Texas Instruments 66AK2L06XCMSA2

Overview

66AK2L06XCMSA2 from Texas Instruments is a KeyStone II multicore SoC integrating two ARM® Cortex®-A15 processors (up to 1.2 GHz) and four TMS320C66x DSP cores (up to 1.2 GHz), with 2 MB shared MSMC SRAM, 72-bit DDR3 interface (1600 MHz), and integrated JESD204B digital front-end for high-speed ADC/DAC interfacing - deployed in radar signal processing and software-defined radio baseband systems.

For engineers reviewing the 66AK2L06XCMSA2 datasheet, 66AK2L06XCMSA2 pinout, 66AK2L06XCMSA2 application, or 66AK2L06XCMSA2 equivalent, key selection considerations include dual-core ARM control + quad-DSP compute partitioning, hardware-accelerated packet/FFT/security offload, and thermal compliance across -40°C to +100°C extended temperature operation.

Technical Context

The 66AK2L06XCMSA2 implements TI's KeyStone II architecture with a non-blocking 2-Tbps TeraNet interconnect, Multicore Navigator managing 8K hardware queues, and MSMC V2 enabling 4× higher internal memory bandwidth versus KeyStone I. Its ARM CorePac supports full ARMv7-A with LPAE, virtualization, and ACE coherency, while each C66x CorePac delivers 38.4 GMACS/core and 19.2 GFLOPS/core at 1.2 GHz.

Dedicated subsystems include a 4-port SGMII Ethernet switch, dual PCIe Gen2 interfaces, USB 3.0, USIM, and a Digital Front End supporting up to four JESD204B lanes (7.37 Gbps line rate). The Security Accelerator enables IPSec, SSL/TLS, AES, SHA-2, and HMAC with up to 6.4 Gbps IPSec throughput.

Key Specifications

Pinout & Package

66AK2L06XCMSA2 uses a 900-pin flip-chip plastic BGA (CMS package), 25 mm × 25 mm, 0.8 mm ball pitch, RoHS-compliant. Pin functions are defined per TI SPRS930 Rev. A (April 2015), Section 6 "Terminals".

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar multicore DSP+ARM SoC applications.

Compared with 66AK2H12XCMSA2, the 66AK2L06XCMSA2 trades raw compute density for lower power and smaller footprint - ideal for SWaP-constrained platforms. Versus AM5728BCBD2, it delivers 4× DSP throughput and native JESD204B, making it uniquely suited for RF-intensive applications where converter integration is mandatory.

Availability

66AK2L06XCMSA2 is available at Aetrix Electronics and suitable for radar signal processing, software-defined radio, avionics mission computing, and test & measurement instrumentation requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 66AK2L06XCMSA2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, designing and manufacturing analog, embedded processing, and wireless chips for industrial, automotive, and communications markets.

The 66AK2L06XCMSA2 belongs to TI's KeyStone II multicore SoC product line, engineered specifically for high-performance signal intelligence, radar, and communications infrastructure where tight integration of ARM control, DSP compute, and RF data converter interfaces is essential.

FAQ

What is the maximum operating frequency of the ARM and DSP cores in the 66AK2L06XCMSA2?

The 66AK2L06XCMSA2 features two ARM Cortex-A15 processors and four C66x DSP cores, all rated for operation up to 1.2 GHz. This frequency is validated under extended temperature conditions (-40°C to +100°C case temperature) and supported by TI's SmartReflex power management system. The 66AK2L06XCMSA2 achieves this performance with a 0.85 V core supply at 1.2 GHz, as specified in the SPRS930 datasheet Section 3.1.

Does the 66AK2L06XCMSA2 support JESD204B subclass 1 for deterministic latency applications?

Yes, the 66AK2L06XCMSA2 supports JESD204B subclass 1 through its integrated Digital Front End (DFE) subsystem, which includes dedicated serializer/deserializer logic and SYSREF synchronization circuitry. This enables precise multi-device alignment for phased-array radar and synchronized multi-channel SDR systems. The 66AK2L06XCMSA2 documentation confirms subclass 1 compliance in Section 1.4 and Figure 1-1 of SPRS930.

How much on-chip SRAM is available for shared use across all processing elements in the 66AK2L06XCMSA2?

The 66AK2L06XCMSA2 provides 2 MB of Multicore Shared Memory Controller (MSMC) SRAM accessible by all four C66x DSP cores and both ARM Cortex-A15 processors, plus an additional 1 MB On-Chip Standalone RAM (OSR) for dedicated low-latency buffering. This shared memory architecture eliminates DDR3 contention and is explicitly documented in Table 3-1 and Section 1.1 of the SPRS930 datasheet.

Is the Security Accelerator enabled in the 66AK2L06XCMSA2 variant, and what cryptographic protocols does it support?

The 66AK2L06XCMSA2 includes the Security Accelerator hardware block, and its functionality is enabled per TI's export-controlled shipment policy. It supports IPSec, SSL/TLS, AES-128/256, DES/3DES, SHA-1/SHA-2 (256-bit), HMAC, CMAC, GCM, and RSA acceleration - delivering up to 6.4 Gbps IPSec throughput. Details are confirmed in Section 1.1 and Table 3-1 footnote (2) of SPRS930.

What is the package type and thermal specification for the 66AK2L06XCMSA2?

The 66AK2L06XCMSA2 uses a 900-pin flip-chip plastic BGA (CMS package), 25 mm × 25 mm, with 0.8 mm ball pitch. It is rated for extended temperature operation from -40°C to +100°C case temperature, validated per TI's Production Data (PD) status in Table 3-1 of SPRS930. Thermal resistance (θJA) is 13.5°C/W, and heatsink mounting guidelines are provided in Section 12.1 of the datasheet.