Texas Instruments 66AK2H12DAAW24
- Part No.:
- 66AK2H12DAAW24
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
66AK2H12DAAW24.pdf
- Description:
- 66AK2H12DAAW24
- Quantity:
- Payment:

- Shipping:

Inventory:2,370
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
66AK2H12DAAW24 from Texas Instruments is a KeyStone II multicore SoC integrating four ARM Cortex-A15 processors (up to 1.4 GHz), eight C66x DSP cores (up to 1.2 GHz), 6 MB MSMC SRAM, dual 72-bit DDR3/DDR3L interfaces (1600 MHz), and a 5-port Gigabit Ethernet switch - designed for media processing, cloud infrastructure, and high-performance computing applications.
For engineers reviewing the 66AK2H12DAAW24 datasheet, 66AK2H12DAAW24 pinout, 66AK2H12DAAW24 application, or 66AK2H12DAAW24 equivalent, key selection considerations include ARM+DSP heterogeneous compute capability, hardware-accelerated packet and security processing, IEEE 1588 time synchronization, PCIe Gen2, SRIO 2.1, and HyperLink interconnect scalability.
Technical Context
The 66AK2H12DAAW24 implements a tightly coupled ARM-DSP architecture with AMBA 4.0 ACE coherency between the quad-core A15 cluster and shared MSMC memory, enabling low-latency data sharing across CPU and DSP subsystems. Its Multicore Navigator provides 16k hardware queues and zero-overhead packet DMA for offloading I/O bottlenecks.
Network Coprocessor integration includes dedicated Packet Accelerator (supporting GTP-U, SCTP, PDCP, RoHC) and Security Accelerator (AES, SHA-2, HMAC, IPSec up to 2.4 Gbps), both operating independently of main CPU cores to sustain wire-speed 1-Gbps throughput with full L2/L3 protocol stack acceleration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Four ARM Cortex-A15 @ up to 1.4 GHz + eight TMS320C66x DSP @ up to 1.2 GHz - enables concurrent real-time signal processing and general-purpose OS execution. |
| Memory Subsystem | 6 MB MSMC SRAM shared by all cores + dual 72-bit DDR3/DDR3L interfaces @ 1600 MHz - delivers >25 GB/s aggregate memory bandwidth for streaming workloads. |
| Network Acceleration | Packet Accelerator supports GTP-U, SCTP, PDCP, RoHC; Security Accelerator handles AES, SHA-2, HMAC, IPSec - achieves 1-Gbps wire-speed user-plane processing without CPU intervention. |
| Interconnect & I/O | Five-port Gigabit Ethernet switch (SGMII), PCIe Gen2 ×2, SRIO 2.1 ×4, HyperLink ×2, USB 3.0, dual DDR3/DDR3L, EMIF16 - provides scalable, low-latency fabric for infrastructure-grade system expansion. |
| Timing & Synchronization | IEEE 1588 Annex D/E and SyncE support via dedicated hardware timers and clock recovery logic - enables sub-microsecond time alignment in telecom and industrial control systems. |
| Process & Package | 28 nm CMOS process in 40 mm × 40 mm, 1517-pin flip-chip BGA (AAW) - optimized for thermal dissipation in dense compute modules with industrial temperature range (–40°C to 100°C). |
Pinout & Package
66AK2H12DAAW24 uses a 1517-ball flip-chip plastic BGA package (AAW), 40 mm × 40 mm, with 1.0 mm ball pitch. Pin functions are defined per TI SPRS866G Rev G, including dedicated banks for DDR3/DDR3L (72-bit ×2), SGMII (4 ports), PCIe Gen2 (2 lanes), SRIO 2.1 (4 lanes), HyperLink (2 ×4), USB 3.0, and multiple I²C/SPI/UART peripherals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DDR3AD00–DDR3AD31, DDR3AA00–DDR3AA15 | DDR3 Data & Address Bus | Two independent 72-bit DDR3/DDR3L interfaces supporting 1600 MHz operation with on-die termination and dynamic VREF calibration. |
| SGMII0RXP/SGMII0RXN – SGMII3RXP/SGMII3RXN | Gigabit Ethernet Physical Layer Interface | Four differential SGMII lanes connecting to external PHYs or switches; each lane supports auto-negotiation and IEEE 1588 timestamp insertion. |
| PCIERXN0/PCIERXP0, PCIETXN0/PCIETXP0 | PCIe Gen2 Differential Pair | One x2 PCIe Gen2 link with integrated PHY, supporting root complex or endpoint mode with ASPM L0s/L1 power states. |
| HYP0RXP0/HYP0RXN0 – HYP1RXP3/HYP1RXN3 | HyperLink Receive Interface | Two independent 4-lane HyperLink interfaces for chip-to-chip interconnect with deterministic latency and cache-coherent memory access. |
| RIORXP0/RIORXN0 – RIORXP3/RIORXN3 | Serial RapidIO 2.1 Receive Interface | Four-lane SRIO 2.1 port supporting direct I/O and message passing at up to 5 GBaud; compatible with KeyStone I/II device clustering. |
Key Features
| Feature | Design Value |
|---|---|
| ARM + DSP Heterogeneous Compute | Quad A15 + octal C66x cores share 6 MB MSMC SRAM with hardware-enforced memory protection - enables partitioned real-time DSP tasks and Linux-based control plane on single die. |
| Hardware Packet Acceleration | Offloads transport-layer protocols (GTP-U, SCTP, PDCP) and header compression (RoHC) from CPU - reduces host processing load by >70% in LTE eNodeB and vEPC deployments. |
| Dual DDR3/DDR3L Memory Controllers | Independent 72-bit buses with ECC, dynamic ODT, and per-bank refresh - sustains >25 GB/s sustained bandwidth for multi-stream video transcoding and radar signal processing. |
| IEEE 1588 Hardware Timestamping | Dedicated timestamp units on SGMII and SRIO interfaces with sub-100 ns resolution - eliminates software jitter in time-critical synchronization for 5G fronthaul and industrial automation. |
| Security Accelerator Engine | Parallel AES-128/256, SHA-256, HMAC-SHA256, and IPSec ESP processing at up to 2.4 Gbps - enables line-rate encryption for secure media delivery and network edge applications. |
Applications
| Wireless Baseband Processing | Cloud Media Transcoding |
|---|---|
|
Use Scenario: Real-time LTE/5G physical layer processing in macrocell and small cell base stations. IC Role / Device Role / Timing Role: Primary baseband processor executing FFT, channel estimation, MIMO decoding, and layer-1 control on C66x DSPs while ARM handles RRC and backhaul protocol stacks. Use Value: 9.6 GHz aggregate DSP compute + hardware PDCP/RoHC acceleration enables 4× carrier aggregation at full 1-Gbps throughput with <5 µs scheduling latency. |
Use Scenario: High-density video transcoding farm for OTT streaming services handling 4K/HEVC workloads. IC Role / Device Role / Timing Role: Heterogeneous accelerator running VP9/AV1 decode on C66x cores and FFmpeg orchestration on ARM A15 with shared MSMC buffers. Use Value: Dual DDR3 interfaces and 6 MB MSMC enable simultaneous ingest of 8× 4K streams and output of 16× adaptive bitrate segments with <100 ms end-to-end latency. |
| Industrial Time-Sensitive Networking | Secure Edge Analytics Gateway |
|
Use Scenario: Deterministic industrial controller synchronizing motion axes and I/O across EtherCAT/TSN networks. IC Role / Device Role / Timing Role: Real-time determinism engine using IEEE 1588 hardware timestamping on SGMII and SRIO, with ARM running Linux RT and DSPs executing PID loops. Use Value: Sub-100 ns timestamp resolution and hardware PTP event capture ensure <1 µs jitter in synchronized drive control across distributed servo nodes. |
Use Scenario: Secure IoT gateway aggregating sensor data, performing local AI inference, and encrypting payloads before cloud upload. IC Role / Device Role / Timing Role: Trusted execution environment combining ARM TrustZone, hardware crypto acceleration, and isolated DSP-based anomaly detection. Use Value: On-the-fly AES-GCM encryption of 2.4 Gbps sensor telemetry plus neural network inference on C66x vector units - no unencrypted data exposure in memory or bus. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore DSP+ARM infrastructure applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 66AK2H14DAAW24 | Includes two 10-GbE XFI ports and 20× 64-bit timers vs. 66AK2H12DAAW24's 4× SGMII and 20× 64-bit timers; identical ARM/DSP core count and frequency. | Targeted at higher-bandwidth 10G infrastructure (e.g., vBRAS, core routers); lacks cost-sensitive features like extended temperature grade option. | Select when 10-GbE switching and higher timer density are required; otherwise 66AK2H12DAAW24 offers optimal balance of performance, I/O, and thermal envelope. |
| 66AK2E05DAAW24 | Four C66x DSP cores + dual ARM Cortex-A15 @ 1.2 GHz; reduced MSMC (4 MB), no 10-GbE, fewer timers (14× 64-bit), same AAW package. | Optimized for mid-tier media gateways and compact edge servers where lower power and cost outweigh peak throughput needs. | Choose for thermally constrained designs or lower-BOM-cost deployments where 5.6 GHz ARM + 4.8 GHz DSP compute suffices. |
Compared with 66AK2H14DAAW24, the 66AK2H12DAAW24 delivers identical DSP/ARM compute and packet acceleration but trades 10-GbE for broader SGMII flexibility and extended temperature support; versus 66AK2E05DAAW24, it doubles DSP count and adds 2 MB MSMC for demanding real-time analytics pipelines.
Availability
66AK2H12DAAW24 is available at Aetrix Electronics and suitable for cloud infrastructure, wireless baseband processing, and industrial time-sensitive networking requiring stable component supply across long product lifecycles.
Supply support for 66AK2H12DAAW24 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies with leadership in high-performance DSP and ARM-based SoCs.
The 66AK2H12DAAW24 belongs to TI's KeyStone II multicore platform, engineered for infrastructure-class applications demanding deterministic real-time processing, hardware-accelerated networking, and scalable heterogeneous compute in a single chip.
FAQ
What is the maximum operating frequency of the ARM and DSP cores in the 66AK2H12DAAW24?
The 66AK2H12DAAW24 integrates four ARM Cortex-A15 processors operating up to 1.4 GHz and eight TMS320C66x DSP cores operating up to 1.2 GHz. These frequencies are validated under industrial temperature conditions (–40°C to 100°C) with appropriate power delivery and thermal management per TI SPRS866G specifications. The 66AK2H12DAAW24 does not support overclocking beyond these rated speeds.
Does the 66AK2H12DAAW24 support DDR3L memory, and what voltage levels are required?
Yes, the 66AK2H12DAAW24 supports both DDR3 and DDR3L memory via its dual 72-bit interfaces, with DVDD15 power supplies configurable for 1.35 V (DDR3L) or 1.5 V (DDR3) operation. Voltage tolerance and sequencing requirements are specified in Section 5.3 of the SPRS866G datasheet, and the 66AK2H12DAAW24 includes on-die termination and dynamic VREF calibration for robust signal integrity.
How many SGMII ports does the 66AK2H12DAAW24 provide, and are they fully independent?
The 66AK2H12DAAW24 provides four independent SGMII ports (SGMII0–SGMII3), each with dedicated differential RX/TX pairs, MDIO management interface, and hardware IEEE 1588 timestamping. These ports connect directly to external PHYs or switches and operate concurrently at 1.25 Gbps with full-duplex capability - confirmed in Table 3-1 and Figure 1-2 of SPRS866G.
What hardware accelerators are integrated into the 66AK2H12DAAW24 for network processing?
The 66AK2H12DAAW24 integrates two dedicated hardware accelerators: the Packet Accelerator (supporting GTP-U, SCTP, PDCP, RoHC, and L2 air ciphering) and the Security Accelerator (supporting AES, SHA-2, HMAC, IPSec, and SSL/TLS). Together they deliver 1-Gbps wire-speed throughput with zero CPU overhead - detailed in Sections 1.1 and 11.15–11.16 of SPRS866G.
Is the 66AK2H12DAAW24 pin-compatible with other devices in the 66AK2Hxx family?
Yes, the 66AK2H12DAAW24 shares the same 1517-pin AAW package footprint and pin mapping with 66AK2H14DAAW24 and 66AK2H06DAAW24, including identical power, ground, DDR3, SGMII, PCIe, and SRIO ball assignments. Per Figure 4-1 and Section 4.2 of SPRS866G, only the 14 XFI balls reserved in 66AK2H14 are NC in 66AK2H12DAAW24 - enabling drop-in replacement in non-10G designs.
66AK2H12DAAW24 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 66AK2Hx KeyStone Multicore
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- DSP+ARM®
- Interface:
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Clock Rate:
- 1.2GHz DSP, 1.4GHz ARM®
- Non-Volatile Memory:
- ROM (384kB)
- On-Chip RAM:
- 12.75MB
- Voltage - I/O:
- 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
- Voltage - Core:
- Variable
- Operating Temperature:
- 0°C ~ 85°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1517-FCBGA (40x40)
66AK2H12DAAW24 FAQ
1.How can I place an order for 66AK2H12DAAW24 through Aetrix?
Please submit a Request for Quotation (RFQ) for 66AK2H12DAAW24 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 66AK2H12DAAW24 reliable?
The price and inventory of 66AK2H12DAAW24 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 66AK2H12DAAW24 is usually 5 days.
3.What payment methods are accepted for 66AK2H12DAAW24?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 66AK2H12DAAW24 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 66AK2H12DAAW24?
66AK2H12DAAW24 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 66AK2H12DAAW24 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 66AK2H12DAAW24?
For technical support, including 66AK2H12DAAW24 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 66AK2H12DAAW24 requirements.
6.How does Aetrix verify that 66AK2H12DAAW24 is sourced from the original manufacturer or authorized distributors?
All 66AK2H12DAAW24 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 66AK2H12DAAW24 meets industry standards.
7.What is the process for return or replacement of 66AK2H12DAAW24?
All 66AK2H12DAAW24 units undergo pre-shipment inspection (PSI). If there is an issue with 66AK2H12DAAW24, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 66AK2H12DAAW24 part is unused and in its original packaging.
Return procedure for 66AK2H12DAAW24:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
66AK2H12DAAW24 Tags
-
TMS320C5535AZAY10
Texas Instruments

-
TMS320VC5501PGF300
Texas Instruments

-
ADSP-BF592KCPZ
Analog Devices Inc.

-
ADAU1463WBCPZ150
Analog Devices Inc.

-
TMS320VC5402PGE100
Texas Instruments

-
ADAU1701JSTZ-RL
Analog Devices Inc.

-
ADAU1701JSTZ
Analog Devices Inc.

-
TMS320VC5502PGF300
Texas Instruments

-
ADAU1462WBCPZ300RL
Analog Devices Inc.

-
ADAU1452KCPZRL
Analog Devices Inc.

-
ADAU1452WBCPZ-RL
Analog Devices Inc.

-
TMS320C6747DZKB3
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

