Renesas 70T3319S133BC

Overview

70T3319S133BC from Integrated Device Technology is a high-speed 2.5V synchronous dual-port static RAM with 128K × 18-bit organization (2,304Kb), 133MHz operation, 4.2ns access time, and industrial temperature support (–40°C to +85°C). It enables simultaneous read/write access on independent left/right ports in telecom switching fabric, network packet buffering, and real-time DSP co-processing systems.

For engineers reviewing the 70T3319S133BC datasheet, 70T3319S133BC pinout, 70T3319S133BC application, or 70T3319S133BC equivalent, key selection criteria include pipelined/flow-through output mode selection, dual-voltage I/O (2.5V/3.3V per port), JTAG IEEE 1149.1 compliance, collision detection flag timing, and BGA package thermal/mechanical constraints for high-density PCB layout.

Technical Context

The 70T3319S133BC implements true dual-port SRAM cells with fully synchronous clocking on both ports, supporting 5ns cycle time in pipelined mode and 25ns in flow-through mode. It features separate byte enables (UBL/LBL, UBR/LBR), address strobe (ADSL/ADSR), counter enable (CNTENL/CNTENR), and repeat logic for burst address generation without external sequencing.

Each port supports independent VDDQ selection (2.5V or 3.3V) via OPTL/OPTR pins, with core VDD fixed at 2.5V ±100mV. Sleep mode (ZZL/ZZR) reduces current to 5–15mA while preserving JTAG accessibility, and collision/interrupt flags (COLL/INTR, COLR/INTR) provide hardware-level arbitration between concurrent port accesses.

Key Specifications

Pinout & Package

70T3319S133BC uses a 256-pin Ball Grid Array (BC256) package with 17mm × 17mm footprint and 1.0mm ball pitch. Power delivery requires dedicated VDD (core), VDDQL/VDDQR (port-specific I/O), and VSS (ground) balls distributed across the array. NC pins include A18L, A18R, and multiple reserved positions per pin diagram.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-port SRAM applications.

Compared with CY7C1362BV33-133BZI and AS7C3128A-133BIN, the 70T3319S133BC uniquely supports mixed-voltage I/O per port, hardware collision detection, and IEEE 1149.1 JTAG-critical for fault-tolerant industrial and medical systems requiring runtime diagnostics and voltage domain isolation.

Availability

70T3319S133BC is available at Aetrix Electronics and suitable for telecom switching fabric, real-time DSP co-processing, and industrial PLC motion control requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 70T3319S133BC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, designs high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 70T33xx family targets high-bandwidth, low-latency memory subsystems in systems requiring concurrent dual-port access-especially where deterministic timing, voltage flexibility, and hardware arbitration are mandatory.

FAQ

What is the maximum operating frequency of the 70T3319S133BC under industrial temperature conditions?

The 70T3319S133BC is rated for 133MHz operation across the full industrial temperature range of –40°C to +85°C. This is confirmed in the AC Electrical Characteristics table (page 11), where S133 speed grade parameters are explicitly specified for both commercial and industrial grades. The device does not support 166MHz or 200MHz operation in industrial conditions.

Does the 70T3319S133BC support independent voltage selection for each port's I/O interface?

Yes, the 70T3319S133BC supports independent I/O voltage selection per port via OPTL and OPTR pins. Setting OPTL to VDD (2.5V) configures the left port for 3.3V I/O levels with VDDQL = 3.3V; setting it to VSS (0V) configures 2.5V I/O with VDDQL = 2.5V. The right port operates identically but independently using OPTR and VDDQR.

How does the collision detection feature work in the 70T3319S133BC?

The 70T3319S133BC asserts COLL (left port) or COLR (right port) within 4.2ns when both ports attempt simultaneous access to the same memory address. This hardware flag eliminates software polling overhead and enables immediate arbitration-critical for real-time systems. Collision reset occurs automatically after successful access on either port, as defined in the Truth Table II and timing waveforms.

What package type and dimensions does the 70T3319S133BC use?

The 70T3319S133BC uses a 256-pin Ball Grid Array (BC256) package with a 17mm × 17mm body size and 1.0mm ball pitch. Pin configuration details-including NC assignments for A18L/A18R and power/ground ball distribution-are provided in the "Pin Configuration" section (page 3) of the datasheet. Thermal pad exposure and solder mask clearance follow standard IDT BGA guidelines.

Can the 70T3319S133BC operate in sleep mode while maintaining JTAG accessibility?

Yes, the 70T3319S133BC supports sleep mode (activated by asserting ZZL and ZZR) while retaining full JTAG functionality. Per datasheet note on page 2, "all static inputs… i.e., PL/FTx and OPTx and the sleep mode pins themselves (ZZx) are not affected during sleep mode," and boundary scan remains operational. Sleep mode reduces current to 5–15mA without disabling TCK, TMS, TDI, TDO, or TRST pins.