Texas Instruments 66AK2H12DAAWA24
- Part No.:
- 66AK2H12DAAWA24
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
66AK2H12DAAWA24.pdf
- Description:
- 66AK2H12DAAWA24
- Quantity:
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Product details
Overview
66AK2H12DAAWA24 from Texas Instruments is a KeyStone II–based multicore SoC integrating four ARM Cortex-A15 processors (up to 1.4 GHz) and eight TMS320C66x DSP cores (up to 1.2 GHz), with 6 MB MSMC SRAM, dual 72-bit DDR3/DDR3L interfaces (1600 MHz), and a 5-port Gigabit Ethernet switch. It delivers 5.6 GHz ARM + 9.6 GHz DSP compute for media processing, wireless infrastructure, and secure packet forwarding.
For engineers reviewing the 66AK2H12DAAWA24 datasheet, 66AK2H12DAAWA24 pinout, 66AK2H12DAAWA24 application, or 66AK2H12DAAWA24 equivalent, key selection factors include its 1517-pin AAW BGA package, 20 × 64-bit timers, PCIe Gen2 ×2, SRIO 2.1 ×4, USB 3.0, and hardware-accelerated IPsec/GTP-U/PDCP at 1.5 Mpps wire speed.
Technical Context
The 66AK2H12DAAWA24 implements a tightly coupled heterogeneous architecture: ARM A15 cores handle OS, control plane, and high-level protocol stacks via AMBA 4.0 ACE coherency, while C66x DSPs execute real-time signal, video, and baseband processing in parallel. The Multicore Navigator provides 16k hardware queues and zero-overhead packet DMA between peripherals and memory subsystems.
Its Network Coprocessor integrates independent Packet Accelerator and Security Accelerator engines-supporting Transport Plane IPsec, GTP-U, SCTP, PDCP, RoHC, and air ciphering (AES, SHA-2, Kasumi, SNOW 3G)-with up to 2.4 Gbps IPSec throughput and IEEE 1588 time synchronization across all five SGMII ports.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Four ARM Cortex-A15 @ up to 1.4 GHz + eight C66x DSP @ up to 1.2 GHz - enables concurrent real-time signal processing and Linux-based control plane execution. |
| Memory Subsystem | 6 MB MSMC SRAM shared by all cores + dual 72-bit DDR3/DDR3L @ 1600 MHz - supports low-latency inter-core data exchange and high-bandwidth streaming I/O. |
| Network Acceleration | Packet Accelerator + Security Accelerator - offloads L2/L3/L4 packet processing (GTP-U, SCTP, PDCP) and crypto (AES, SHA-2, Kasumi) from CPU, sustaining 1.5 Mpps at 1 Gbps line rate. |
| Peripherals | 5-port Gigabit Ethernet switch (SGMII), PCIe Gen2 ×2, SRIO 2.1 ×4, USB 3.0, 3× I²C, 3× SPI, 2× UART, 32 GPIO - enables full-featured base station, media gateway, or analytics appliance design. |
| Timers & Clocking | Twenty 64-bit configurable timers + five on-chip PLLs - supports precise time-stamping, synchronization (IEEE 1588 Annex D/E), and multi-domain clock management for mixed-signal systems. |
| Package & Thermal | 1517-pin flip-chip BGA (AAW), 40 mm × 40 mm, 0°C to 85°C commercial temperature range - compatible with standard high-density PCB assembly and thermal management for embedded infrastructure. |
Pinout & Package
66AK2H12DAAWA24 uses a 1517-ball flip-chip plastic BGA (package code AAW), 40 mm × 40 mm, 1.0 mm ball pitch. Ball map includes dedicated banks for DDR3/DDR3L (72-bit ×2), SGMII (5 ports), PCIe Gen2 (2 lanes), SRIO 2.1 (4 lanes), HyperLink (2 ×4), USB 3.0, and power/ground distribution across multiple voltage domains (DVDD15, CVDD, VDDAHV, VDDALV, DVDD18, AVDDA).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DDR3AD00–DDR3AD31, DDR3AA00–DDR3AA15 | DDR3/DDR3L Data & Address Bus | Two independent 72-bit DDR3/DDR3L interfaces (64 data + 8 ECC bits each) supporting 1600 MHz operation with programmable timing and ODT control. |
| SGMII0RXP/SGMII0RXN – SGMII4RXP/SGMII4RXN | Gigabit Ethernet Physical Layer Interface | Five differential SGMII lanes for direct connection to external PHYs or optical modules; supports IEEE 1588 timestamping and auto-negotiation. |
| PCIERXN0/PCIERXP0, PCIETXN0/PCIETXP0 | PCIe Gen2 Differential Pair | Two fully compliant PCIe Gen2 lanes (5 GT/s) with integrated PHY, root complex or endpoint configuration, and MSI/MSI-X interrupt support. |
| HYP0RXP0/HYP0RXN0 – HYP1RXP3/HYP1RXN3 | HyperLink Differential I/O | Two 4-lane HyperLink interfaces enabling chip-to-chip scalability with deterministic latency, cache-coherent memory access, and up to 50 GBaud aggregate bandwidth. |
| RIORXP0/RIORXN0 – RIORXP3/RIORXN3 | Serial RapidIO 2.1 Interface | Four-lane SRIO 2.1 port supporting direct I/O and message passing at up to 5 GBaud; used for inter-processor communication in distributed processing systems. |
Key Features
| Feature | Design Value |
|---|---|
| ARM + DSP Heterogeneous Compute | Four Cortex-A15 cores (4 MB shared L2) + eight C66x DSPs (1024 KB L2 per CorePac) enable simultaneous control-plane software stack execution and real-time signal processing without resource contention. |
| Hardware Packet Acceleration | Offloads transport-layer protocols (GTP-U, SCTP, PDCP) and header compression (RoHC) from CPU, reducing host load and enabling deterministic 1-Gbps packet forwarding at <1 µs latency per packet. |
| Integrated Security Engine | Supports AES-128/256, SHA-2 (256-bit), HMAC, CMAC, Kasumi, SNOW 3G, and 3GPP air interface ciphering - delivers 2.4 Gbps IPSec and 2.4 Gbps air ciphering throughput with zero CPU cycles consumed. |
| Scalable Interconnect Fabric | TeraNet switch fabric + Multicore Navigator + MSMC enables coherent, low-latency communication among all 12 cores, accelerators, and peripherals - eliminating bus bottlenecks in high-throughput media pipelines. |
| Multi-Domain Power Management | SmartReflex™ dynamic voltage scaling per core domain (ARM, DSP, DDR, I/O) allows fine-grained power optimization - critical for thermal-constrained telecom and edge computing deployments. |
Applications
| Wireless Baseband Processing | Secure Media Gateway |
|---|---|
|
Use Scenario: LTE-Advanced eNodeB baseband unit performing real-time channel coding, MIMO processing, and layer-2 protocol handling. IC Role / Device Role / Timing Role: Primary SoC executing PHY-layer algorithms on C66x DSPs while running LTE stack and backhaul interface on ARM A15 cores with IEEE 1588 time sync. Use Value: 9.6 GHz DSP compute + hardware-accelerated PDCP/RoHC enables full 4×4 MIMO LTE-A Cat.6 throughput within single-chip power envelope (<15 W typical). |
Use Scenario: Carrier-grade media gateway terminating VoIP, video conferencing, and encrypted SIP sessions across multiple network segments. IC Role / Device Role / Timing Role: Central processing engine managing TLS/SSL termination, SRTP encryption, transcoding, and QoS-aware packet scheduling via Network Coprocessor. Use Value: Integrated Security Accelerator delivers 2.4 Gbps air ciphering and 2.4 Gbps IPSec throughput - eliminates need for external crypto ASICs and reduces BOM cost by >30%. |
| Video Analytics Appliance | High-Performance Computing Node |
|
Use Scenario: Edge AI inference server performing real-time object detection, facial recognition, and metadata extraction on HD/4K video streams. IC Role / Device Role / Timing Role: Heterogeneous accelerator hosting CNN inference kernels on C66x DSPs and runtime orchestration on ARM A15 with shared MSMC for zero-copy feature buffer access. Use Value: 6 MB on-chip MSMC SRAM enables caching of model weights and intermediate tensors - avoids DDR bandwidth bottlenecks and cuts inference latency by 40% vs. DDR-only architectures. |
Use Scenario: Compact HPC node for financial modeling, genomics alignment, or radar signal simulation requiring deterministic low-latency inter-core communication. IC Role / Device Role / Timing Role: Compute node leveraging HyperLink and SRIO for cache-coherent multi-chip scaling, with EDMA3 and Multicore Navigator enabling lock-free data movement across 12 cores. Use Value: Dual 72-bit DDR3 interfaces + TeraNet fabric deliver >50 GB/s aggregate memory bandwidth - sustains >90% peak compute utilization under sustained double-precision workloads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore DSP+ARM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 66AK2H14DAAWA24 | Includes two XFI 10-GbE ports and 20 × 64-bit timers; otherwise identical architecture, package, and peripheral set. | Required for 10-GbE backhaul or high-throughput packet capture; not needed for pure 1-GbE aggregation or media processing. | Select 66AK2H14DAAWA24 only if 10-GbE interface or additional timer resources are mandatory; 66AK2H12DAAWA24 offers identical DSP/ARM performance at lower cost and power. |
| 66AK2E05DAAWA24 | Four C66x DSPs + two ARM A15 cores; reduced MSMC (6 MB same), no 10-GbE, fewer timers (14 × 64-bit), same AAW package. | Suitable for cost-sensitive small-cell baseband or entry-level media transcoders where full 8-DSP/4-ARM capacity is unnecessary. | Choose 66AK2E05DAAWA24 when system requirements fit within half the compute resources; retains pin compatibility and software scalability path to 66AK2H12DAAWA24. |
Compared with 66AK2H14DAAWA24, the 66AK2H12DAAWA24 removes 10-GbE hardware but retains full DSP/ARM performance and security acceleration - making it optimal for 1-GbE–centric infrastructure. Against 66AK2E05DAAWA24, it doubles both DSP and ARM core count while maintaining identical package and software compatibility - enabling seamless performance scaling without PCB redesign.
Availability
66AK2H12DAAWA24 is available at Aetrix Electronics and suitable for wireless infrastructure, video analytics, secure media gateways, and high-performance computing applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for 66AK2H12DAAWA24 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies, with leadership in high-performance DSP and ARM-based SoCs for infrastructure and industrial markets.
The 66AK2Hxx product line was designed for embedded infrastructure applications including cloud computing, media processing, transcoding, security, and wireless baseband - delivering integrated DSP+ARM compute, hardware acceleration, and scalable interconnect in a single die.
FAQ
What is the maximum operating frequency of the ARM and DSP cores in the 66AK2H12DAAWA24?
The 66AK2H12DAAWA24 features four ARM Cortex-A15 processors operating up to 1.4 GHz and eight TMS320C66x DSP cores operating up to 1.2 GHz. These frequencies are guaranteed under recommended operating conditions (0°C to 85°C case temperature) with appropriate power delivery and thermal management. The 66AK2H12DAAWA24 achieves 5.6 GHz aggregate ARM compute and 9.6 GHz aggregate DSP compute, validated in TI's SPRS866G datasheet revision G.
Does the 66AK2H12DAAWA24 support DDR3L memory, and what are the voltage requirements?
Yes, the 66AK2H12DAAWA24 supports both DDR3 and DDR3L memory across its dual 72-bit interfaces, with DDR3L operation enabled at 1.35 V (DVDD15 supply). The device specifies DVDD15 as 1.35/1.5 V in its Recommended Operating Conditions table, allowing flexible memory selection based on system power and thermal targets. This dual-voltage support is confirmed in revision G of the SPRS866G datasheet.
How many Ethernet ports does the 66AK2H12DAAWA24 integrate, and what standards do they support?
The 66AK2H12DAAWA24 integrates a five-port Gigabit Ethernet switch subsystem using SGMII physical interfaces - supporting IEEE 802.3, IEEE 1588-2008 Annex D/E (PTP), and SyncE. It does not include XFI 10-GbE ports (reserved in this variant), distinguishing it from the 66AK2H14. All five SGMII ports are fully functional and share the integrated switch fabric and packet acceleration engine.
Is the 66AK2H12DAAWA24 pin-compatible with other devices in the 66AK2Hxx family?
Yes, the 66AK2H12DAAWA24 shares the identical 1517-pin AAW BGA package and ball map with 66AK2H14DAAWA24 and 66AK2H06DAAWA24. Pin functions are consistent across the family, with unused pins (e.g., XFI signals in 66AK2H12/06) designated as reserved (RSV) per Figure 4-1 and Table 3-1 in SPRS866G. This enables common PCB layout across variants.
What hardware security features are implemented in the 66AK2H12DAAWA24?
The 66AK2H12DAAWA24 includes a dedicated Security Accelerator engine supporting ECB/CBC/CTR/A5/3/CCM/GCM/HMAC/CMAC/GMAC/AES/DES/3DES/Kasumi/SNOW 3G/SHA-1/SHA-2/MD5 - delivering up to 2.4 Gbps IPSec and 2.4 Gbps air ciphering throughput. These functions are hardware-accelerated and operate independently of the ARM and DSP cores, as documented in Section 11.16 of SPRS866G.
66AK2H12DAAWA24 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 66AK2Hx KeyStone Multicore
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- DSP+ARM®
- Interface:
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Clock Rate:
- 1.2GHz DSP, 1.4GHz ARM®
- Non-Volatile Memory:
- ROM (384kB)
- On-Chip RAM:
- 12.75MB
- Voltage - I/O:
- 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
- Voltage - Core:
- Variable
- Operating Temperature:
- -40°C ~ 100°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1517-FCBGA (40x40)
66AK2H12DAAWA24 FAQ
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Please submit a Request for Quotation (RFQ) for 66AK2H12DAAWA24 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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For technical support, including 66AK2H12DAAWA24 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 66AK2H12DAAWA24 requirements.
6.How does Aetrix verify that 66AK2H12DAAWA24 is sourced from the original manufacturer or authorized distributors?
All 66AK2H12DAAWA24 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 66AK2H12DAAWA24 meets industry standards.
7.What is the process for return or replacement of 66AK2H12DAAWA24?
All 66AK2H12DAAWA24 units undergo pre-shipment inspection (PSI). If there is an issue with 66AK2H12DAAWA24, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 66AK2H12DAAWA24 part is unused and in its original packaging.
Return procedure for 66AK2H12DAAWA24:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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