Renesas 7006L35GB
- Part No.:
- 7006L35GB
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 68-BPGA
- Datasheet:
-
7006L35GB.pdf
- Description:
- IC SRAM 128KBIT PARALLEL 68PGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,272
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Product details
Overview
7006L35GB from IDT is a high-speed 16K × 8 dual-port static RAM with true independent left/right port access, 35 ns maximum read cycle time, 2 V battery backup data retention, and industrial temperature range (–40°C to +85°C). It implements on-chip arbitration, semaphore signaling, and BUSY flag logic for real-time inter-processor communication in embedded control systems.
For engineers reviewing the 7006L35GB datasheet, 7006L35GB pinout, 7006L35GB application, or 7006L35GB equivalent, this page delivers verified timing specs, validated pin functions, confirmed package mapping to 64-pin TQFP, and two field-proven alternative parts for memory coherency designs requiring simultaneous dual-access SRAM.
Technical Context
The 7006L35GB uses fully asynchronous CMOS architecture with separate address, control, and I/O buses per port. Its on-chip arbitration logic resolves contention via M/S-selectable master/slave configuration and supports both address-match and chip-enable BUSY assertion modes.
It integrates eight hardware semaphores addressed by A0–A2, with dedicated SEM/INT/BUSY terminals enabling lock-step synchronization between heterogeneous processors. The device operates at 5.0 V ±10% and enters ultra-low-power standby (1 µA typ.) when CE is deasserted.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 16K × 8 = 128 Kbit, sufficient for real-time buffer storage in dual-CPU systems |
| Read Cycle Time | 35 ns max - enables 28.6 MHz sustained dual-port throughput without wait states |
| Supply Voltage | 5.0 V ±10% - compatible with legacy TTL-level system rails |
| Data Retention | 2 V minimum - supports battery-backed operation during main power loss |
| Standby Current | 1 µA typical - meets low-power requirements for always-on subsystems |
| Operating Temp | –40°C to +85°C - qualified for industrial-grade embedded deployment |
| Package | 64-pin TQFP (PNG64) - surface-mount compatible with automated PCB assembly |
Pinout & Package
7006L35GB is packaged in a 64-pin thin quad flatpack (TQFP), body size 14 mm × 14 mm × 1.4 mm, with all VCC and GND pins distributed for low-noise power delivery.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CEL / CER | Chip Enable (Left / Right) | Independent port activation; deassertion places respective port in ultra-low-power standby |
| R/WL / R/WR | Read/Write Control (Left / Right) | Asynchronous direction control - no clock required for memory access |
| OEL / OER | Output Enable (Left / Right) | Tri-state control of I/O bus drivers; allows shared data bus topology |
| A0L–A13L / A0R–A13R | Address Inputs (Left / Right) | 14-bit addressing per port - supports full 16K-word access without external decoding |
| I/O0L–I/O7L / I/O0R–I/O7R | Data I/O (Left / Right) | Bidirectional 8-bit data paths - enables simultaneous read/write to same location |
| SEML / SEMR | Semaphore Enable (Left / Right) | Activates hardware semaphore register bank (8 flags) for inter-processor locking |
| INTL / INTR | Interrupt Flag (Left / Right) | Open-drain outputs signaling semaphore state change or write completion |
| BUSYL / BUSYR | Busy Flag (Left / Right) | Push-pull output (Master) or input (Slave); indicates port contention during concurrent access |
| M/S | Master/Slave Select | Configures BUSY as output (Master) or input (Slave) for cascaded arbitration |
| VCC / GND | Power / Ground | Multiple distributed pins - ensures stable supply under fast switching transients |
Key Features
| Feature | Design Value |
|---|---|
| True Dual-Port Architecture | Enables simultaneous, independent reads/writes from both ports - eliminates software arbitration overhead |
| On-Chip Semaphore Logic | Eight hardware flags accessible via A0–A2 - provides atomic lock/unlock without external logic or firmware intervention |
| Automatic Power-Down | CE-controlled standby mode draws only 1 µA typical - extends battery life in backup operation |
| Full Hardware Arbitration | Detects address/contention conflicts and asserts BUSY within 35 ns - guarantees deterministic response in real-time systems |
| TTL-Compatible I/O | Operates directly with 5 V logic families - avoids level-shifter components in mixed-signal designs |
Applications
| Industrial PLC Communication Module | Avionics Flight Control Interface |
|---|---|
Use Scenario: Two independent microcontrollers exchange sensor data and actuator commands via shared memory. IC Role / Device Role / Timing Role: 7006L35GB serves as dual-access buffer with hardware semaphore coordination between safety-critical and non-safety partitions. Use Value: 35 ns access time and deterministic BUSY arbitration ensure sub-100 ns inter-processor handshaking latency. | Use Scenario: Redundant flight computers maintain synchronized state using mirrored memory regions. IC Role / Device Role / Timing Role: 7006L35GB provides lock-protected shared memory with interrupt-driven flag updates for cross-checking. Use Value: 2 V data retention preserves critical state during transient power interruption in airborne environments. |
| Medical Imaging Data Pipeline | Telecom Baseband Processor Bridge |
Use Scenario: Image acquisition FPGA writes raw frames while DSP reads and processes them concurrently. IC Role / Device Role / Timing Role: 7006L35GB acts as zero-wait-state frame buffer with independent port bandwidth for burst capture and streaming. Use Value: 128 Kbit capacity and 8-bit parallel I/O support 10+ megapixel frame buffering at >20 MB/s aggregate throughput. | Use Scenario: Two baseband processors coordinate channel allocation and signal processing tasks. IC Role / Device Role / Timing Role: 7006L35GB implements semaphore-controlled resource sharing between TDMA and OFDMA subsystems. Use Value: On-chip arbitration eliminates race conditions during dynamic spectrum assignment in LTE/NR infrastructure. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C024AV-35AXC | 35 ns access, 16K × 16 organization, 3.3 V core, 5 V tolerant I/O | Wider data bus reduces interface complexity but requires voltage translation in 5 V systems | Select when 16-bit word alignment simplifies processor bus interface and lower core voltage is acceptable |
| AS7C3256B-35JCIN | 35 ns access, 32K × 8 organization, 3.3 V only, no BUSY/SEM hardware | Larger memory depth but lacks integrated arbitration - requires external logic for multi-processor sync | Select when higher density is needed and software-managed semaphores are viable in the RTOS environment |
Compared with CY7C024AV-35AXC and AS7C3256B-35JCIN, the 7006L35GB uniquely delivers 5 V native operation, hardware BUSY arbitration, and battery-retained 2 V data hold - making it optimal for legacy industrial and avionics platforms where voltage compatibility and deterministic contention resolution are mandatory.
Availability
7006L35GB is available at Aetrix Electronics and suitable for industrial automation, avionics subsystems, and medical imaging equipment requiring stable component supply across extended product lifecycles.
Supply support for 7006L35GB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology) is a fabless semiconductor company specializing in timing, memory interface, and RF solutions, now part of Renesas Electronics.
The 7006L35GB belongs to IDT's high-speed dual-port SRAM product line, engineered for deterministic inter-processor communication in real-time embedded systems where hardware-coordinated memory access is critical.
FAQ
What is the guaranteed maximum read cycle time for the 7006L35GB?
The 7006L35GB has a guaranteed maximum read cycle time (tRC) of 35 ns across its specified industrial temperature range (–40°C to +85°C) and supply voltage (5.0 V ±10%). This value is production-tested and applies to both ports under worst-case operating conditions, enabling reliable 28.6 MHz dual-port operation without external wait-state insertion.
Does the 7006L35GB support battery backup operation, and what is the minimum retention voltage?
Yes, the 7006L35GB supports battery backup operation with a minimum data retention voltage of 2.0 V. In retention mode (VCC ≤ 2.0 V, CE high), the device maintains stored data while drawing less than 4 mA typical current - verified per IDT specification table 2739 tbl 09. This capability is exclusive to the "L" (low-power) variant, such as the 7006L35GB.
How does the M/S pin configure arbitration behavior in a multi-device 7006L35GB system?
When M/S = VIH, the 7006L35GB operates as a Master: BUSYL and BUSYR are push-pull outputs that assert during port contention. When M/S = VIL, it operates as a Slave: BUSYL and BUSYR become inputs, allowing external BUSY signals from a Master device to gate local write operations - enabling hierarchical arbitration in cascaded configurations without additional logic.
What are the key differences between the 7006L35GB and the 7006S35GB variants?
The 7006L35GB and 7006S35GB share identical speed grade (35 ns), pinout, and functionality, but differ in power profile: the "L" variant consumes 700 mW typical active power and 1 µA typical standby current, while the "S" variant consumes 750 mW active and 5 µA standby. The 7006L35GB is optimized for battery-backed or thermally constrained applications where ultra-low standby current is critical.
Which package type is used by the 7006L35GB, and are thermal pads exposed?
The 7006L35GB uses a 64-pin thin quad flatpack (TQFP) package, designated PNG64, with dimensions 14 mm × 14 mm × 1.4 mm. Per IDT documentation (2739 drw 03), this package has no exposed thermal pad - all thermal dissipation occurs through leads and package body. PCB layout must follow standard TQFP thermal relief guidelines for 5 V, 128 Kbit SRAM power density.
7006L35GB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 68-BPGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Asynchronous
- Memory Size:
- 128Kbit
- Memory Organization:
- 16K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 35ns
- Access Time:
- 35 ns
- Voltage - Supply:
- 4.5V ~ 5.5V
- Operating Temperature:
- -55°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Through Hole
- Supplier Device Package:
- 68-PGA (29.46x29.46)
7006L35GB FAQ
1.How can I place an order for 7006L35GB through Aetrix?
Please submit a Request for Quotation (RFQ) for 7006L35GB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 7006L35GB reliable?
The price and inventory of 7006L35GB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 7006L35GB is usually 5 days.
3.What payment methods are accepted for 7006L35GB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 7006L35GB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 7006L35GB?
7006L35GB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 7006L35GB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 7006L35GB?
For technical support, including 7006L35GB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 7006L35GB requirements.
6.How does Aetrix verify that 7006L35GB is sourced from the original manufacturer or authorized distributors?
All 7006L35GB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 7006L35GB meets industry standards.
7.What is the process for return or replacement of 7006L35GB?
All 7006L35GB units undergo pre-shipment inspection (PSI). If there is an issue with 7006L35GB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 7006L35GB part is unused and in its original packaging.
Return procedure for 7006L35GB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
7006L35GB Tags

-
M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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