Texas Instruments 66AK2H06DXAAW2
- Part No.:
- 66AK2H06DXAAW2
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- -
- Datasheet:
-
66AK2H06DXAAW2.pdf
- Description:
- IC DSP ARM SOC FCBGA
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Product details
Overview
66AK2H06DXAAW2 from Texas Instruments is a KeyStone II–based multicore SoC integrating two ARM Cortex-A15 processors (up to 1.4 GHz) and four TMS320C66x DSP cores (up to 1.2 GHz), with 6 MB shared MSMC SRAM, dual 72-bit DDR3/DDR3L interfaces (1600 MHz), and a 5-port Gigabit Ethernet switch. It targets media processing, analytics, and embedded infrastructure where heterogeneous compute and packet acceleration are required.
For engineers reviewing the 66AK2H06DXAAW2 datasheet, 66AK2H06DXAAW2 pinout, 66AK2H06DXAAW2 application, or 66AK2H06DXAAW2 equivalent, key selection considerations include its 4-C66x + 2-A15 core configuration, 14 × 64-bit timers, SmartReflex™ voltage scaling, and AAW 1517-pin flip-chip BGA package for thermal and signal integrity in high-throughput systems.
Technical Context
The 66AK2H06DXAAW2 implements a tightly coupled heterogenous architecture: ARM cores handle OS, control, and protocol stack execution while C66x DSPs perform real-time signal, video, and packet processing. Its Multicore Navigator provides 16k hardware queues and zero-overhead packet DMA, enabling deterministic data movement across eight memory domains.
On-chip accelerators include a Network Coprocessor with Packet Accelerator (supporting GTP-U, SCTP, PDCP, RoHC) and Security Accelerator (AES, SHA-2, HMAC, Kasumi, SNOW 3G) delivering up to 2.4 Gbps IPSec and 2.4 Gbps air ciphering. The device uses five independent PLLs for domain-specific clock generation and supports IEEE 1588 time synchronization via dedicated hardware.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | 2 × ARM Cortex-A15 @ up to 1.4 GHz + 4 × TMS320C66x DSP @ up to 1.2 GHz - enables parallel control-plane and data-plane processing without external co-processors |
| Memory Subsystem | 6 MB MSMC SRAM shared by all cores + dual 72-bit DDR3/DDR3L interfaces @ 1600 MHz - provides low-latency inter-core communication and high-bandwidth external memory access |
| Timers | Fourteen 64-bit configurable timers - supports precise scheduling, timestamping, and real-time event management in telecom and media applications |
| Networking | 5-port Gigabit Ethernet switch (4 × SGMII) + Serial RapidIO 2.1 (4 lanes) + PCIe Gen2 (2 lanes) - enables multi-protocol backhaul, fronthaul, and chip-to-chip interconnect |
| Security Acceleration | Dedicated Security Accelerator supporting AES, SHA-2, HMAC, Kasumi, SNOW 3G, and 3GPP air interface ciphers - offloads crypto operations from CPU/DSP, preserving throughput for application logic |
| Package | 1517-pin flip-chip plastic BGA (AAW), 40.0 mm × 40.0 mm - optimized for thermal dissipation and high I/O density in compact infrastructure modules |
| Operating Temperature | –40°C to 100°C extended case temperature range - qualified for industrial and outdoor embedded deployments without active cooling |
Pinout & Package
66AK2H06DXAAW2 is housed in a 1517-ball flip-chip plastic BGA (package code AAW), 40.0 mm × 40.0 mm, with 1.0 mm ball pitch. Ball map follows TI's standardized AAW layout; XFI pins reserved (not functional on 66AK2H06).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DDR3AD00–DDR3AD54 | DDR3 address/data/strobe lines | Two independent 72-bit DDR3/DDR3L interfaces with full DQS gating and ODT control - supports interleaved memory access and ECC-capable configurations |
| HYP0RXP0–HYP1TXP3 | HyperLink differential I/O pairs | Two 4-lane HyperLink interfaces for cache-coherent inter-chip scalability with other KeyStone II devices - used for resource pooling in multi-SoC systems |
| SGMII0RXP/SGMII0TXP–SGMII3RXP/SGMII3TXP | Gigabit Ethernet physical layer I/O | Four SGMII ports connected to internal 5-port switch - enables direct PHY attachment without external MAC/PHY bridging |
| RIORXP0–RIOTXN3 | Serial RapidIO 2.1 differential lanes | Four-lane SRIO supporting 5 GBaud, message passing, and direct I/O - used for deterministic low-latency inter-processor communication |
| PCIERXP0/PCIETXP0–PCIERXP1/PCIETXP1 | PCIe Gen2 differential lanes | Two-lane PCIe root complex or endpoint mode - allows host connectivity or expansion of peripheral bandwidth (e.g., FPGA co-processing) |
Key Features
| Feature | Design Value |
|---|---|
| ARM + DSP Heterogeneous Compute | 2 × Cortex-A15 + 4 × C66x cores enable concurrent Linux-based control software and real-time DSP algorithms (e.g., video encode + network stack) |
| Multicore Navigator | 16k hardware queues with descriptor-based packet DMA eliminate software overhead in data path forwarding and buffer management |
| Network Coprocessor | Integrated Packet Accelerator handles GTP-U, SCTP, PDCP, and RoHC header compression/decompression at line rate - reduces CPU load in LTE/EPC gateways |
| SmartReflex Dynamic Voltage Scaling | Real-time core voltage adjustment based on workload and temperature - lowers power consumption in burst-mode media processing without performance loss |
| IEEE 1588 Hardware Timestamping | Dedicated timestamp units in Ethernet subsystem and timer modules - enables sub-microsecond time synchronization for TSN and wireless fronthaul |
Applications
| Wireless Baseband Processing | Media Transcoding Gateway |
|---|---|
Use Scenario: LTE eNodeB baseband unit performing Layer 1 PHY processing and Layer 2 MAC scheduling. IC Role / Device Role / Timing Role: 66AK2H06DXAAW2 executes real-time C66x-based FFT, channel estimation, and turbo decoding while ARM cores run RRC and S1AP stacks. Use Value: Integrated Packet Accelerator offloads GTP-U tunneling and PDCP ciphering, enabling 1.5 Mpackets/s throughput at <10 µs latency per packet. |
Use Scenario: Cloud-based video transcoding node converting 4K UHD streams to adaptive bitrate profiles for OTT delivery. IC Role / Device Role / Timing Role: C66x DSPs perform motion estimation, DCT, and quantization; ARM cores manage FFmpeg pipeline, HTTP streaming, and DRM. Use Value: 6 MB MSMC SRAM enables zero-copy frame buffering between DSP and ARM domains, reducing DDR3 traffic by >40% versus discrete solutions. |
| Industrial Analytics Edge Node | Secure Network Appliance |
Use Scenario: Factory-floor edge server aggregating sensor data from 100+ IoT nodes and running real-time anomaly detection models. IC Role / Device Role / Timing Role: ARM cores host Linux OS and inference engine; C66x cores accelerate FFT-based spectral analysis and filtering on streaming sensor inputs. Use Value: Fourteen 64-bit timers support synchronized sampling across multiple ADC channels with microsecond-level jitter control. |
Use Scenario: Enterprise firewall appliance performing deep packet inspection, TLS termination, and IPsec VPN gateway functions. IC Role / Device Role / Timing Role: Security Accelerator handles AES-GCM encryption/decryption and SHA-2 hashing; ARM cores run Snort and OpenVPN stacks. Use Value: Dedicated crypto engine delivers 2.4 Gbps IPSec throughput without consuming ARM or DSP cycles - maintains full wire-speed performance under encryption load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore DSP+ARM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 66AK2H12DXAAW2 | 8 × C66x DSP cores + 4 × ARM Cortex-A15 cores; 20 × 64-bit timers; same AAW package | Higher compute density for full-LTE macro base station or 10GbE media switch; requires more power and thermal margin | Select when >4 DSP cores needed for concurrent multi-carrier PHY or higher packet rates; verify PCB thermal design and DDR3 routing capacity |
| OMAP5432AAZCEA | 2 × ARM Cortex-A15 + 2 × C64x+ DSP; no integrated packet/security accelerator; 128KB L2 cache per ARM core | Lower-cost entry for non-real-time multimedia or legacy DSP migration; lacks KeyStone II interconnect and hardware offload engines | Choose for cost-sensitive applications without GTP-U/PDCP or IPSec requirements; expect software-only crypto and reduced packet throughput |
Compared with 66AK2H12DXAAW2 and OMAP5432AAZCEA, the 66AK2H06DXAAW2 offers balanced DSP/ARM ratio and integrated accelerators ideal for mid-tier infrastructure-delivering deterministic packet processing and crypto offload without over-provisioning core count or power budget.
Availability
66AK2H06DXAAW2 is available at Aetrix Electronics and suitable for wireless infrastructure, media transcoding, industrial analytics, and secure networking applications requiring stable component supply across long product lifecycles.
Supply support for 66AK2H06DXAAW2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and digital signal processing technologies, with leadership in high-performance SoCs for communications and industrial markets.
The 66AK2Hxx family was designed to deliver scalable, heterogeneous compute for embedded infrastructure-integrating ARM application processing, DSP signal processing, and hardware-accelerated networking/security in a single die.
FAQ
What is the maximum operating frequency of the ARM and DSP cores in the 66AK2H06DXAAW2?
The 66AK2H06DXAAW2 features two ARM Cortex-A15 processors operating up to 1.4 GHz and four TMS320C66x DSP cores operating up to 1.2 GHz. These frequencies are guaranteed under recommended operating conditions including junction temperature ≤ 100°C and proper power rail sequencing. The 66AK2H06DXAAW2 achieves 38.4 GMACS/core and 19.2 GFLOPS/core at 1.2 GHz for fixed- and floating-point workloads respectively.
Does the 66AK2H06DXAAW2 support DDR3L memory?
Yes, the 66AK2H06DXAAW2 supports both DDR3 and DDR3L memory through its dual 72-bit EMIF interfaces, with operation up to 1600 MHz. The DDR3L compatibility is explicitly confirmed in Revision G of the SPRS866G datasheet, which updated DVDD15 power supply specifications to 1.35/1.5 V to accommodate DDR3L VDDQ requirements. This allows lower-power memory subsystem design without sacrificing bandwidth.
How many 64-bit timers does the 66AK2H06DXAAW2 include, and what are their primary use cases?
The 66AK2H06DXAAW2 integrates fourteen 64-bit configurable timers, as specified in Table 3-1 of the SPRS866G datasheet. These timers support free-running, periodic, and one-shot modes with programmable prescalers and interrupt generation. They are commonly used for real-time task scheduling, timestamping of network packets in the 5-port Ethernet switch, synchronization of sensor sampling in industrial analytics, and watchdog supervision across heterogeneous cores.
Is the 66AK2H06DXAAW2 pin-compatible with other devices in the 66AK2Hxx family?
The 66AK2H06DXAAW2 shares the same AAW 1517-pin BGA package and mechanical footprint with 66AK2H12DXAAW2 and 66AK2H14DXAAW2, but it is not fully pin-compatible due to functional differences. Specifically, XFI (10-GbE) pins present on 66AK2H14 are reserved (no-connect) on 66AK2H06DXAAW2, and certain HyperLink, PCIe, and timer signals differ in allocation. Board reuse requires schematic and layout review against the specific 66AK2H06DXAAW2 pin map in Section 4.2 of SPRS866G.
What security acceleration capabilities does the 66AK2H06DXAAW2 provide?
The 66AK2H06DXAAW2 includes a dedicated Security Accelerator supporting ECB, CBC, CTR, F8, A5/3, CCM, GCM, HMAC, CMAC, GMAC, AES, DES, 3DES, Kasumi, SNOW 3G, SHA-1, SHA-2 (256-bit hash), and MD5. It delivers up to 2.4 Gbps IPSec throughput and 2.4 Gbps air ciphering, offloading crypto operations from ARM and DSP cores. This capability is confirmed in Section 1.1 and Table 3-1 of the SPRS866G datasheet and applies identically across the 66AK2Hxx family, including the 66AK2H06DXAAW2.
66AK2H06DXAAW2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- *
- Package/Case:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- -
- Interface:
- -
- Clock Rate:
- -
- Non-Volatile Memory:
- -
- On-Chip RAM:
- -
- Voltage - I/O:
- -
- Voltage - Core:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
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- Supplier Device Package:
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66AK2H06DXAAW2 FAQ
1.How can I place an order for 66AK2H06DXAAW2 through Aetrix?
Please submit a Request for Quotation (RFQ) for 66AK2H06DXAAW2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 66AK2H06DXAAW2 reliable?
The price and inventory of 66AK2H06DXAAW2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 66AK2H06DXAAW2 is usually 5 days.
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5.How can I obtain technical support or documentation for 66AK2H06DXAAW2?
For technical support, including 66AK2H06DXAAW2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 66AK2H06DXAAW2 requirements.
6.How does Aetrix verify that 66AK2H06DXAAW2 is sourced from the original manufacturer or authorized distributors?
All 66AK2H06DXAAW2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 66AK2H06DXAAW2 meets industry standards.
7.What is the process for return or replacement of 66AK2H06DXAAW2?
All 66AK2H06DXAAW2 units undergo pre-shipment inspection (PSI). If there is an issue with 66AK2H06DXAAW2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 66AK2H06DXAAW2 part is unused and in its original packaging.
Return procedure for 66AK2H06DXAAW2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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