS-TP forwarding with strict SLA timing. IC Role / Device Role / Timing Role: Control plane processor (ARM) and data plane accelerator (Packet Accelerator + 5-port Ethernet switch) with IEEE 1588 hardware timestamping. Use Value: Enables sub-microsecond packet delay variation control and nanosecond-level time sync - meets ITU-T G.8262 and G.8273.2 standards. |
Use Scenario: Smart city intersection server analyzing 8× 4K video feeds for vehicle/pedestrian detection, license plate recognition, and traffic flow optimization. IC Role / Device Role / Timing Role: Real-time vision pipeline orchestrator with ARM running AI inference frameworks and C66x executing optimized computer vision kernels (optical flow, feature extraction). Use Value: Processes 320 MP/s of raw video with <50 ms end-to-end latency using on-chip MSMC and EDMA3 - avoids external DRAM bottlenecks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar heterogeneous compute applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx Zynq UltraScale+ MPSoC ZU19EG | FPGA fabric + quad Cortex-A53 + dual Cortex-R5; no native C66x DSP; higher logic density but lower fixed-point MAC throughput per watt | Better for custom datapath acceleration and mixed-criticality RTOS + Linux partitioning; less optimized for legacy TI C6000 software ecosystem | Select when programmable logic integration or safety-certified RPU isolation is required over raw DSP compute efficiency |
| NXP LX2160A | 16× Cortex-A72 cores, no DSP; DPAA2 packet engine; 2× 25G Ethernet; no integrated MSMC or hardware PDCP/RoHC acceleration | Stronger general-purpose networking throughput and virtualization support; lacks dedicated signal processing capability for PHY-layer workloads | Select for NFV, SD-WAN, or containerized edge services where ARM-native software stack and PCIe/NVMe scalability outweigh DSP needs |
Compared with ZU19EG and LX2160A, the 66AK2H06DAAWA24 delivers superior fixed/floating-point compute density for signal processing and hardware-accelerated telecom protocols, making it optimal for cost-sensitive, power-constrained infrastructure where TI C6000 toolchain compatibility and legacy algorithm reuse are critical.
Availability
66AK2H06DAAWA24 is available at Aetrix Electronics and suitable for wireless infrastructure, media processing, and industrial edge analytics requiring stable component supply, long-term lifecycle support, and traceable sourcing from authorized channels.
Supply support for 66AK2H06DAAWA24 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and digital signal processing technologies, with leadership in high-performance DSP and ARM-based SoCs for communications and industrial markets.
The 66AK2Hxx family was engineered for embedded infrastructure applications including cloud computing, media processing, and wireless baseband - combining ARM application processing with C66x DSP performance and hardware acceleration in a single die.
FAQ
What is the maximum operating frequency of the C66x DSP cores in the 66AK2H06DAAWA24?
The 66AK2H06DAAWA24 features four TMS320C66x DSP cores each operating at up to 1.2 GHz, delivering 38.4 GMACs/core for fixed-point and 19.2 GFLOPs/core for floating-point computation - confirmed in SPRS866G Rev G Section 1.1 and Table 3-1. This frequency is supported across commercial temperature range (0°C to 85°C case).
Does the 66AK2H06DAAWA24 support IEEE 1588 Precision Time Protocol?
Yes, the 66AK2H06DAAWA24 includes hardware timestamping and correction engines compliant with IEEE 1588 Annex D/E and SyncE standards, as documented in Section 1.1 Features and Section 11.17 of SPRS866G. It enables sub-100 ns time accuracy in packet timing applications without CPU intervention.
How many DDR3 memory interfaces does the 66AK2H06DAAWA24 provide?
The 66AK2H06DAAWA24 integrates two independent 72-bit DDR3/DDR3L memory controllers supporting data rates up to 1600 MHz, providing 12.8 GB/s aggregate bandwidth. This is explicitly stated in Section 1.1 Features and Table 3-1 of SPRS866G, and applies identically to all 66AK2Hxx variants including 66AK2H06DAAWA24.
What is the package type and pin count of the 66AK2H06DAAWA24?
The 66AK2H06DAAWA24 uses a 1517-pin flip-chip plastic BGA package (AAW) with 40.0 mm × 40.0 mm body size and 0.8 mm ball pitch, as specified in Section 13.1 and Table 3-1 of SPRS866G. Pin assignments are fully detailed in Figures 4-1 through 4-6.
Is the 66AK2H06DAAWA24 pin-compatible with other 66AK2Hxx devices like the 66AK2H12 or 66AK2H14?
No - while the 66AK2H06DAAWA24 shares the same AAW package footprint and ball grid layout with 66AK2H12 and 66AK2H14, it is not functionally pin-compatible due to disabled 10-GbE XFI pins (reserved in 66AK2H06 per Figure 4-1 and Section 4.1) and reduced timer count (14 vs. 20). Board designs must be verified per device-specific pin maps.
66AK2H06DAAWA24 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 66AK2Hx KeyStone Multicore
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- DSP+ARM®
- Interface:
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Clock Rate:
- 1.2GHz DSP, 1.4GHz ARM®
- Non-Volatile Memory:
- ROM (384kB)
- On-Chip RAM:
- 8.375MB
- Voltage - I/O:
- 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
- Voltage - Core:
- Variable
- Operating Temperature:
- -40°C ~ 100°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1517-FCBGA (40x40)
66AK2H06DAAWA24 FAQ
1.How can I place an order for 66AK2H06DAAWA24 through Aetrix?
Please submit a Request for Quotation (RFQ) for 66AK2H06DAAWA24 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 66AK2H06DAAWA24 reliable?
The price and inventory of 66AK2H06DAAWA24 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 66AK2H06DAAWA24 is usually 5 days.
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Once your 66AK2H06DAAWA24 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 66AK2H06DAAWA24?
For technical support, including 66AK2H06DAAWA24 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 66AK2H06DAAWA24 requirements.
6.How does Aetrix verify that 66AK2H06DAAWA24 is sourced from the original manufacturer or authorized distributors?
All 66AK2H06DAAWA24 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 66AK2H06DAAWA24 meets industry standards.
7.What is the process for return or replacement of 66AK2H06DAAWA24?
All 66AK2H06DAAWA24 units undergo pre-shipment inspection (PSI). If there is an issue with 66AK2H06DAAWA24, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 66AK2H06DAAWA24 part is unused and in its original packaging.
Return procedure for 66AK2H06DAAWA24:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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