Texas Instruments 66AK2H12BAAWA2

Overview

66AK2H12BAAWA2 from Texas Instruments is a KeyStone II–based multicore SoC integrating four ARM Cortex-A15 processors (up to 1.4 GHz) and eight TMS320C66x DSP cores (up to 1.2 GHz), 6 MB shared MSMC SRAM, dual 72-bit DDR3/DDR3L interfaces (1600 MHz), and a 5-port Gigabit Ethernet switch. It delivers 5.6 GHz ARM + 9.6 GHz DSP compute for media processing, cloud infrastructure, and secure networking applications.

For engineers reviewing the 66AK2H12BAAWA2 datasheet, 66AK2H12BAAWA2 pinout, 66AK2H12BAAWA2 application, or 66AK2H12BAAWA2 equivalent, key selection considerations include its 1517-pin AAW BGA package, SmartReflex™ voltage scaling, dual DDR3 EMIF bandwidth, hardware-accelerated packet and security processing, and IEEE 1588 time synchronization support.

Technical Context

The 66AK2H12BAAWA2 implements a tightly coupled heterogeneous architecture: ARM CorePac provides Linux-capable general-purpose control and management, while eight C66x DSP CorePacs execute parallel signal- and media-intensive workloads with 38.4 GMACS/core and 19.2 GFLOPS/core at 1.2 GHz. The Multicore Navigator enables zero-overhead packet DMA across 16k hardware queues.

Its Network Coprocessor integrates a Packet Accelerator (supporting GTP-U, SCTP, PDCP, RoHC) and Security Accelerator (AES, SHA-2, IPSec, air ciphering up to 2.4 Gbps), both connected via ACE-coherent AXI to the ARM cluster and MSMC. The 5-port SGMII Ethernet switch operates at wire speed without host CPU intervention.

Key Specifications

Pinout & Package

The 66AK2H12BAAWA2 is housed in a 40.0 mm × 40.0 mm, 1517-ball flip-chip plastic BGA (package code AAW), with 1.0 mm ball pitch and Pb-free finish. Thermal design requires exposed thermal pad under die.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar multicore DSP+ARM SoC applications.

Compared with 66AK2H14BAAWA2, the 66AK2H12BAAWA2 omits 10-GbE hardware but retains identical DSP/ARM compute, memory bandwidth, and accelerator capabilities-making it optimal for cost-sensitive 1-GbE infrastructure. Versus OMAP5432AAAB, it delivers 3× higher DSP throughput, dual DDR3 bandwidth, and integrated security/packet engines essential for carrier-grade deployments.

Availability

66AK2H12BAAWA2 is available at Aetrix Electronics and suitable for media transcoding servers, wireless baseband units, network function virtualization platforms, and high-performance analytics appliances requiring stable component supply across extended temperature ranges (–40°C to 100°C).

Supply support for 66AK2H12BAAWA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets.

The 66AK2Hxx product line was designed specifically for high-throughput, low-latency infrastructure applications-including cloud computing, wireless infrastructure, and real-time media processing-where heterogeneous compute, hardware acceleration, and deterministic timing are critical.

FAQ

What is the maximum operating frequency of the ARM and DSP cores in the 66AK2H12BAAWA2?

The 66AK2H12BAAWA2 integrates four ARM Cortex-A15 processors operating up to 1.4 GHz and eight TMS320C66x DSP cores operating up to 1.2 GHz. These frequencies are guaranteed under recommended operating conditions (0°C to 85°C commercial or –40°C to 100°C extended temperature range) with proper power delivery and thermal management. The 66AK2H12BAAWA2 achieves 5.6 GHz aggregate ARM and 9.6 GHz aggregate DSP computational throughput.

Does the 66AK2H12BAAWA2 support DDR3L memory, and what are the voltage requirements?

Yes, the 66AK2H12BAAWA2 supports both DDR3 and DDR3L memory across its dual 72-bit interfaces, operating at speeds up to 1600 MHz. DVDD15 supplies the DDR3 I/O domain and is specified at 1.35 V or 1.5 V depending on memory type and speed grade; this is explicitly documented in the Recommended Operating Conditions table of the SPRS866G datasheet. The 66AK2H12BAAWA2 implements SmartReflex™ to dynamically adjust voltage based on frequency and temperature.

How many Ethernet ports does the 66AK2H12BAAWA2 integrate, and what standards do they support?

The 66AK2H12BAAWA2 integrates a five-port Gigabit Ethernet switch subsystem using SGMII interfaces-four external ports plus one internal port for interconnection. It supports IEEE 1588-2008 Annex D/E and SyncE for precise time synchronization, enabling deterministic packet forwarding in TSN and fronthaul applications. Unlike the 66AK2H14, the 66AK2H12BAAWA2 does not include XFI-based 10-GbE ports.

What hardware accelerators are included in the 66AK2H12BAAWA2, and what protocols do they support?

The 66AK2H12BAAWA2 includes two dedicated hardware accelerators: the Packet Accelerator supports GTP-U, SCTP, PDCP, RoHC, and transport-plane IPsec at 1 Gbps wire speed; the Security Accelerator supports AES (ECB/CBC/CTR/GCM), SHA-1/SHA-2, HMAC, Kasumi, SNOW3G, and 3GPP air interface ciphering at up to 2.4 Gbps. Both accelerators are accessible via the Multicore Navigator and operate independently of ARM/DSP cores.

Is the 66AK2H12BAAWA2 pin-compatible with other devices in the 66AK2Hxx family, and what are the key package constraints?

Yes, the 66AK2H12BAAWA2 shares the same 1517-ball AAW BGA package (40.0 mm × 40.0 mm, 1.0 mm pitch) and pinout with 66AK2H14BAAWA2 and 66AK2H06BAAWA2. However, 14 XFI balls reserved for 10-GbE in the 66AK2H14 are NoConnect (NC) in the 66AK2H12BAAWA2. Thermal design must accommodate the exposed thermal pad, and PCB layout must follow TI's guidelines for high-speed DDR3, SGMII, and HyperLink signal integrity.