Texas Instruments 66AK2H12DXAAWA24
- Part No.:
- 66AK2H12DXAAWA24
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
66AK2H12DXAAWA24.pdf
- Description:
- 66AK2H12DXAAWA24
- Quantity:
- Payment:

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Product details
Overview
66AK2H12DXAAWA24 from Texas Instruments is a KeyStone II multicore SoC integrating four ARM Cortex-A15 processors (up to 1.4 GHz) and eight TMS320C66x DSP cores (up to 1.2 GHz), with 6 MB shared MSMC SRAM, dual 72-bit DDR3/DDR3L interfaces (1600 MHz), and integrated network coprocessor supporting 1-Gbps wire-speed packet acceleration and security offload. It targets high-performance media processing and embedded infrastructure systems.
For engineers reviewing the 66AK2H12DXAAWA24 datasheet, 66AK2H12DXAAWA24 pinout, 66AK2H12DXAAWA24 application, or 66AK2H12DXAAWA24 equivalent, key selection considerations include its 1517-pin AAW BGA package, 20 × 64-bit timers, five EDMA modules, and absence of 10-GbE XFI ports (reserved in this variant), distinguishing it from the 66AK2H14.
Technical Context
The 66AK2H12DXAAWA24 implements a heterogeneous multicore architecture where ARM A15 cores handle general-purpose OS execution and system control, while C66x DSP cores perform real-time signal and media processing. Its Multicore Navigator provides 16k hardware queues and zero-overhead packet DMA for inter-core data movement.
The integrated Network Coprocessor includes dedicated Packet Accelerator (supporting GTP-U, SCTP, PDCP, RoHC) and Security Accelerator (AES, SHA-2, HMAC, IPSec up to 2.4 Gbps), enabling offload of L2/L3 protocol stack and cryptographic operations from the main CPU cluster.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | 4× ARM Cortex-A15 @ up to 1.4 GHz + 8× TMS320C66x DSP @ up to 1.2 GHz - enables concurrent high-level OS tasks and deterministic real-time DSP workloads |
| Memory Subsystem | 6 MB MSMC SRAM shared across all cores + dual 72-bit DDR3/DDR3L @ 1600 MHz - provides low-latency on-chip memory and high-bandwidth external memory access |
| Network Acceleration | 1-Gbps wire-speed packet processing with Transport Plane IPsec/GTP-U/SCTP/PDCP - eliminates host CPU overhead for telecom/datacom protocol handling |
| Security Engine | AES/SHA-2/HMAC/CMAC/GCM up to 2.4 Gbps IPSec & air ciphering - accelerates encryption/decryption for secure media transport and wireless backhaul |
| Peripherals | 5-port Gigabit Ethernet switch (SGMII), 4-lane SRIO 2.1, 2-lane PCIe Gen2, USB 3.0, 3× I²C, 3× SPI, 2× UART, 32 GPIO - supports full-system connectivity without external bridge ICs |
| Timers & DMA | Twenty 64-bit configurable timers + five EDMA modules - enables precise timing control and high-throughput memory-to-peripheral transfers in media pipelines |
| Package & Process | 1517-pin flip-chip BGA (AAW), 40 mm × 40 mm, 0.028 µm process - standard high-I/O density package compatible with industrial PCB assembly processes |
Pinout & Package
66AK2H12DXAAWA24 uses a 1517-ball flip-chip plastic BGA (package code AAW, 40.0 mm × 40.0 mm), with ball pitch of 1.0 mm. Pin functions are defined per TI SPRS866G Rev G, with reserved XFI balls (for 10-GbE) unused in this variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DDR3AD00–DDR3AD54 | DDR3 Address/Data/Strobe | Two independent 72-bit DDR3/DDR3L interfaces with full DQS/DQ/DQM/CK/CS/ODT support - enables dual-channel memory bandwidth up to 25.6 GB/s |
| HYP0RXP0–HYP1TXP3 | HyperLink Differential I/O | Two 4-lane HyperLink interfaces for chip-to-chip coherent interconnect at up to 50 GBaud - used for scalable multi-SoC system expansion |
| RIORXN0–RIOTXP3 | Serial RapidIO 2.1 I/O | Four-lane SRIO 2.1 port supporting direct I/O and message passing - provides deterministic low-latency inter-processor communication |
| SGMII0RXP–SGMII3TXN | Gigabit Ethernet PHY Interface | Four SGMII lanes connected to internal 5-port Ethernet switch - supports four independent 1-GbE links plus one internal switch port |
| PCIERXN0–PCIETXP1 | PCIe Gen2 Differential Pair | Two-lane PCIe Gen2 interface operating at 5 GT/s - enables high-speed connection to FPGAs, NICs, or storage controllers |
Key Features
| Feature | Design Value |
|---|---|
| ARM + DSP Heterogeneous Compute | Four Cortex-A15 cores (4 MB shared L2) + eight C66x DSPs (1024 KB L2 each) enable parallel OS + real-time signal processing in single die |
| Hardware Queue Management | Multicore Navigator with 16k queues and packet-based DMA eliminates software scheduling overhead for inter-core data flow |
| Integrated Network Coprocessor | Dedicated hardware for GTP-U, SCTP, PDCP, RoHC, and IPSec offload - reduces host CPU load by >80% in LTE baseband/media gateway use cases |
| Memory Coherency Support | AMBA 4.0 ACE master port from ARM CorePac to MSMC - enables cache-coherent access to shared 6 MB SRAM across ARM and DSP clusters |
| Power-Optimized Architecture | SmartReflex™ dynamic voltage scaling across core, I/O, and memory domains - achieves <15 W typical power in media transcoding workloads |
Applications
| Wireless Baseband Processing | Media Transcoding Gateway |
|---|---|
|
Use Scenario: LTE-Advanced macrocell baseband unit performing real-time layer-1 PHY processing and layer-2 protocol stack handling. IC Role / Device Role / Timing Role: Primary baseband SoC executing channel coding, FFT/IFFT, RLC/MAC/PDCP, and security offload via integrated coprocessors. Use Value: 9.6 GHz aggregate DSP compute + hardware-accelerated PDCP/RoHC enables full 4×20 MHz carrier aggregation with sub-100 µs latency. |
Use Scenario: Cloud-based video transcoding node converting 4K UHD streams between HEVC, AVC, and VP9 formats for adaptive bitrate delivery. IC Role / Device Role / Timing Role: Main media processor running VSDK on ARM cores while offloading motion estimation, DCT, and entropy coding to C66x DSPs. Use Value: 38.4 GMACS/core fixed-point performance enables real-time 4K@60fps transcode with <50 ms end-to-end pipeline latency. |
| Secure Network Appliance | High-Performance Radar Processing |
|
Use Scenario: Next-generation firewall/UTM appliance performing deep packet inspection, TLS decryption, and IPSec tunnel termination at 1 Gbps line rate. IC Role / Device Role / Timing Role: Central security processor using Network Coprocessor for packet parsing and Security Accelerator for crypto offload. Use Value: 2.4 Gbps IPSec throughput and 1-Gbps wire-speed DPI eliminate bottlenecks in encrypted traffic inspection. |
Use Scenario: Active electronically scanned array (AESA) radar front-end performing real-time beamforming, CFAR detection, and pulse-Doppler processing. IC Role / Device Role / Timing Role: Real-time signal processor executing FFT, STAP, and SAR imaging algorithms on C66x DSPs with deterministic latency. Use Value: 19.2 GFLOPS/core floating-point capability enables 1024-point complex FFT in <2 µs, meeting airborne radar timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore DSP+ARM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 66AK2H14DXAAWA24 | Includes two 10-GbE XFI ports; identical ARM/DSP count, clock, and memory subsystem | Required for 10-GbE uplink in media edge routers or high-throughput packet capture systems | Select when 10-GbE physical layer connectivity is mandatory; otherwise 66AK2H12DXAAWA24 offers cost and power advantage |
| 66AK2H06DXAAWA24 | 4× C66x DSP cores + 2× ARM Cortex-A15 cores; reduced timer count (14× 64-bit) | Suitable for entry-level media gateways or lightweight baseband units with lower throughput requirements | Choose for cost-sensitive designs with ≤2.4 GHz aggregate DSP compute need and no requirement for full 8-core DSP parallelism |
Compared with 66AK2H14DXAAWA24, the 66AK2H12DXAAWA24 removes 10-GbE XFI pins while retaining identical DSP/ARM performance and memory bandwidth-ideal for 1-GbE-centric infrastructure. Against 66AK2H06DXAAWA24, it doubles DSP core count and ARM cores, enabling higher concurrency in real-time media pipelines.
Availability
66AK2H12DXAAWA24 is available at Aetrix Electronics and suitable for wireless infrastructure, media transcoding, and secure networking applications requiring stable component supply across long product lifecycles.
Supply support for 66AK2H12DXAAWA24 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and digital signal processing technologies, with leadership in high-performance SoCs for communications and industrial markets.
The 66AK2Hxx family was designed for embedded infrastructure applications including cloud computing, media processing, security, and wireless baseband-delivering multicore DSP+ARM integration with hardware-accelerated networking and security.
FAQ
What is the maximum operating frequency of the ARM and DSP cores in the 66AK2H12DXAAWA24?
The 66AK2H12DXAAWA24 features four ARM Cortex-A15 processors operating up to 1.4 GHz and eight TMS320C66x DSP cores operating up to 1.2 GHz. These frequencies are guaranteed under recommended operating conditions (0°C to 85°C case temperature) and supported by SmartReflex™ dynamic voltage scaling. The 66AK2H12DXAAWA24 delivers 5.6 GHz aggregate ARM compute and 9.6 GHz aggregate DSP compute.
Does the 66AK2H12DXAAWA24 support DDR3L memory?
Yes, the 66AK2H12DXAAWA24 supports both DDR3 and DDR3L memory through its dual 72-bit DDR3/DDR3L interfaces, which operate at speeds up to 1600 MHz. The device accommodates 1.35 V DDR3L operation alongside standard 1.5 V DDR3, as confirmed in Revision G of the SPRS866G datasheet. This flexibility allows optimization of power consumption in thermally constrained systems.
How many 64-bit timers does the 66AK2H12DXAAWA24 include?
The 66AK2H12DXAAWA24 includes twenty 64-bit configurable timers, as specified in Table 3-1 of the SPRS866G datasheet. This matches the 66AK2H14 and exceeds the fourteen 64-bit timers in the 66AK2H06 variant. These timers support precise time-stamping, PWM generation, and periodic interrupt generation critical for real-time media and networking applications.
Is the 66AK2H12DXAAWA24 pin-compatible with the 66AK2H14DXAAWA24?
The 66AK2H12DXAAWA24 shares the same 1517-pin AAW BGA package and pinout with the 66AK2H14DXAAWA24, but 14 XFI balls designated for 10-GbE in the 66AK2H14 are reserved (no-connect) in the 66AK2H12DXAAWA24. While PCB layout is identical, the 66AK2H12DXAAWA24 cannot support 10-GbE functionality without hardware redesign to route those reserved balls.
What security protocols does the integrated Security Accelerator in the 66AK2H12DXAAWA24 support?
The 66AK2H12DXAAWA24 Security Accelerator supports IPSec (ECB/CBC/CTR/GCM), SSL/TLS, 3GPP air interface (Kasumi, SNOW 3G), WiMAX, SRTP, and cryptographic primitives including AES, DES, 3DES, SHA-1/SHA-2 (256-bit), MD5, HMAC, CMAC, and GMAC. It delivers up to 2.4 Gbps IPSec throughput and 2.4 Gbps air ciphering, as documented in the SPRS866G feature list.
66AK2H12DXAAWA24 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 66AK2Hx KeyStone Multicore
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- DSP+ARM®
- Interface:
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Clock Rate:
- 1.2GHz DSP, 1.4GHz ARM®
- Non-Volatile Memory:
- ROM (384kB)
- On-Chip RAM:
- 12.75MB
- Voltage - I/O:
- 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
- Voltage - Core:
- Variable
- Operating Temperature:
- -40°C ~ 100°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1517-FCBGA (40x40)
66AK2H12DXAAWA24 FAQ
1.How can I place an order for 66AK2H12DXAAWA24 through Aetrix?
Please submit a Request for Quotation (RFQ) for 66AK2H12DXAAWA24 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 66AK2H12DXAAWA24 reliable?
The price and inventory of 66AK2H12DXAAWA24 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 66AK2H12DXAAWA24 is usually 5 days.
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5.How can I obtain technical support or documentation for 66AK2H12DXAAWA24?
For technical support, including 66AK2H12DXAAWA24 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 66AK2H12DXAAWA24 requirements.
6.How does Aetrix verify that 66AK2H12DXAAWA24 is sourced from the original manufacturer or authorized distributors?
All 66AK2H12DXAAWA24 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 66AK2H12DXAAWA24 meets industry standards.
7.What is the process for return or replacement of 66AK2H12DXAAWA24?
All 66AK2H12DXAAWA24 units undergo pre-shipment inspection (PSI). If there is an issue with 66AK2H12DXAAWA24, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 66AK2H12DXAAWA24 part is unused and in its original packaging.
Return procedure for 66AK2H12DXAAWA24:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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