Texas Instruments 66AK2H14DXAAWA24
- Part No.:
- 66AK2H14DXAAWA24
- Manufacturer:
- Texas Instruments
- Category:
- DSP (Digital Signal Processors)
- Package:
- 1517-BBGA, FCBGA
- Datasheet:
-
66AK2H14DXAAWA24.pdf
- Description:
- 66AK2H14DXAAWA24
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
66AK2H14DXAAWA24 from Texas Instruments is a KeyStone II–based multicore SoC integrating four ARM Cortex-A15 processors (up to 1.4 GHz), eight TMS320C66x DSP cores (up to 1.2 GHz), 6 MB MSMC SRAM, dual 72-bit DDR3/DDR3L interfaces (1600 MHz), and a dedicated 10-GbE switch subsystem with two XFI ports and IEEE 1588 support. It targets high-throughput media processing, cloud infrastructure, and secure packet forwarding.
For engineers reviewing the 66AK2H14DXAAWA24 datasheet, 66AK2H14DXAAWA24 pinout, 66AK2H14DXAAWA24 application, or 66AK2H14DXAAWA24 equivalent, key selection criteria include 10-GbE switching capability, hardware-accelerated security (IPsec up to 2.4 Gbps), multicore navigator queue management, and thermal operation at –40°C to 100°C extended case temperature.
Technical Context
The 66AK2H14DXAAWA24 implements a heterogeneous architecture where ARM A15 cores handle OS-level tasks and control plane functions while C66x DSPs execute real-time signal, video, and packet processing. Its Multicore Navigator provides 16k hardware queues and zero-overhead packet DMA, enabling deterministic data movement across 8 DSPs, 4 ARM cores, and peripherals including SRIO, PCIe, and Ethernet.
Hardware acceleration is distributed: the Network Coprocessor integrates Packet Accelerator (GTP-U, SCTP, PDCP) and Security Accelerator (AES, SHA-2, Kasumi, SNOW 3G), while the 10-GbE Switch Subsystem supports two XFI ports, full IEEE 1588 timestamping, and line-rate 10-GbE forwarding-features exclusive to the 66AK2H14 variant within the 66AK2Hxx family.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Architecture | Quad ARM Cortex-A15 + octal TMS320C66x DSP, fully coherent via ACE and MSMC |
| Max Core Frequency | ARM: 1.4 GHz; DSP: 1.2 GHz - enables 5.6 GHz ARM + 9.6 GHz DSP aggregate compute |
| Memory Subsystem | 6 MB shared MSMC SRAM with MPU; dual 72-bit DDR3/DDR3L @ 1600 MHz - supports >25 GB/s memory bandwidth |
| 10-GbE Interface | Two XFI ports with IEEE 1588 Annex D/E and SyncE - enables precise time-synchronized 10-GbE switching in telecom infrastructure |
| Security Acceleration | Hardware IPsec, SRTP, 3GPP air ciphering (Kasumi/SNOW 3G), AES-GCM, SHA-2 - delivers 2.4 Gbps encrypted throughput |
| Thermal Range | Extended case temperature: –40°C to 100°C - qualified for industrial and outdoor base station deployment |
| Process Technology | 28 nm CMOS - balances power efficiency (SmartReflex dynamic voltage scaling) and high-frequency operation |
Pinout & Package
66AK2H14DXAAWA24 uses a 1517-pin flip-chip plastic BGA (package code AAW), 40.0 mm × 40.0 mm, with 1.0 mm ball pitch. The package includes dedicated XFI lanes (pins XFIRXP0/XFIRXN0 through XFITXP1/XFITXN1), SGMII and PCIe differential pairs, DDR3 address/control/data banks, and multiple power domains (CVDD, DVDD15, DVDD18, VDDAHV, VDDALV).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| XFIRXP0 / XFIRXN0 | 10-GbE XFI Receive Differential Pair | Direct connection to 10-GbE PHY; requires AC-coupling and impedance-controlled routing (100 Ω differential) |
| XFITXP0 / XFITXN0 | 10-GbE XFI Transmit Differential Pair | Drives 10-GbE optical module; supports IEEE 802.3ae compliance and 1588 timestamp injection |
| DDR3AD00–DDR3AD31 | DDR3 Data Bus (72-bit) | Two independent 72-bit DDR3/DDR3L interfaces; each supports 1600 MT/s with on-die termination and write leveling |
| HYP0RXP0 / HYP0TXP0 | HyperLink Lane 0 Differential Pair | Enables chip-to-chip interconnect up to 50 GBaud; used for scalable multi-SoC systems in radar or compute clusters |
| SGMII0RXP / SGMII0TXP | Gigabit Ethernet SGMII Interface | Four integrated SGMII ports (plus two XFI) enable five-port 1-GbE switch + dual 10-GbE uplinks |
Key Features
| Feature | Design Value |
|---|---|
| 10-GbE Switch Subsystem | Dedicated hardware switch with two XFI ports and IEEE 1588 timestamping - eliminates external switch IC in media gateway designs |
| Multicore Navigator | 16k hardware queues + packet DMA - enables lock-free, zero-copy data movement between all 12 cores and peripherals |
| Security Accelerator Engine | Parallel execution of IPsec ESP/AH, RoHC, and air interface ciphers - offloads >95% of crypto processing from ARM/DSP cores |
| MSMC Memory Protection Unit | Configurable access rights per core and peripheral - enforces isolation between secure boot, RTOS, and Linux application partitions |
| SmartReflex Power Management | Dynamic voltage and frequency scaling per core cluster - reduces active power by up to 40% under variable workload conditions |
Applications
| Media Transcoding Gateway | Secure Wireless Baseband Unit |
|---|---|
|
Use Scenario: Real-time 4K video transcoding and adaptive bitrate streaming in CDN edge nodes. IC Role / Device Role / Timing Role: 66AK2H14DXAAWA24 acts as the unified media processor, with DSP cores executing HEVC/H.264 encode/decode and ARM cores managing HTTP/RTMP protocol stacks and QoS scheduling. Use Value: Integrated 10-GbE XFI ports enable direct fiber uplink to aggregation switches; MSMC SRAM reduces DDR latency for frame buffering. |
Use Scenario: LTE-Advanced and 5G NR baseband processing with Layer 2 encryption and timing synchronization. IC Role / Device Role / Timing Role: 66AK2H14DXAAWA24 serves as the L1/L2 baseband processor, using DSPs for FFT/iFFT, channel estimation, and turbo decoding, while ARM handles RRC and security protocols. Use Value: Hardware Security Accelerator performs 3GPP-compliant air ciphering (Kasumi/SNOW 3G) at 2.4 Gbps; IEEE 1588 ensures sub-100 ns time alignment across distributed radios. |
| Cloud Infrastructure Accelerator | High-Performance Analytics Node |
|
Use Scenario: Packet inspection and deep packet filtering in cloud load balancers and firewalls. IC Role / Device Role / Timing Role: 66AK2H14DXAAWA24 functions as a programmable network accelerator, with Packet Accelerator parsing GTP-U, SCTP, and PDCP headers and EDMA moving payloads to DSP-based pattern-matching engines. Use Value: 1-Gbps wire-speed throughput at 1.5 Mpackets/sec enables line-rate DPI without CPU intervention; dual DDR3 interfaces sustain >25 GB/s memory bandwidth for signature database lookups. |
Use Scenario: Real-time financial risk modeling and sensor fusion analytics in industrial IoT gateways. IC Role / Device Role / Timing Role: 66AK2H14DXAAWA24 operates as a heterogeneous compute node, assigning ARM cores to Python-based analytics frameworks and DSPs to fixed-point matrix math and FFT-based spectral analysis. Use Value: C66x DSPs deliver 38.4 GMACs/core at 1.2 GHz for low-latency numeric workloads; 20 × 64-bit timers support microsecond-precision event correlation across sensor inputs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multicore DSP+ARM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 66AK2H12DXAAWA24 | Omits 10-GbE XFI ports; retains 5-port 1-GbE switch, same ARM/DSP count and frequency, identical MSMC and DDR3 interfaces | Suitable for cost-sensitive 1-GbE infrastructure where 10-GbE uplink is not required | Select when 10-GbE switching is unnecessary and BOM cost reduction is prioritized over future bandwidth scalability |
| TI AM5728 | Dual ARM Cortex-A15 + dual C66x DSP; no 10-GbE; includes PowerVR GPU and display controllers; lower thermal envelope (–40°C to 90°C) | Targeted at embedded vision and HMI applications rather than telecom/media infrastructure | Choose for multimedia HMI with OpenGL ES graphics; avoid for packet-forwarding or high-throughput DSP workloads requiring 8 C66x cores |
Compared with 66AK2H12DXAAWA24 and AM5728, the 66AK2H14DXAAWA24 uniquely delivers dual 10-GbE XFI with IEEE 1588, making it the only option in this group capable of serving as a standalone 10-GbE media switch or baseband accelerator without external PHYs or switches.
Availability
66AK2H14DXAAWA24 is available at Aetrix Electronics and suitable for cloud infrastructure accelerators, wireless baseband units, media transcoding gateways, and high-performance analytics nodes requiring stable component supply across long product lifecycles.
Supply support for 66AK2H14DXAAWA24 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets.
The 66AK2Hxx family was designed specifically for high-throughput, low-latency infrastructure applications-including wireless base stations, media servers, and secure networking equipment-where integration of ARM control, DSP signal processing, and hardware-accelerated packet and security functions is critical.
FAQ
What distinguishes 66AK2H14DXAAWA24 from other 66AK2Hxx variants like 66AK2H12 or 66AK2H06?
The 66AK2H14DXAAWA24 is the only variant in the 66AK2Hxx family with integrated 10-GbE XFI ports (two lanes), enabling direct optical interface without external PHYs. It also features twenty 64-bit timers-more than the 66AK2H12 (also twenty) and 66AK2H06 (fourteen)-and shares identical ARM/DSP core counts and frequencies with the 66AK2H12 but exceeds the 66AK2H06's dual ARM/four DSP configuration.
Does 66AK2H14DXAAWA24 support IEEE 1588 Precision Time Protocol, and how is it implemented?
Yes, 66AK2H14DXAAWA24 supports IEEE 1588 Annex D/E and SyncE via its dedicated 10-GbE Switch Subsystem. Timestamping is performed in hardware at the XFI MAC layer, with nanosecond-resolution counters and hardware-assisted correction for asymmetry and delay. This enables sub-100 ns time synchronization accuracy in wireless fronthaul and media transport applications.
What power supply rails does 66AK2H14DXAAWA24 require, and how are they distributed across the AAW package?
66AK2H14DXAAWA24 requires seven primary supply domains: CVDD (core logic), DVDD15 (DDR3 I/O), DVDD18 (SGMII/PCIe I/O), VDDAHV (analog high-voltage), VDDALV (analog low-voltage), AVDDA1–AVDDA15 (ADC/DAC analog), and USB-specific rails (VDDUSB, VP, VPTX). These are distributed across dedicated balls in the AAW package, with multiple ground (VSS) balls interleaved for EMI suppression and power integrity.
Can 66AK2H14DXAAWA24 boot from NAND flash, and what boot modes are supported?
Yes, 66AK2H14DXAAWA24 supports boot from NAND flash via its EMIF16 interface, in addition to SPI, I2C, PCIe, SRIO, and USB. Boot mode is selected using strap pins (BOOTCOMPLETE, RESETSTAT, etc.) during power-up, and the internal ROM bootloader validates images using SHA-256 before loading to MSMC or DDR. Secure boot with cryptographic signature verification is enabled via the Security Accelerator.
Is there hardware support for virtualization in 66AK2H14DXAAWA24, and how is it utilized?
Yes, 66AK2H14DXAAWA24 supports ARM virtualization extensions (ARMv7-A Virtualization Extensions) and includes a Memory Protection Unit (MPU) for both MSMC SRAM and DDR3_EMIF. This allows hypervisor-based partitioning of ARM cores across Linux, RTOS, and bare-metal workloads, with hardware-enforced isolation-critical for mixed-criticality applications such as secure baseband + non-secure application processing on the same SoC.
66AK2H14DXAAWA24 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 66AK2Hx KeyStone Multicore
- Package/Case:
- 1517-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- DSP+ARM®
- Interface:
- EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0
- Clock Rate:
- 1.2GHz DSP, 1.4GHz ARM®
- Non-Volatile Memory:
- ROM (384kB)
- On-Chip RAM:
- 12.75MB
- Voltage - I/O:
- 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
- Voltage - Core:
- Variable
- Operating Temperature:
- -40°C ~ 100°C (TC)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1517-FCBGA (40x40)
66AK2H14DXAAWA24 FAQ
1.How can I place an order for 66AK2H14DXAAWA24 through Aetrix?
Please submit a Request for Quotation (RFQ) for 66AK2H14DXAAWA24 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 66AK2H14DXAAWA24 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 66AK2H14DXAAWA24 is usually 5 days.
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Once your 66AK2H14DXAAWA24 order is processed, you will receive an email with the shipment details and tracking number.
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5.How can I obtain technical support or documentation for 66AK2H14DXAAWA24?
For technical support, including 66AK2H14DXAAWA24 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 66AK2H14DXAAWA24 requirements.
6.How does Aetrix verify that 66AK2H14DXAAWA24 is sourced from the original manufacturer or authorized distributors?
All 66AK2H14DXAAWA24 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 66AK2H14DXAAWA24 meets industry standards.
7.What is the process for return or replacement of 66AK2H14DXAAWA24?
All 66AK2H14DXAAWA24 units undergo pre-shipment inspection (PSI). If there is an issue with 66AK2H14DXAAWA24, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 66AK2H14DXAAWA24 part is unused and in its original packaging.
Return procedure for 66AK2H14DXAAWA24:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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